Sound visualization is made possible by FLIR Si124, an industrial acoustic imaging camera that creates accurate acoustic images in real time on digital camera images. The device utilizes sound imaging from its 124 built-in microphones to help professionals identify leaks and partial discharges 10 times faster than traditional methods
TDK Corporation has extended its MiniCell range to incorporate pressure transmitters in robust stainless-steel casing that measure differential pressure in industrial applications. , where microicell uses a high alloy AISI 316L steel film on the pressure port to provide dielectric resistance, ideal for industrial applications.
The new low-power relay G5RL-K-EL, supplied by Omron Europe -- ideal for controlling fluorescent and LED lamps -- offers an innovative single-contact structure that makes it an extremely competitive solution
KIOXIA Europe LTD offers what it claims is the industry's first enterprise and data center standard Form Factor (EDSFF) E3. SSDS designed with PCIe 5.0 technology. Freed from the design constraints of the 2.5-inch form factor, the series is optimized for the needs of high-performance, efficient servers and storage
Qorvo QPQ1040QEVB Evaluation Board, available now from Mouser, is a demonstration and development platform for the QPQ1040Q Automotive Band-40 BAW Filter.
Renesas Electronics Corporation has expanded its 5G beamforming IC family with the introduction of two new dual-polarized millimeter Wave (mmWave) devices. The new integrated circuit provides a unique dynamic array power (DAP) technology that allows efficient operation at programmable linear output power levels from 10dBm to 16dBm
Vector provides VN5611 and N5612 hardware, which are compact and convenient interfaces. These devices are ideal for portable use because of their compact and compact formats. Flexible configuration options are also provided to support a wide variety of application domains.
TDK offers the new L860 NTC thermior chip, which can be embedded directly into the power module and used for sintering and AI heavy wire bonding. Lead-free chips are suitable for a wide temperature range from -55C to +175C, with a size of 1.6mm x 1.6mm x 0.5mm. It is an ideal device for integration into IGBT and IPM modules
Irose has designed a new hybrid FPC/ FFC that can significantly save space compared to competing products with the same allowable current. Its height is only 1.2mm and the installation depth is 4mm. Compact family connectors are commonly used for portable and consumer electronics applications
onsemi has released its new 600V SUPERFET V family of MOSFETs. The high-performance devices allow power supplies to satisfy pressing efficiency regulations such as 80 PLUS Titanium, particularly at the highly challenging 10% load condition. As part of the family, three product groups – FAST, Easy Drive and FRFET – are optimised to deliver class-leading performance in various applications and topologies.
Power Integrations has released the highly integrated Innoswitch 3-TN off-line CV/CC flyback IC. Safety certified compact MINSOP-16A package and other advantages. Suitable for electrical and industrial auxiliary applications up to 21W.
The RS module now provides a new type of ultrasound imaging camera from forward looking infrared. There are three models available: SI124-LD, SI124-PD and Si124. Ultrasound imaging is a fairly new technology that provides valuable assistance to industrial enterprises and maximizes uptime, efficiency and safety
Analog Devices has released the RadioVerse SoC family, which provides advanced RF signal processing and extends digital capabilities and RF capacity. Provides RU developers with a flexible and cost-effective platform to produce the most energy efficient 5G RUs in the industry.
Microchip Technology provides the next generation of full online emulators, debugging and programming development tools for its PIC and AVR MCUS, dsPIC, DSCs and SAM MCUS and MPU.
LAPIS Technologies, a ROHM Group of companies, has developed a chipset that provides up to 1W of wireless power for compact, streamlined wearables and industrial intelligent, miniaturized and sealed solutions. The ML7661(transmitter) and ML7660(receiver) eliminate the need for external MCU by including a transmission/receive control circuit, achieving the smallest level 1W system size in the industry and becoming ideal for wearables with large battery capacities
Elesa supplies a wide selection of durable and reliable industrial magnets, now includes new sizes in round and rectangular flat designs as well as application-specific cable fixing magnets.
Hirose has extended its family of miniature wire-to-board connectors by incorporating single-row right-angle versions. Compared to similar products, the compact GT50 series wire-to-board connectors are only 1mm in pitch, saving PCB space and reducing weight by up to 75%, making them ideal for both traditional and emerging automotive applications
U-blox offers two additions to its cellular LTE CAT1 family of products. U-blox Lara-R6 and U-Blox LenA-R8, these modules include five certified global, multi-regional and regional product variants that simplify logistics and improve design flexibility for developers. Both modules offer a SKU for global roaming, which greatly simplifies logistics and supply chain management
