Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 256-LBGA |
Stock4 640 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 256-LBGA |
Stock3 232 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
TRIPLE CORE 6M FLASH 768K RAM
|
paquet: 256-LBGA |
Stock2 096 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32 BIT MCU 2M FLASH 1.5MB
|
paquet: 257-LFBGA |
Stock6 096 |
|
32-Bit Tri-Core | 180MHz, 240MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire | POR, PWM, WDT | - | 2MB (2M x 8) | FLASH | 64K x 8 | 1.5M x 8 | 1.19 V ~ 5.5 V | A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b | Internal | -40°C ~ 105°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
32 BIT6MB FLASH768 RAM
|
paquet: 256-LBGA |
Stock5 040 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
32 BITDUAL CORE4M FLAS
|
paquet: 324-LBGA |
Stock3 264 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 246 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 324-LBGA | 324-MAPBGA (19x19) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 257-LFBGA |
Stock2 160 |
|
32-Bit Dual-Core | 180MHz | CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, POR, PWM, WDT | - | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 384K x 8 | 1.14 V ~ 5.5 V | A/D 22x12b | Internal | -40°C ~ 105°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
2M FLASH 1.5MB SRAM 2X
|
paquet: 257-LFBGA |
Stock7 088 |
|
32-Bit Tri-Core | 180MHz, 240MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire | POR, PWM, WDT | - | 2MB (2M x 8) | FLASH | 64K x 8 | 1.5M x 8 | 1.19 V ~ 5.5 V | A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b | Internal | -40°C ~ 105°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
3M FLASH256K RAM120MHZ
|
paquet: 256-LBGA |
Stock3 952 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 256-LBGA |
Stock6 096 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
TRIPLE CORE 6M FLASH 768K RAM
|
paquet: 256-LBGA |
Stock3 392 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
IC SRAM 2M FLASH 257MAPBGA
|
paquet: 257-LFBGA |
Stock7 936 |
|
32-Bit Tri-Core | 180MHz, 240MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire | POR, PWM, WDT | - | 2MB (2M x 8) | FLASH | 64K x 8 | 1.5M x 8 | 1.19 V ~ 5.5 V | A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b | Internal | -40°C ~ 105°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 324-BBGA |
Stock5 328 |
|
32-Bit | 120MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 151 | 3MB (3M x 8) | FLASH | - | 192K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 324-BBGA | 324-TEPBGA (23x23) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 2MB
|
paquet: 208-BGA |
Stock7 264 |
|
32-Bit | 116MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 155 | 2MB (2M x 8) | FLASH | - | 592K x 8 | 3 V ~ 5.5 V | A/D 36x10b | Internal | -40°C ~ 105°C (TA) | - | 208-BGA | 208-MAPBGA (17x17) |
||
NXP |
TRIPLE CORE 6M FLASH 768K RAM
|
paquet: 256-LBGA |
Stock2 944 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
TRIPLE CORE, 6M FLASH
|
paquet: 176-LQFP Exposed Pad |
Stock5 808 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU TRIPLE CORE 4MB
|
paquet: 176-LQFP Exposed Pad |
Stock3 440 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
ULTRA RELIABLE MCU WITH VAST PER
|
paquet: 176-LQFP Exposed Pad |
Stock3 040 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 208-LQFP |
Stock5 104 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 177 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP | 208-TQFP (28x28) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 176-LQFP |
Stock2 048 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 176-LQFP |
Stock3 360 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 256-LBGA |
Stock4 688 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 256-LBGA |
Stock4 960 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 256-LBGA |
Stock3 456 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 208-LQFP |
Stock2 032 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 177 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP | 208-TQFP (28x28) |
||
NXP |
NXP 32 BIT MCU 2M FLASH 1.5MB
|
paquet: 257-LFBGA |
Stock2 448 |
|
32-Bit Tri-Core | 180MHz, 240MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire | POR, PWM, WDT | - | 2MB (2M x 8) | FLASH | 64K x 8 | 1.5M x 8 | 1.19 V ~ 5.5 V | A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b | Internal | -40°C ~ 125°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
TRIPLE CORE 6M FLASH 768K RAM
|
paquet: 256-LBGA |
Stock6 704 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 256-LBGA |
Stock4 816 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPBGA |