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Produits NXP - Embarqués - Microcontrôleurs

Dossiers 9 482
Page  129/339
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Size
Speed
Connectivity
Peripherals
Number of I/O
Program Memory Size
Program Memory Type
EEPROM Size
RAM Size
Voltage - Supply (Vcc/Vdd)
Data Converters
Oscillator Type
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
SPC5673FK0MVR2
NXP

3M FLASH 256K RAM Z7 200MHZ

  • Core Processor: e200z7
  • Core Size: 32-Bit
  • Speed: 200MHz
  • Connectivity: CANbus, SCI, SPI
  • Peripherals: DMA, POR, PWM
  • Number of I/O: 32
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
  • Data Converters: A/D 64x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BBGA
  • Supplier Device Package: 416-PBGA (27x27)
paquet: 416-BBGA
Stock3 888
32-Bit
200MHz
CANbus, SCI, SPI
DMA, POR, PWM
32
3MB (3M x 8)
FLASH
-
192K x 8
1.08 V ~ 5.25 V
A/D 64x12b
External
-40°C ~ 125°C (TA)
-
416-BBGA
416-PBGA (27x27)
SPC5673FF3MVR2
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z7
  • Core Size: 32-Bit
  • Speed: 200MHz
  • Connectivity: CANbus, SCI, SPI
  • Peripherals: DMA, POR, PWM
  • Number of I/O: 32
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
  • Data Converters: A/D 64x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BBGA
  • Supplier Device Package: 416-PBGA (27x27)
paquet: 416-BBGA
Stock7 456
32-Bit
200MHz
CANbus, SCI, SPI
DMA, POR, PWM
32
3MB (3M x 8)
FLASH
-
192K x 8
1.08 V ~ 5.25 V
A/D 64x12b
External
-40°C ~ 125°C (TA)
-
416-BBGA
416-PBGA (27x27)
SPC5566MZP80
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z6
  • Core Size: 32-Bit
  • Speed: 80MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 256
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
  • Data Converters: A/D 40x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BBGA
  • Supplier Device Package: 416-PBGA (27x27)
paquet: 416-BBGA
Stock4 272
32-Bit
80MHz
CANbus, EBI/EMI, Ethernet, SCI, SPI
DMA, POR, PWM, WDT
256
3MB (3M x 8)
FLASH
-
128K x 8
1.35 V ~ 1.65 V
A/D 40x12b
External
-40°C ~ 125°C (TA)
-
416-BBGA
416-PBGA (27x27)
hot SPC5673FK0MVR2R
NXP

3M FLASH 256K RAM Z7 200MHZ

  • Core Processor: e200z7
  • Core Size: 32-Bit
  • Speed: 200MHz
  • Connectivity: CANbus, SCI, SPI
  • Peripherals: DMA, POR, PWM
  • Number of I/O: 32
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
  • Data Converters: A/D 64x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BBGA
  • Supplier Device Package: 416-PBGA (27x27)
paquet: 416-BBGA
Stock9 672
32-Bit
200MHz
CANbus, SCI, SPI
DMA, POR, PWM
32
3MB (3M x 8)
FLASH
-
192K x 8
1.08 V ~ 5.25 V
A/D 64x12b
External
-40°C ~ 125°C (TA)
-
416-BBGA
416-PBGA (27x27)
SPC5673FF3MVR2R
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z7
  • Core Size: 32-Bit
  • Speed: 200MHz
  • Connectivity: CANbus, SCI, SPI
  • Peripherals: DMA, POR, PWM
  • Number of I/O: 32
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
  • Data Converters: A/D 64x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BBGA
  • Supplier Device Package: 416-PBGA (27x27)
paquet: 416-BBGA
Stock4 032
32-Bit
200MHz
CANbus, SCI, SPI
DMA, POR, PWM
32
3MB (3M x 8)
FLASH
-
192K x 8
1.08 V ~ 5.25 V
A/D 64x12b
External
-40°C ~ 125°C (TA)
-
416-BBGA
416-PBGA (27x27)
SPC5566MZP80R
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z6
  • Core Size: 32-Bit
  • Speed: 80MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 256
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
  • Data Converters: A/D 40x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BBGA
  • Supplier Device Package: 416-PBGA (27x27)
paquet: 416-BBGA
Stock6 240
32-Bit
80MHz
CANbus, EBI/EMI, Ethernet, SCI, SPI
DMA, POR, PWM, WDT
256
3MB (3M x 8)
FLASH
-
128K x 8
1.35 V ~ 1.65 V
A/D 40x12b
External
-40°C ~ 125°C (TA)
-
416-BBGA
416-PBGA (27x27)
SPC5554MVR132
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z6
  • Core Size: 32-Bit
  • Speed: 132MHz
  • Connectivity: CANbus, EBI/EMI, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 256
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
  • Data Converters: A/D 40x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BBGA
  • Supplier Device Package: 416-PBGA (27x27)
paquet: 416-BBGA
Stock5 616
32-Bit
132MHz
CANbus, EBI/EMI, SCI, SPI
DMA, POR, PWM, WDT
256
2MB (2M x 8)
FLASH
-
64K x 8
1.35 V ~ 1.65 V
A/D 40x12b
External
-40°C ~ 125°C (TA)
-
416-BBGA
416-PBGA (27x27)
SPC5777MK0MVA8R
NXP

