Page 121 - Produits NXP - Embarqués - Microcontrôleurs | Heisener Electronics
Contactez nous
SalesDept@heisener.com +86-755-83210559 ext. 803
Connexion/S'inscrire
Language Translation

* Please refer to the English Version as our Official Version.

BOM
Chariot 0

Produits NXP - Embarqués - Microcontrôleurs

Dossiers 9 482
Page  121/339
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Size
Speed
Connectivity
Peripherals
Number of I/O
Program Memory Size
Program Memory Type
EEPROM Size
RAM Size
Voltage - Supply (Vcc/Vdd)
Data Converters
Oscillator Type
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
SPC5644BK0VLU1
NXP

NXP 32-BIT MCU POWER ARCH 1.5M

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock5 968
32-Bit
120MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
128K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5644BAVLU1
NXP

NXP 32-BIT MCU POWER ARCH 1.5M

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock3 712
32-Bit
120MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
128K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5646BCF0VLU8R
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock4 528
32-Bit
120MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
3MB (3M x 8)
FLASH
64K x 8
192K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5745RK1MLU3
NXP

NXP 32-BIT MCU TRIPLE POWER ARC

  • Core Processor: e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 150MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 3.5 V ~ 5.5 V
  • Data Converters: A/D 12b SAR, 16b Sigma-Delta
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock6 480
32-Bit Tri-Core
150MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART
DMA, LVD, POR, Zipwire
-
3MB (3M x 8)
FLASH
-
192K x 8
3.5 V ~ 5.5 V
A/D 12b SAR, 16b Sigma-Delta
Internal
-40°C ~ 125°C (TA)
-
176-LQFP
176-LQFP (24x24)
SAC57D54HCVLTR
NXP

ARM 32-BIT MCU TRIPLE CORE 4MB

  • Core Processor: ARM® Cortex®-A5, -M4, -M0+
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz, 160MHz, 320MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
  • Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2.3M x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 24x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 208-LQFP Exposed Pad
  • Supplier Device Package: 208-LQFP (28x28)
paquet: 208-LQFP Exposed Pad
Stock4 688
32-Bit Tri-Core
80MHz, 160MHz, 320MHz
CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
DMA, LCD, LVD/HVD, POR, PWM, WDT
-
4MB (4M x 8)
FLASH
-
2.3M x 8
3.15 V ~ 5.5 V
A/D 24x12b
Internal
-40°C ~ 105°C (TA)
-
208-LQFP Exposed Pad
208-LQFP (28x28)
SP5747CBK0AVKU6R
NXP

DUAL CORE 4M FLASH 512K RAM F

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock7 200
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
4MB (4M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SPC5747CFK0AVMJ6
NXP

DUAL CORE 4M FLASH 512

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock5 808
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI
DMA, LVD, POR, WDT
129
4MB (4M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SPC5746RK1MLU3
NXP

FREESCALE 32-BIT MCU TRIPLE POW

  • Core Processor: e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 150MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3.5 V ~ 5.5 V
  • Data Converters: A/D 12b SAR, 16b Sigma-Delta
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock4 912
32-Bit Tri-Core
150MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART
DMA, LVD, POR, Zipwire
-
4MB (4M x 8)
FLASH
-
256K x 8
3.5 V ~ 5.5 V
A/D 12b SAR, 16b Sigma-Delta
Internal
-40°C ~ 125°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5642AF2MVZ2R
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 151
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V
  • Data Converters: A/D 40x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 324-BBGA
  • Supplier Device Package: 324-TEPBGA (23x23)
paquet: 324-BBGA
Stock5 920
32-Bit
120MHz
CANbus, EBI/EMI, LINbus, SCI, SPI
DMA, POR, PWM, WDT
151
2MB (2M x 8)
FLASH
-
128K x 8
1.14 V ~ 5.25 V
A/D 40x12b
Internal
-40°C ~ 125°C (TA)
-
324-BBGA
324-TEPBGA (23x23)
SPC5645BF0VLU1R
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 160K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock4 688
32-Bit
120MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
2MB (2M x 8)
FLASH
64K x 8
160K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5746CBK1AMMJ6
NXP

