Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
S32K144 32-BIT MCU, ARM
|
paquet: 64-LQFP |
Stock5 968 |
|
32-Bit | 112MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | - | 512KB (512K x 8) | FLASH | 4K x 8 | 64K x 8 | 2.7 V ~ 5.5 V | A/D 16x12b, D/A 1x8b | Internal | -40°C ~ 125°C (TA) | - | 64-LQFP | 64-LQFP (10x10) |
||
NXP |
1.5MB NVM 2 X E200Z4 CORES 180
|
paquet: 144-LQFP |
Stock6 528 |
|
32-Bit Dual-Core | 180MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | - | 1.5MB (1.5M x 8) | FLASH | - | 192K x 8 | 3.15 V ~ 5.5 V | A/D 64x12b | Internal | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
1.5MB NVM 2 X E200Z4 CORES 150
|
paquet: 144-LQFP |
Stock5 568 |
|
32-Bit Dual-Core | 150MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | - | 1.5MB (1.5M x 8) | FLASH | - | 192K x 8 | 3.15 V ~ 5.5 V | A/D 64x12b | Internal | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
1.5MB NVM 2 X E200Z4 CORES 150
|
paquet: 144-LQFP |
Stock4 144 |
|
32-Bit Dual-Core | 150MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | - | 1.5MB (1.5M x 8) | FLASH | - | 192K x 8 | 3.15 V ~ 5.5 V | A/D 64x12b | Internal | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 64-LQFP |
Stock5 296 |
|
32-Bit | 64MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, WDT | 39 | 512KB (512K x 8) | FLASH | 64K x 8 | 96K x 8 | 3 V ~ 3.6 V | A/D 4x10b | Internal | -40°C ~ 105°C (TA) | - | 64-LQFP | 64-LQFP (10x10) |
||
NXP |
MAGNIV 16-BIT MCU S12 CORE 48K
|
paquet: 48-LQFP |
Stock5 472 |
|
16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 28 | 48KB (48K x 8) | FLASH | 512 x 8 | 2K x 8 | 3.13 V ~ 5.5 V | A/D 6x10b | Internal | -40°C ~ 105°C (TA) | - | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
MAGNIV 16-BIT MCU S12 CORE 48K
|
paquet: 32-LQFP |
Stock2 592 |
|
16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16 | 48KB (48K x 8) | FLASH | 512 x 8 | 2K x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | Internal | -40°C ~ 105°C (TA) | - | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
MAGNIV 16-BIT MCU S12 CORE 48K
|
paquet: 48-LQFP |
Stock4 912 |
|
16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 28 | 48KB (48K x 8) | FLASH | 512 x 8 | 2K x 8 | 3.13 V ~ 5.5 V | A/D 6x10b | Internal | -40°C ~ 85°C (TA) | - | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
S32K144 32-BIT MCU ARM CORTEX-M
|
paquet: 64-LQFP |
Stock7 792 |
|
32-Bit | 64MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | - | 512KB (512K x 8) | FLASH | 4K x 8 | 64K x 8 | 2.7 V ~ 5.5 V | A/D 16x12b, D/A 1x8b | Internal | -40°C ~ 85°C (TA) | - | 64-LQFP | 64-LQFP (10x10) |
||
NXP |
S32K144 32-BIT MCU ARM
|
paquet: 100-LQFP |
Stock7 168 |
|
32-Bit | 64MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | - | 512KB (512K x 8) | FLASH | 4K x 8 | 64K x 8 | 2.7 V ~ 5.5 V | A/D 16x12b, D/A 1x8b | Internal | -40°C ~ 125°C (TA) | - | 100-LQFP | 100-LQFP (14x14) |
||
NXP |
S32K144 32-BIT MCU ARM CORTEX-M
|
paquet: 64-LQFP |
Stock4 224 |
|
32-Bit | 80MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | - | 512KB (512K x 8) | FLASH | 4K x 8 | 64K x 8 | 2.7 V ~ 5.5 V | A/D 16x12b, D/A 1x8b | Internal | -40°C ~ 85°C (TA) | - | 64-LQFP | 64-LQFP (10x10) |
||
NXP |
IC MCU 16BIT FLASH
|
paquet: 64-LQFP Exposed Pad |
Stock4 800 |
|
16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 31 | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5 V ~ 40 V | A/D 9x12b | Internal | -40°C ~ 105°C (TA) | - | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) |
||
NXP |
IC MCU 16BIT FLASH
|
paquet: 64-LQFP Exposed Pad |
Stock3 200 |
|
16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 31 | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5 V ~ 40 V | A/D 9x12b | Internal | -40°C ~ 125°C (TA) | - | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) |
||
NXP |
IC MCU 16BIT FLASH
|
paquet: 64-LQFP Exposed Pad |
Stock2 288 |
|