NXP 32-BIT MCU QUAD POWER ARCH

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 300MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8.64MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 404K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 12b SAR, 16b Sigma-Delta
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 512-FBGA
  • Supplier Device Package: 512-TEPBGA (25x25)
paquet: 512-FBGA
Stock7 728
32-Bit Tri-Core
300MHz
CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART
DMA, LVD, POR, Zipwire
-
8.64MB (8M x 8)
FLASH
-
404K x 8
3 V ~ 5.5 V
A/D 12b SAR, 16b Sigma-Delta
Internal
-40°C ~ 125°C (TA)
-
512-FBGA
512-TEPBGA (25x25)
SPC5748GBK0AMMN6
NXP

TRIPLE CORE 6M FLASH

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 246
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 324-LBGA
  • Supplier Device Package: 324-MAPBGA (19x19)
paquet: 324-LBGA
Stock6 432
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
246
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
324-LBGA
324-MAPBGA (19x19)
SPC5777CDK3MMO4
NXP

POWER ARCH CORES 8MB FL

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock7 904
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SPC5777CDK3MME4
NXP

POWER ARCH CORES 8MB FL

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BGA
  • Supplier Device Package: 416-MAPBGA (27x27)
paquet: 416-BGA
Stock3 792
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
416-BGA
416-MAPBGA (27x27)
MPC5554MZP112
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z6
  • Core Size: 32-Bit
  • Speed: 112MHz
  • Connectivity: CANbus, EBI/EMI, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 256
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
  • Data Converters: A/D 40x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BBGA
  • Supplier Device Package: 416-PBGA (27x27)
paquet: 416-BBGA
Stock2 768
32-Bit
112MHz
CANbus, EBI/EMI, SCI, SPI
DMA, POR, PWM, WDT
256
2MB (2M x 8)
FLASH
-
64K x 8
1.35 V ~ 1.65 V
A/D 40x12b
External
-40°C ~ 125°C (TA)
-
416-BBGA
416-PBGA (27x27)
SPC5777CDK3MMO4R
NXP