DUAL CORE 3M FLASH 384K RAM F

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock7 440
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
SPC5644BK0MLU1R
NXP

NXP 32-BIT MCU POWER ARCH 1.5M

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock6 192
32-Bit
120MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
128K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5644BF0MLU1R
NXP

NXP 32-BIT MCU POWER ARCH 1.5M

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock7 552
32-Bit
120MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
128K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5644BAMLU1R
NXP

NXP 32-BIT MCU POWER ARCH 1.5M

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock7 792
32-Bit
120MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
128K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP
176-LQFP (24x24)
SAC57D53MCVMO
NXP

ARM 32-BIT MCU TRIPLE CORE 3MB

  • Core Processor: ARM® Cortex®-A5, -M4, -M0+
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz, 160MHz, 320MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
  • Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2.3M x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 24x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock2 240
32-Bit Tri-Core
80MHz, 160MHz, 320MHz
CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
DMA, LCD, LVD/HVD, POR, PWM, WDT
-
3MB (3M x 8)
FLASH
-
2.3M x 8
3.15 V ~ 5.5 V
A/D 24x12b
Internal
-40°C ~ 105°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SPC5746CHK1AVKU6
NXP

DUAL CORE 3M FLASH 512K RAM F

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock7 120
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SP5748CSK0ACKU2R
NXP

DUAL CORE 6M FLASH 768K RAM F

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock6 768
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 85°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SP5747CFK0AMKU6R
NXP

DUAL CORE 4M FLASH 512

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock7 056
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
4MB (4M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SPC5746CBK1AMKU6
NXP

DUAL CORE 3M FLASH 384K RAM F

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock4 432
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SPC5644CK0VLU8
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock3 056
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
192K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5644CAVLU8
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock7 696
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
192K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP
176-LQFP (24x24)
SP5746CHK1AMMJ6R
NXP

32 BIT DUAL CORE 3M FLASH 512

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock3 632
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
SAC57D54HCVMOR
NXP

ARM 32-BIT MCU TRIPLE CORE 4MB

  • Core Processor: ARM® Cortex®-A5, -M4, -M0+
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz, 160MHz, 320MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
  • Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2.3M x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 24x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock4 624
32-Bit Tri-Core
80MHz, 160MHz, 320MHz
CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
DMA, LCD, LVD/HVD, POR, PWM, WDT
-
4MB (4M x 8)
FLASH
-
2.3M x 8
3.15 V ~ 5.5 V
A/D 24x12b
Internal
-40°C ~ 105°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SPC5644BCF0VLU8
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock3 664
32-Bit
120MHz
CANbus, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
1.5MB (1.5M x 8)
FLASH
64K x 8
128K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5746BHK1AMKU6
NXP

SINGLE CORE, 3M FLASH

  • Core Processor: e200z4
  • Core Size: 32-Bit
  • Speed: 160MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, I²S, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 384K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 36x10b, 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock7 248
32-Bit
160MHz
CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
DMA, I²S, POR, WDT
129
3MB (3M x 8)
FLASH
64K x 8
384K x 8
3.15 V ~ 5.5 V
A/D 36x10b, 16x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SPC5746CSK1AMMJ6
NXP

32 BITDUAL CORE3M FLASH384 RA

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock4 144
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
SP5746CHK1AMKU6R
NXP

32 BITDUAL CORE3M FLASH512K R

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock2 304
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
3MB (3M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SAC57D53MCVLTR
NXP

ARM 32-BIT MCU TRIPLE CORE 3MB

  • Core Processor: ARM® Cortex®-A5, -M4, -M0+
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz, 160MHz, 320MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
  • Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2.3M x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 24x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 208-LQFP Exposed Pad
  • Supplier Device Package: 208-LQFP (28x28)
paquet: 208-LQFP Exposed Pad
Stock4 992
32-Bit Tri-Core
80MHz, 160MHz, 320MHz
CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
DMA, LCD, LVD/HVD, POR, PWM, WDT
-
3MB (3M x 8)
FLASH
-
2.3M x 8
3.15 V ~ 5.5 V
A/D 24x12b
Internal
-40°C ~ 105°C (TA)
-
208-LQFP Exposed Pad
208-LQFP (28x28)