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Produits NXP - Embarqués - Microcontrôleurs

Dossiers 9 482
Page  128/339
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Size
Speed
Connectivity
Peripherals
Number of I/O
Program Memory Size
Program Memory Type
EEPROM Size
RAM Size
Voltage - Supply (Vcc/Vdd)
Data Converters
Oscillator Type
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
SPC5777CAK3MMO3
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock5 328
32-Bit Tri-Core
264MHz
EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SPC5777CRK3MMO3
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock4 736
32-Bit Tri-Core
264MHz
EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SPC5777CSK3MME3
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BGA
  • Supplier Device Package: 416-MAPBGA (27x27)
paquet: 416-BGA
Stock6 016
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
416-BGA
416-MAPBGA (27x27)
SPC5748GHK0AMMJ6
NXP

ULTRA RELIABLE MCU WITH VAST PER

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock7 136
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
SPC5675KFF0VMM2R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z7d
  • Core Size: 32-Bit Dual-Core
  • Speed: 180MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
  • Data Converters: A/D 22x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-MAPBGA (14x14)
paquet: 257-LFBGA
Stock5 040
32-Bit Dual-Core
180MHz
CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
DMA, POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
512K x 8
1.14 V ~ 5.5 V
A/D 22x12b
Internal
-40°C ~ 105°C (TA)
-
257-LFBGA
257-MAPBGA (14x14)
hot SPC5675KFAVMM2R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z7d
  • Core Size: 32-Bit Dual-Core
  • Speed: 180MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
  • Data Converters: A/D 22x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-MAPBGA (14x14)
paquet: 257-LFBGA
Stock9 828
32-Bit Dual-Core
180MHz
CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
DMA, POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
512K x 8
1.14 V ~ 5.5 V
A/D 22x12b
Internal
-40°C ~ 105°C (TA)
-
257-LFBGA
257-MAPBGA (14x14)
SPC5748GHK0AMKU6
NXP

ULTRA RELIABLE MCU WITH VAST PER

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock7 584
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SPC5777CLK3MME3
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BGA
  • Supplier Device Package: 416-MAPBGA (27x27)
paquet: 416-BGA
Stock5 072
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
416-BGA
416-MAPBGA (27x27)
hot MAC7116VAG50
NXP

32-BIT MCU ARM7TDMI-S 32KB FLA

  • Core Processor: ARM7®
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
  • Peripherals: DMA, POR
  • Number of I/O: 112
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 32K x 8
  • RAM Size: 48K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 16x8/10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
paquet: 144-LQFP
Stock4 992
32-Bit
50MHz
CANbus, EBI/EMI, I²C, SCI, SPI
DMA, POR
112
1MB (1M x 8)
FLASH
32K x 8
48K x 8
2.35 V ~ 5.5 V
A/D 16x8/10b
Internal
-40°C ~ 105°C (TA)
-
144-LQFP
144-LQFP (20x20)
SPC5777CDK3MME3
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BGA
  • Supplier Device Package: 416-MAPBGA (27x27)
paquet: 416-BGA
Stock6 432
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
416-BGA
416-MAPBGA (27x27)
SPC5777CSK3MMO3R
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BGA
  • Supplier Device Package: 416-MAPBGA (27x27)
paquet: 416-BGA
Stock7 984
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
416-BGA
416-MAPBGA (27x27)
SPC5777CRK3MME3
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BGA
  • Supplier Device Package: 416-MAPBGA (27x27)
paquet: 416-BGA
Stock3 888
32-Bit Tri-Core
264MHz
EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
416-BGA
416-MAPBGA (27x27)
SPC5777CAK3MME3
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BGA
  • Supplier Device Package: 416-MAPBGA (27x27)
paquet: 416-BGA
Stock6 224
32-Bit Tri-Core
264MHz
EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
416-BGA
416-MAPBGA (27x27)
SPC5748GTK0AMMJ6
NXP

TRIPLE CORE 6M FLASH 768K RAM

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock2 752
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
SPC5748GTK0AMKU6
NXP

TRIPLE CORE 6M FLASH

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock6 080
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SP5748GBK0AMMN6R
NXP

TRIPLE CORE 6M FLASH

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 246
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 324-LBGA
  • Supplier Device Package: 324-MAPBGA (19x19)
paquet: 324-LBGA
Stock2 912
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
246
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
324-LBGA
324-MAPBGA (19x19)
SPC5777CLK3MMO3R
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock4 000
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SPC5777CDK3MMO3R
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock7 536
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SPC5777CCK3MMO3R
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock6 960
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SP5748GHK0AMMJ6R
NXP

ULTRA RELIABLE MCU WITH VAST PER

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock6 336
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
SPC5645SF1CVU
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 125MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 177
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1.064M x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 20x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BBGA
  • Supplier Device Package: 416-PBGA (27x27)
paquet: 416-BBGA
Stock2 256
32-Bit
125MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
177
2MB (2M x 8)
FLASH
-
1.064M x 8
3 V ~ 5.5 V
A/D 20x10b
Internal
-40°C ~ 85°C (TA)
-
416-BBGA
416-PBGA (27x27)
SPC5674KAVMS2
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z7d
  • Core Size: 32-Bit Dual-Core
  • Speed: 180MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 384K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
  • Data Converters: A/D 34x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 473-LFBGA
  • Supplier Device Package: 473-MAPBGA (19x19)
paquet: 473-LFBGA
Stock4 992
32-Bit Dual-Core
180MHz
CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
DMA, POR, PWM, WDT
-
1.5MB (1.5M x 8)
FLASH
64K x 8
384K x 8
1.14 V ~ 5.5 V
A/D 34x12b
Internal
-40°C ~ 105°C (TA)
-
473-LFBGA
473-MAPBGA (19x19)
SPC5777CK3MMO3R
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock2 192
32-Bit Tri-Core
264MHz
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SPC5777CAK3MMO3R
NXP

NXP 32-BIT MCU POWER ARCH CORES

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock3 552
32-Bit Tri-Core
264MHz
EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SPC5646CCK0MLT1R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 177
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 208-LQFP
  • Supplier Device Package: 208-TQFP (28x28)
paquet: 208-LQFP
Stock5 504
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
177
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 33x10b, 10x12b
Internal
-40°C ~ 125°C (TA)
-
208-LQFP
208-TQFP (28x28)
SPC5646CCF0MLT1R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 177
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 208-LQFP
  • Supplier Device Package: 208-TQFP (28x28)
paquet: 208-LQFP
Stock3 520
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
177
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 33x10b, 10x12b
Internal
-40°C ~ 125°C (TA)
-
208-LQFP
208-TQFP (28x28)
SPC5674KAVMM2
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z7d
  • Core Size: 32-Bit Dual-Core
  • Speed: 180MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 384K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
  • Data Converters: A/D 22x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-MAPBGA (14x14)
paquet: 257-LFBGA
Stock5 664
32-Bit Dual-Core
180MHz
CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
DMA, POR, PWM, WDT
-
1.5MB (1.5M x 8)
FLASH
64K x 8
384K x 8
1.14 V ~ 5.5 V
A/D 22x12b
Internal
-40°C ~ 105°C (TA)
-
257-LFBGA
257-MAPBGA (14x14)
SPC5748GBK0AMMJ6
NXP

TRIPLE CORE 6M FLASH 768K RAM

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock4 416
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)