POWER ARCH CORES 8MB FL

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock6 384
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SPC5675KF0MMM2
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z7d
  • Core Size: 32-Bit Dual-Core
  • Speed: 180MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
  • Data Converters: A/D 22x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-MAPBGA (14x14)
paquet: 257-LFBGA
Stock5 568
32-Bit Dual-Core
180MHz
CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
DMA, POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
512K x 8
1.14 V ~ 5.5 V
A/D 22x12b
Internal
-40°C ~ 125°C (TA)
-
257-LFBGA
257-MAPBGA (14x14)
SPC5675KFAVMS2
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z7d
  • Core Size: 32-Bit Dual-Core
  • Speed: 180MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
  • Data Converters: A/D 34x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 473-LFBGA
  • Supplier Device Package: 473-MAPBGA (19x19)
paquet: 473-LFBGA
Stock2 944
32-Bit Dual-Core
180MHz
CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
DMA, POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
512K x 8
1.14 V ~ 5.5 V
A/D 34x12b
Internal
-40°C ~ 105°C (TA)
-
473-LFBGA
473-MAPBGA (19x19)
SPC5675KFF0VMM2
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z7d
  • Core Size: 32-Bit Dual-Core
  • Speed: 180MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
  • Data Converters: A/D 22x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-MAPBGA (14x14)
paquet: 257-LFBGA
Stock2 528
32-Bit Dual-Core
180MHz
CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
DMA, POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
512K x 8
1.14 V ~ 5.5 V
A/D 22x12b
Internal
-40°C ~ 105°C (TA)
-
257-LFBGA
257-MAPBGA (14x14)
SPC5675KFAVMM2
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z7d
  • Core Size: 32-Bit Dual-Core
  • Speed: 180MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
  • Data Converters: A/D 22x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-MAPBGA (14x14)
paquet: 257-LFBGA
Stock3 184
32-Bit Dual-Core
180MHz
CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
DMA, POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
512K x 8
1.14 V ~ 5.5 V
A/D 22x12b
Internal
-40°C ~ 105°C (TA)
-
257-LFBGA
257-MAPBGA (14x14)
SPC5675KF0MMS2
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z7d
  • Core Size: 32-Bit Dual-Core
  • Speed: 180MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
  • Data Converters: A/D 34x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 473-LFBGA
  • Supplier Device Package: 473-MAPBGA (19x19)
paquet: 473-LFBGA
Stock3 696
32-Bit Dual-Core
180MHz
CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
DMA, POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
512K x 8
1.14 V ~ 5.5 V
A/D 34x12b
Internal
-40°C ~ 125°C (TA)
-
473-LFBGA
473-MAPBGA (19x19)
SPC5748GHK0AMMN6
NXP

ULTRA RELIABLE MCU WITH VAST PER

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 246
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 324-LBGA
  • Supplier Device Package: 324-MAPBGA (19x19)
paquet: 324-LBGA
Stock6 128
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
246
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
324-LBGA
324-MAPBGA (19x19)
SPC5777MK0MVU8R
NXP

NXP 32-BIT MCU QUAD POWER ARCH

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 300MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8.64MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 404K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 12b SAR, 16b Sigma-Delta
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BBGA
  • Supplier Device Package: 416-PBGA (27x27)
paquet: 416-BBGA
Stock7 520
32-Bit Tri-Core
300MHz
CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART
DMA, LVD, POR, Zipwire
-
8.64MB (8M x 8)
FLASH
-
404K x 8
3 V ~ 5.5 V
A/D 12b SAR, 16b Sigma-Delta
Internal
-40°C ~ 125°C (TA)
-
416-BBGA
416-PBGA (27x27)
SPC5777CDK3MME4R
NXP

POWER ARCH CORES 8MB FL

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BGA
  • Supplier Device Package: 416-MAPBGA (27x27)
paquet: 416-BGA
Stock2 592
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
416-BGA
416-MAPBGA (27x27)
SPC5675KF0VMS2
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z7d
  • Core Size: 32-Bit Dual-Core
  • Speed: 180MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
  • Data Converters: A/D 34x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 473-LFBGA
  • Supplier Device Package: 473-MAPBGA (19x19)
paquet: 473-LFBGA
Stock6 480
32-Bit Dual-Core
180MHz
CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
DMA, POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
512K x 8
1.14 V ~ 5.5 V
A/D 34x12b
Internal
-40°C ~ 105°C (TA)
-
473-LFBGA
473-MAPBGA (19x19)
SPC5777CSK3MMO3
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock5 664
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
hot SPC5675KFAVMS2R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z7d
  • Core Size: 32-Bit Dual-Core
  • Speed: 180MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
  • Data Converters: A/D 34x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 473-LFBGA
  • Supplier Device Package: 473-MAPBGA (19x19)
paquet: 473-LFBGA
Stock7 120
32-Bit Dual-Core
180MHz
CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
DMA, POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
512K x 8
1.14 V ~ 5.5 V
A/D 34x12b
Internal
-40°C ~ 105°C (TA)
-
473-LFBGA
473-MAPBGA (19x19)
SPC5777CLK3MMO3
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock5 376
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SPC5777CDK3MMO3
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock6 512
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SPC5777CCK3MMO3
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock4 624
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SP5748GHK0AMMN6R
NXP

ULTRA RELIABLE MCU WITH VAST PER

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 246
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 324-LBGA
  • Supplier Device Package: 324-MAPBGA (19x19)
paquet: 324-LBGA
Stock7 200
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
246
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
324-LBGA
324-MAPBGA (19x19)