Tendances de l'industrie

Custom connector designs often start as niche products with limited applications but can evolve into popular proprietary connectors over time. Initially designed and manufactured by a single source, proprietary connectors can become lucrative if widely adopted.

A team led by the University at Buffalo has developed the highest-performing high-temperature superconducting (HTS) wire segment to date, opening new possibilities for harnessing magnetic forces and potentially transforming energy infrastructure and even enabling commercial nuclear fusion. The breakthrough is detailed in the latest issue of Nature Communications.

Common Mode Semiconductor is proud to announce the release of the GM12071, a 20V/500mA low-power, low-noise LDO (Low Dropout) voltage regulator designed to replace ADI’s ADP7104 and ADP7102. The GM12071, a CMOS-based LDO, operates from 1.9V to 20V and delivers a maximum output current of 500mA.

Naxin Microelectronics, a leading provider of high-performance analog and mixed-signal ICs, has announced a strategic partnership with DigiKey, a global leader in electronic component distribution. This collaboration establishes a global distribution partnership, enhancing the availability of Naxin Microelectronics' products to customers worldwide.

Vishay Intertechnology, Inc. is pleased to announce the launch of its new CHA Series of film resistors on August 2, 2024, which have been certified to AEC-Q200 standards. These high-performance resistors are designed to deliver exceptional high-frequency performance up to 70 GHz for applications in automotive, aerospace, avionics, and telecommunications.

The Okinawa Institute of Science and Technology (OIST) has announced a revolutionary Extreme Ultraviolet (EUV) lithography technology that transcends the standard limits of semiconductor manufacturing. This cutting-edge design allows for the use of significantly smaller EUV light sources, with power consumption reduced to less than one-tenth of traditional EUV lithography machines. This advancement not only lowers costs but also greatly enhances the reliability and lifespan of the equipment.

As automotive technology continues to advance, the role of automotive relays in vehicle electrical systems has become increasingly crucial. Automotive relays are electromagnetic switches that control various electrical devices in vehicles by switching circuits on and off. Serving as "switches" within electrical systems, relays can handle high currents and voltages, enabling automatic and remote control functions. Therefore, selecting the appropriate automotive relay is essential for the proper functioning of a vehicle.

According to a report by Taiwanese media outlet DIGITIMES, TSMC is set to introduce High NA EUV lithography technology in its A14P process, with a potential launch as early as 2028. Currently, TSMC's most advanced process is the A16, which supports backside power delivery network (BSPDN) and is scheduled for mass production in the second half of 2026. The A16 will still use the traditional Low NA (0.33NA) EUV lithography machines.

The Quantum Nano Science Center (QNS) at the Institute for Basic Science (IBS) in South Korea, in collaboration with the Forschungszentrum Jülich in Germany, has developed the world’s first atomic-scale quantum sensor capable of detecting minute magnetic fields at the atomic level. The groundbreaking research was published on the 25th in Nature Nanotechnology. This achievement marks a significant milestone in quantum technology and is expected to have profound implications across multiple scientific fields.

On the 25th, the Institute of Chemistry at the Chinese Academy of Sciences announced a significant advancement in the field of high-performance polymer thermoelectric materials. Researchers from the Institute and collaborating institutions have developed a novel high-performance polymer thermoelectric material—PMHJ film. Compared to conventional polymer films, the PMHJ film is expected to greatly enhance the thermoelectric performance of the material, providing a new approach for high-performance plastic-based thermoelectric materials.