CONCERT - a leading provider of embedded and edge computing technology - extends its line of high-performance COM-HPC computer modules with the conga-HPC/cBLS module for edge and infrastructure applications that require powerful computing performance. The new COM-HPC Client Size C (120x160 mm) module is based on the performance-hybrid architecture of the Intel Core S-Series processors (codenamed Bartlett Lake S) and supports up to 16 high-efficiency cores (E-cores) and 8 high-performance cores (P-cores), providing up to 32 threads of compute power. It is designed to meet application scenarios that require superior multi-core and multi-threaded performance, large cache, massive memory, high bandwidth and advanced I/O technologies.
Target application areas include medical imaging, test and measurement, communications and networking, retail, energy and finance. Other application scenarios include video surveillance for traffic monitoring, and automation applications such as optical inspection, which can also benefit from the module's enhanced performance.
The new conga-HPC/cBLS COM-HPC Client Size C module is particularly well suited for high-performance real-time applications with integrated workloads. The Hypervisor integrated in the module firmware makes system integration very easy. The modules are a cost-effective alternative to conventional motherboards and are especially suitable for applications that require continuous maximum performance and regular performance upgrades. In addition, the standardized COM modules not only provide high scalability, but also allow for easy upgrades across processor generations by simply replacing the modules without changing the underlying design.
Jürgen Jungbauer, Senior Product Line Manager at Conquest, explains: “The module's heterogeneous computing architecture with powerful Intel® Graphics and Deep Learning Boost makes it a high-performance, low-power server capable of AI inference for power-hungry edge applications. When used as a GPGPU, it offers a superb price/performance ratio. At the same time, support for Intel® TSN and TCC provides an ideal foundation for networked real-time applications in areas such as medical technology, automation and industrial solutions.”
Application-Ready with Hypervisor-on-Modules Support
The conga-HPC/cBLS module supports up to 42 PCIe lanes, including 16 PCIe Gen 5 lanes and 12 PCIe Gen 4 lanes. The integrated Intel® graphics technology comes with up to 32 execution units to deliver superior AI inference performance for AI edge applications. The modules also support fast DDR5-4000 memory with ECC checksum for data-critical applications.
This COM-HPC Client Size C module is also available as an application-ready aReady.COM platform with options for validated and pre-installed operating systems such as ctrlX OS, Ubuntu or RT-Linux. It can also be paired with aReady.VT and IoT connectivity for system integration. The modules can also be pre-loaded with customer applications, enabling users to plug them directly into the completed system, thus accelerating time-to-market. The Hypervisor functionality integrated through the module's firmware provides a cost-effective and flexible solution for system design, enabling multiple system applications on a single machine. Examples include test and measurement systems for visualization, real-time control of production cells (including HMI and IoT gateways), and edge servers in smart grids.
In addition, application development is simplified by the high-performance ecosystem and design services offered by Conquest. Included services include a comprehensive board-level support package, proven production-grade application carrier boards, customized thermal solutions, thorough documentation and training, and high-speed signal integrity measurements. Developers can also install the new COM-HPC module on Conquest's Micro-ATX Application Carrier Boards (conga-HPC/mATX) to gain immediate access to the new module's full range of features and enhancements, including ultra-high speed PCIe connectivity.
