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Produits NXP - Embarqués - Microcontrôleurs

Dossiers 9 482
Page  120/339
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Size
Speed
Connectivity
Peripherals
Number of I/O
Program Memory Size
Program Memory Type
EEPROM Size
RAM Size
Voltage - Supply (Vcc/Vdd)
Data Converters
Oscillator Type
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
SPC5746CHK1AMMH6
NXP

32 BIT DUAL CORE 3M FLASH 512

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: -
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LBGA
  • Supplier Device Package: 100-MAPBGA (11x11)
paquet: 100-LBGA
Stock6 368
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
-
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
100-LBGA
100-MAPBGA (11x11)
SPC5644BF0VLU1R
NXP

NXP 32-BIT MCU POWER ARCH 1.5M

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock7 264
32-Bit
120MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
128K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5644BAVLU1R
NXP

NXP 32-BIT MCU POWER ARCH 1.5M

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock3 056
32-Bit
120MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
128K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5746CHK1ACMJ6
NXP

32 BIT3M FLASH512K RAM

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock4 928
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 85°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
SAC57D53MCVLT
NXP

ARM 32-BIT MCU TRIPLE CORE 3MB

  • Core Processor: ARM® Cortex®-A5, -M4, -M0+
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz, 160MHz, 320MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
  • Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2.3M x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 24x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 208-LQFP Exposed Pad
  • Supplier Device Package: 208-LQFP (28x28)
paquet: 208-LQFP Exposed Pad
Stock6 432
32-Bit Tri-Core
80MHz, 160MHz, 320MHz
CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
DMA, LCD, LVD/HVD, POR, PWM, WDT
-
3MB (3M x 8)
FLASH
-
2.3M x 8
3.15 V ~ 5.5 V
A/D 24x12b
Internal
-40°C ~ 105°C (TA)
-
208-LQFP Exposed Pad
208-LQFP (28x28)
SPC5746CSK1AMKU6
NXP

32 BITDUAL CORE3M FLASH384 RA

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock5 280
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
MC9S12A512CPVER
NXP

S12A 16-BIT MCU HCS12 CORE 512

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CANbus, I²C, SCI, SPI
  • Peripherals: PWM, WDT
  • Number of I/O: 91
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 14K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
paquet: 112-LQFP
Stock5 488
16-Bit
25MHz
CANbus, I²C, SCI, SPI
PWM, WDT
91
512KB (512K x 8)
FLASH
4K x 8
14K x 8
2.35 V ~ 5.25 V
A/D 16x10b
Internal
-40°C ~ 85°C (TA)
-
112-LQFP
112-LQFP (20x20)
SPC5746CBK1AVKU6
NXP

DUAL CORE 3M FLASH 384K RAM F

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock4 208
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SP5747CFK0AVMJ6R
NXP

DUAL CORE 4M FLASH 512

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock2 976
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
4MB (4M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 105°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
SPC5644BK0MLU8
NXP

NXP 32-BIT MCU POWER ARCH 1.5M

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock4 368
32-Bit
120MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
128K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5644BF0MLU8
NXP

NXP 32-BIT MCU POWER ARCH 1.5M

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock5 728
32-Bit
120MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
128K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5644BAMLU8
NXP

NXP 32-BIT MCU POWER ARCH 1.5M

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock6 816
32-Bit
120MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
128K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5644CF0CLU8
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock7 296
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
192K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 85°C (TA)
-
176-LQFP
176-LQFP (24x24)
SP5746CBK1AMMJ6R
NXP

DUAL CORE 3M FLASH 384K RAM F

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock7 328
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
hot SPC5642AF2MLU1
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z4
  • Core Size: 32-Bit
  • Speed: 150MHz
  • Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 84
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V
  • Data Converters: A/D 40x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock18 000
32-Bit
150MHz
CANbus, EBI/EMI, LINbus, SCI, SPI
DMA, POR, PWM, WDT
84
2MB (2M x 8)
FLASH
-
128K x 8
1.14 V ~ 5.25 V
A/D 40x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5745CBK1AMMJ6
NXP

DUAL CORE 2M FLASH 256

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz, 160MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, I²S, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 36x10b, 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock5 232
32-Bit Dual-Core
80MHz, 160MHz
CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
DMA, I²S, POR, WDT
178
2MB (2M x 8)
FLASH
64K x 8
256K x 8
3.15 V ~ 5.5 V
A/D 36x10b, 16x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
SP5746CHK1AVKU6R
NXP

DUAL CORE 3M FLASH 512K RAM F

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock4 912
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SAC57D53MCVMOR
NXP

ARM 32-BIT MCU TRIPLE CORE 3MB

  • Core Processor: ARM® Cortex®-A5, -M4, -M0+
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz, 160MHz, 320MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
  • Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2.3M x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 24x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock3 104
32-Bit Tri-Core
80MHz, 160MHz, 320MHz
CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
DMA, LCD, LVD/HVD, POR, PWM, WDT
-
3MB (3M x 8)
FLASH
-
2.3M x 8
3.15 V ~ 5.5 V
A/D 24x12b
Internal
-40°C ~ 105°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SP5746CBK1AMKU6R
NXP

DUAL CORE 3M FLASH 384K RAM F

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock3 152
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SPC5644CK0VLU8R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock4 848
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
192K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5644CF0VLU8R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock3 040
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
192K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5644BCF0VLU8R
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock4 240
32-Bit
120MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
128K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP
176-LQFP (24x24)
MCW68332A
NXP

32BIT MCU2KRAMTPUQSM

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 120
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SPC5746CSK1AVKU6
NXP

32 BIT3M FLASH384 RAM

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz, 160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock7 632
32-Bit Dual-Core
80MHz, 160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SP5746CSK1AMMJ6R
NXP

32 BITDUAL CORE3M FLASH384 RA

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock5 936
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
S912XDT512J1MAA
NXP

912XDT512J1 GENERAL

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 80MHz
  • Connectivity: CANbus, I²C, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 59
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 20K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
paquet: 80-QFP
Stock4 640
16-Bit
80MHz
CANbus, I²C, SCI, SPI
LVD, POR, PWM, WDT
59
512KB (512K x 8)
FLASH
4K x 8
20K x 8
3.15 V ~ 5.5 V
A/D 8x12b
External
-40°C ~ 125°C (TA)
-
80-QFP
80-QFP (14x14)
SPC5746CBK1ACKU6
NXP

DUAL CORE, 3M FLASH, 384

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz, 160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock5 760
32-Bit Dual-Core
80MHz, 160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 85°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SAC57D52LCVLTR
NXP

ARM 32-BIT MCU TRIPLE CORE 2MB

  • Core Processor: ARM® Cortex®-A5, -M4, -M0+
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz, 160MHz, 320MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
  • Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2.3M x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 24x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 208-LQFP Exposed Pad
  • Supplier Device Package: 208-LQFP (28x28)
paquet: 208-LQFP Exposed Pad
Stock7 968
32-Bit Tri-Core
80MHz, 160MHz, 320MHz
CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
DMA, LCD, LVD/HVD, POR, PWM, WDT
-
2MB (2M x 8)
FLASH
-
2.3M x 8
3.15 V ~ 5.5 V
A/D 24x12b
Internal
-40°C ~ 105°C (TA)
-
208-LQFP Exposed Pad
208-LQFP (28x28)