Tendances de l'industrie

AMD and Google have publicly disclosed a critical microcode vulnerability in the AMD Zen 1 to Zen 4 family of CPUs, discovered in September 2024, that primarily affects EPYC CPUs on server/enterprise platforms. The vulnerability, numbered CVE-2024-56161, is discussed in more detail in a GitHub post from Google's Security Research Team and in a security bulletin issued by AMD in response to the vulnerability. The vulnerability is discussed in more detail in a GitHub post by Google's security research team and in a security advisory issued by AMD in response to the vulnerability

Infineon Technologies AG has made significant progress in the development of capacitive micromechanical ultrasonic transducer (CMUT) technology. With this technology, the company has introduced the first highly integrated single-chip solution for microelectromechanical systems (MEMS)-based ultrasonic sensors with a smaller footprint and more robust performance and functionality for a wide range of applications in the development of new ultrasonic applications as well as for the improvement of existing applications in the fields of consumer electronics.

Vishay Intertechnology, Inc. has announced the launch of the RAIK060, a new inductive-based, high-precision position sensor for demanding industrial and other applications. Compared to magnetic-based solutions, the Vishay MCB RAIK060 absolute encoder kit is thinner at 5 mm and lighter at 15.5 g. In addition, the device is insensitive to magnetic environments, so it can be used in close proximity to motors with shorter latency times of ≤ 5 μs. In addition, the device is insensitive to magnetic environments, so it can be used in close proximity to motors.

CONCERT - a leading provider of embedded and edge computing technology - extends its line of high-performance COM-HPC computer modules with the conga-HPC/cBLS module for edge and infrastructure applications that require powerful computing performance.

Diodes Incorporated (Diodes) announced the expansion of its automotive-compliant* product portfolio with the AL8866Q LED driver. This DC switching LED driver controller drives external MOSFETs and supports buck, boost, buck-boost, and single-ended primary inductor converter (SEPIC) topologies for high-power LED lighting systems. Applications include daytime running lights (DRLs), high and low beams, fog lights, turn signals, brake/parking lights, and more.

PCIe® switches are essential solutions for efficiently managing high-bandwidth data transfers and seamless communication between multiple devices or subsystems in automotive, industrial and data center applications. They provide scalability, reliability and low-latency connectivity essential for handling the demanding workloads of modern high-performance computing (HPC) systems. Microchip Technology Inc. (Microchip Technology) today announced the sampling of the new PCI100x family of Switchtec™ PCIe 4.0 switches, with multiple models to support packet switching and multi-host applications.

Intel is gradually phasing out its 12th-generation Alder Lake series mobile CPUs, covering the standard Core i3, i5, i7, and i9 series, as well as some Pentium and Celeron models with the same architecture, but excluding the HX series.

Diodes Incorporated announces the expansion of its automotive qualified* product portfolio with the launch of the AL8891Q LED driver. This easy-to-use synchronous buck LED driver features high-side current sensing, drives up to 2A over a wide 4.5V to 65V input voltage range, and supports up to 95% duty cycle to drive long LED chains. The device provides a flexible and efficient solution for automotive lighting applications including daytime running lights (DRL), fog lights, turn signals, brake/parking lights, and interior lighting.

STMicroelectronics has added eight new members to its STSPIN32 family of integrated motor drivers to meet the low-cost, high-performance requirements of applications such as power tools, home appliances, and industrial automation.

CES 2025 - Morse Microelectronics, the world's leading supplier of Wi-Fi HaLow chips based on the IEEE 802.11ah standard, announced the launch of the much-anticipated second-generation MM8108 system-on-chip (SoC). Following the great success of the first-generation MM6108 SoC, the MM8108 has achieved comprehensive breakthroughs in core indicators such as coverage, data throughput and power efficiency, while significantly reducing the cost, workload, and cycle of bringing next-generation Wi-Fi HaLow products to market.