Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
NXP 32-BIT MCU POWER ARCH 2MB
|
paquet: 256-LBGA |
Stock4 896 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 2MB (2M x 8) | FLASH | 64K x 8 | 160K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
32-BIT MCU ARM7TDMI-S 512KB FL
|
paquet: 144-LQFP |
Stock2 928 |
|
32-Bit | 50MHz | CANbus, EBI/EMI, I²C, SCI, SPI | DMA, POR | 112 | 544KB (544K x 8) | FLASH | 32K x 8 | 32K x 8 | 2.35 V ~ 5.5 V | A/D 16x8/10b | Internal | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 324-BBGA |
Stock3 728 |
|
32-Bit | 120MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 151 | 3MB (3M x 8) | FLASH | - | 192K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 324-BBGA | 324-TEPBGA (23x23) |
||
NXP |
DUAL CORE 6M FLASH 768K RAM F
|
paquet: 256-LBGA |
Stock3 200 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 176-LQFP |
Stock3 344 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 2MB (2M x 8) | FLASH | 64K x 8 | 160K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 176-LQFP |
Stock6 880 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 2MB (2M x 8) | FLASH | 64K x 8 | 160K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 176-LQFP |
Stock3 328 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 176-LQFP |
Stock4 352 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
paquet: 208-BGA |
Stock6 480 |
|
32-Bit Dual-Core | 66MHz | CANbus, EBI/EMI, I²C, SCI, SPI | DMA, POR, PWM, WDT | 111 | 1.5MB (1.5M x 8) | FLASH | - | 80K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 105°C (TA) | - | 208-BGA | 208-MAPBGA (17x17) |
||
NXP |
DUAL CORE 6M FLASH 768K RAM F
|
paquet: 176-LQFP Exposed Pad |
Stock6 608 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 208-LQFP |
Stock3 280 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 177 | 2MB (2M x 8) | FLASH | 64K x 8 | 160K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP | 208-TQFP (28x28) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 208-LQFP |
Stock3 584 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 177 | 2MB (2M x 8) | FLASH | 64K x 8 | 160K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP | 208-TQFP (28x28) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 208-LQFP |
Stock4 608 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 177 | 2MB (2M x 8) | FLASH | 64K x 8 | 160K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP | 208-TQFP (28x28) |
||
NXP |
DUAL CORE, 6M FLASH, 768
|
paquet: 256-LBGA |
Stock6 160 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
|
paquet: 256-LBGA |
Stock7 536 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 256-LBGA |
Stock2 512 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
32BIT4MB FLASH192K RAMFLEXRAY
|
paquet: 208-BGA |
Stock3 776 |
|
32-Bit | 120MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 120 | 4MB (4M x 8) | FLASH | - | 192K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 208-BGA | 208-MAPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 324-BBGA |
Stock4 624 |
|
32-Bit | 80MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 151 | 2MB (2M x 8) | FLASH | - | 128K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 324-BBGA | 324-TEPBGA (23x23) |
||
NXP |
1.5M FLASH128K RAM
|
paquet: 176-LQFP |
Stock8 424 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
1.5M FLASH128K RAM
|
paquet: 176-LQFP |
Stock6 400 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 176-LQFP |
Stock4 016 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 176-LQFP |
Stock5 184 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 4M FLASH 512K RAM F
|
paquet: 176-LQFP Exposed Pad |
Stock6 240 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
DUAL CORE 6M FLASH 768K RAM F
|
paquet: 176-LQFP Exposed Pad |
Stock6 336 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
POWER ARCH CORES 8MB FL
|
paquet: 416-BGA |
Stock3 968 |
|
32-Bit Dual-Core | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | 293 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 40x12b eQADCx2 | External | -40°C ~ 125°C (TA) | - | 416-BGA | 416-MAPBGA (27x27) |
||
NXP |
32 BIT, 4MB FLASH, 512K
|
paquet: 176-LQFP Exposed Pad |
Stock6 224 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 176-LQFP |
Stock5 664 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 176-LQFP |
Stock2 720 |
|
32-Bit | 120MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 84 | 3MB (3M x 8) | FLASH | - | 192K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |