Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 144-LQFP |
Stock2 576 |
|
32-Bit | 60MHz | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 80 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 64-LQFP |
Stock4 480 |
|
32-Bit | 64MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, WDT | 39 | 512KB (512K x 8) | FLASH | 64K x 8 | 96K x 8 | 3 V ~ 3.6 V | A/D 4x10b | Internal | -40°C ~ 125°C (TA) | - | 64-LQFP | 64-LQFP (10x10) |
||
NXP |
16-BIT MCU S12X CORE 384KB FLA
|
paquet: 112-LQFP |
Stock3 248 |
|
16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 91 | 384KB (384K x 8) | FLASH | 4K x 8 | 20K x 8 | 3.15 V ~ 5.5 V | A/D 16x12b | External | -40°C ~ 125°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 257-LFBGA |
Stock7 648 |
|
32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 257-LFBGA |
Stock6 544 |
|
32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
SINGLE CORE 3M FLASH 384K RAM
|
paquet: 176-LQFP Exposed Pad |
Stock4 512 |
|
32-Bit | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 129 | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
SINGLE CORE 3M FLASH
|
paquet: 100-LBGA |
Stock5 408 |
|
32-Bit | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | 100-LBGA | 100-MAPBGA (11x11) |
||
NXP |
32 BIT SINGLE CORE 3M FLASH 3
|
paquet: 176-LQFP Exposed Pad |
Stock5 664 |
|
32-Bit | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 129 | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
SINGLE CORE 3M FLASH 384K RAM
|
paquet: 176-LQFP Exposed Pad |
Stock7 920 |
|
32-Bit | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 129 | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
912XDP512J1 GENERAL
|
paquet: 112-LQFP |
Stock6 272 |
|
16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 91 | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b, 16x10b | External | -40°C ~ 105°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
32BIT 512K FLASH 48K RAM
|
paquet: 144-LQFP |
Stock4 384 |
|
32-Bit | 64MHz | CANbus, I²C, LINbus, QSPI, SCI, SPI | DMA, LCD, POR, PWM, WDT | 105 | 512KB (512K x 8) | FLASH | 64K x 8 | 48K x 8 | 3 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 85°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
16-BIT MCU S12X CORE 512KB FLA
|
paquet: 112-LQFP |
Stock5 024 |
|
16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 91 | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b, 16x10b | External | -40°C ~ 125°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
16-BIT MCU S12X CORE 768KB FLA
|
paquet: 144-LQFP |
Stock6 064 |
|
16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 119 | 768KB (768K x 8) | FLASH | 4K x 8 | 48K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | External | -40°C ~ 85°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
DUAL CORE 1.5M FLASH
|
paquet: 176-LQFP Exposed Pad |
Stock6 992 |
|
32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
SINGLE CORE, 1.5M FLASH
|
paquet: 176-LQFP Exposed Pad |
Stock3 952 |
|
32-Bit | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
SINGLE CORE 3M FLASH
|
paquet: 100-LBGA |
Stock3 152 |
|
32-Bit | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | - | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | 100-LBGA | 100-MAPBGA (11x11) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 176-LQFP |
Stock7 008 |
|
32-Bit | 64MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 149 | 768KB (768K x 8) | FLASH | 64K x 8 | 64K x 8 | 3 V ~ 5.5 V | A/D 29x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 257-LFBGA |
Stock5 104 |
|
32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 257-LFBGA |
Stock6 240 |
|
32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 176-LQFP |
Stock2 400 |
|
32-Bit | 64MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 149 | 1MB (1M x 8) | FLASH | 64K x 8 | 80K x 8 | 3 V ~ 5.5 V | A/D 29x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 144-LQFP |
Stock6 480 |
|
32-Bit | 64MHz | CANbus, I²C, LINbus, QSPI, SCI, SPI | DMA, LCD, POR, PWM, WDT | 108 | 1MB (1M x 8) | FLASH | 64K x 8 | 48K x 8 | 3 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
paquet: 144-LQFP |
Stock2 256 |
|
32-Bit Dual-Core | 66MHz | CANbus, EBI/EMI, I²C, SCI, SPI | DMA, POR, PWM, WDT | 111 | 512KB (512K x 8) | FLASH | - | 32K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 144-LQFP |
Stock7 392 |
|
32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
paquet: 144-LQFP |
Stock5 504 |
|
32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3 V ~ 5.5 V | A/D 32x12b | Internal | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
16-BIT MCU S12X CORE 512KB FLA
|
paquet: 144-LQFP |
Stock4 720 |
|
16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 119 | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b, 16x10b | External | -40°C ~ 85°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
16-BIT MCU S12X CORE 512KB FLA
|
paquet: 144-LQFP |
Stock6 304 |
|
16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 119 | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b, 16x10b | External | -40°C ~ 105°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
SINGLE CORE, 1.5M FLASH
|
paquet: 176-LQFP Exposed Pad |
Stock2 080 |
|
32-Bit | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 129 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
8-BIT MCU HC08 CORE 8MHZ 60KB
|
paquet: 64-QFP |
Stock2 752 |
|
8-Bit | 8MHz | CANbus, SCI, SPI | LVD, POR, PWM | 52 | 60KB (60K x 8) | FLASH | 1K x 8 | 2K x 8 | 4.5 V ~ 5.5 V | A/D 15x8b | Internal | -40°C ~ 105°C (TA) | - | 64-QFP | 64-QFP (14x14) |