16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 31 | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5 V ~ 40 V | A/D 9x12b | Internal | -40°C ~ 105°C (TA) | - | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) |
||
NXP |
IC MCU 16BIT FLASH
|
paquet: 64-LQFP Exposed Pad |
Stock6 672 |
|
16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 31 | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5 V ~ 40 V | A/D 9x12b | Internal | -40°C ~ 125°C (TA) | - | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) |
||
NXP |
IC MCU 16BIT FLASH
|
paquet: 64-LQFP Exposed Pad |
Stock5 632 |
|
16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 31 | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5 V ~ 40 V | A/D 9x12b | Internal | -40°C ~ 105°C (TA) | - | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) |
||
NXP |
IC MCU 16BIT FLASH
|
paquet: 64-LQFP Exposed Pad |
Stock5 040 |
|
16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 31 | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5 V ~ 40 V | A/D 9x12b | Internal | -40°C ~ 150°C (TA) | - | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) |
||
NXP |
IC MCU 16BIT FLASH
|
paquet: 64-LQFP Exposed Pad |
Stock2 512 |
|
16-Bit | 50MHz | LINbus, SCI, SPI | DMA, POR, PWM, WDT | 31 | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5 V ~ 40 V | A/D 9x12b | Internal | -40°C ~ 105°C (TA) | - | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) |
||
NXP |
IC MCU 16BIT FLASH
|
paquet: 64-LQFP Exposed Pad |
Stock3 856 |
|
16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 31 | 32KB (32K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5 V ~ 40 V | A/D 9x12b | Internal | -40°C ~ 105°C (TA) | - | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) |
||
NXP |
IC MCU 16BIT FLASH
|
paquet: 64-LQFP Exposed Pad |
Stock5 776 |
|
16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 31 | 32KB (32K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5 V ~ 40 V | A/D 9x12b | Internal | -40°C ~ 125°C (TA) | - | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) |
||
NXP |
IC MCU 16BIT FLASH
|
paquet: 64-LQFP Exposed Pad |
Stock3 152 |
|
16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 31 | 32KB (32K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5 V ~ 40 V | A/D 9x12b | Internal | -40°C ~ 105°C (TA) | - | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) |
||
NXP |
IC MCU 16BIT FLASH
|
paquet: 64-LQFP Exposed Pad |
Stock4 320 |
|
16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 31 | 32KB (32K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5 V ~ 40 V | A/D 9x12b | Internal | -40°C ~ 150°C (TA) | - | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) |
||
NXP |
IC MCU 16BIT FLASH
|
paquet: 64-LQFP Exposed Pad |
Stock4 896 |
|
16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 31 | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5 V ~ 40 V | A/D 9x12b | Internal | -40°C ~ 105°C (TA) | - | 64-LQFP Exposed Pad | 64-LQFP-EP (10x10) |
||
NXP |
IC MCU 32BIT ROMLESS 364BGA
|
paquet: 364-LFBGA |
Stock6 032 |
|
32-Bit Dual-Core | 400MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C | - | 364-LFBGA | 364-LFBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364BGA
|
paquet: 364-LFBGA |
Stock3 344 |
|
32-Bit Dual-Core | 500MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C | - | 364-LFBGA | 364-LFBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364BGA
|
paquet: 364-LFBGA |
Stock7 056 |
|
32-Bit Dual-Core | 500MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C | - | 364-LFBGA | 364-LFBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
paquet: 176-LQFP Exposed Pad |
Stock4 928 |
|
32-Bit Single-Core | 266MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C | - | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
paquet: 176-LQFP Exposed Pad |
Stock4 432 |
|
32-Bit Single-Core | 266MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C | - | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |