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Produits Epson Electronics America Inc-Semiconductor Div

Dossiers 203
Page  8/8
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S1F81150F0A2000
Epson Electronics America Inc-Semiconductor Div

IC REG HEX BUCK/LINEAR 16TSSOP

  • Topology: Step-Down (Buck) (5), Linear (LDO) (1)
  • Function: Any Function
  • Number of Outputs: 6
  • Frequency - Switching: -
  • Voltage/Current - Output 1: Controller
  • Voltage/Current - Output 2: Controller
  • Voltage/Current - Output 3: Controller
  • w/LED Driver: No
  • w/Supervisor: No
  • w/Sequencer: No
  • Voltage - Supply: 2.9 V ~ 4.5 V
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-QFP (7x7)
paquet: 48-LQFP
Stock3 520
S1D15711D00B000
Epson Electronics America Inc-Semiconductor Div

IC DRIVER LCD

  • Type: Display Driver
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: Die
  • Supplier Device Package: Chip
paquet: Die
Stock3 664
S1R72005F00A100
Epson Electronics America Inc-Semiconductor Div

IC CTRLR/PHY USB OTG 64-QFP

  • Protocol: -
  • Function: -
  • Interface: -
  • Standards: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Operating Temperature: -
  • Package / Case: 64-QFP
  • Supplier Device Package: -
paquet: 64-QFP
Stock3 840
S1R72U16B08E200
Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 81BGA

  • Protocol: USB
  • Function: Host Controller
  • Interface: USB
  • Standards: USB 2.0
  • Voltage - Supply: 1.8V, 3.3V
  • Current - Supply: 65mA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 81-TFBGA
  • Supplier Device Package: 81-FBGA (8x8)
paquet: 81-TFBGA
Stock2 960
S1R72V27B05H100
Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 81BGA

  • Protocol: USB
  • Function: Host Controller
  • Interface: USB
  • Standards: USB 2.0
  • Voltage - Supply: 1.8V, 3.3V
  • Current - Supply: 40.2mA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 60-TFBGA
  • Supplier Device Package: 60-FBGA (5x5)
paquet: 60-TFBGA
Stock5 568
S1R72V27B08H100
Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 60BGA

  • Protocol: USB
  • Function: Host Controller
  • Interface: USB
  • Standards: USB 2.0
  • Voltage - Supply: 1.8V, 3.3V
  • Current - Supply: 40.2mA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 81-TFBGA
  • Supplier Device Package: 81-FBGA (8x8)
paquet: 81-TFBGA
Stock6 592
S1R72V17B00A200
Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 60BGA

  • Protocol: USB
  • Function: Host Controller
  • Interface: USB
  • Standards: USB 2.0
  • Voltage - Supply: 1.8V, 3.3V
  • Current - Supply: 39.3mA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 60-TFBGA
  • Supplier Device Package: 60-FBGA (5x5)
paquet: 60-TFBGA
Stock5 808
S1C17702F101100
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 128KB FLASH 176QFP

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 8.2MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: LCD, PWM, WDT
  • Number of I/O: 28
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 12K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -20°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: -
paquet: 176-LQFP
Stock7 424
S1C17704B402100
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 161VFBGA

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 8.2MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: LCD, PWM, WDT
  • Number of I/O: 28
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -20°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 161-VFBGA
  • Supplier Device Package: 161-VFBGA (7x7)
paquet: 161-VFBGA
Stock2 912
S1C17W23F101100
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 96KB FLASH 128TQFP

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 4.2MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: LCD, PWM, RFC, WDT
  • Number of I/O: 41
  • Program Memory Size: 96KB (96K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 128-TQFP
  • Supplier Device Package: 128-TQFP (14x14)
paquet: 128-TQFP
Stock6 016
S1C17F57D00E200
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH DIE

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 4.2MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: PWM, WDT
  • Number of I/O: 29
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: Die
  • Supplier Device Package: -
paquet: Die
Stock5 888
S1C31W74B201000
Epson Electronics America Inc-Semiconductor Div

32-BIT SNGL CHIP MICROCONTROLLER

  • Core Processor: ARM? Cortex?-M0+
  • Core Size: 32-Bit
  • Speed: 21MHz
  • Connectivity: I2C, IrDA, QSPI, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
  • Number of I/O: 71
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 181-VFBGA
  • Supplier Device Package: 181-VFBGA (8x8)
paquet: 181-VFBGA
Stock7 456
S1C17W14F102100-90
Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 48KB FLASH 4KB

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 056
S1C17W14F102100
Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 48KB FLASH 4KB

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock6 704
S1C17W18F103100
Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 128KB FLASH 8K

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 440
S1C17W15F005100
Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock2 192
S1C17W03F102100-490
Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ16KB FLASH 2KB

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 136
S1C17M13F101100-250
Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 16.8MHZ16KB FLASH 2K

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 744
S1D13A04B00B200-240
Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 160KB SR

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 121-TFBGA
  • Supplier Device Package: 121-PFBGA (10x10)
paquet: 121-TFBGA
Stock5 504
S1D13A04F00A100-90
Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 160KB SR

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 128-TQFP
  • Supplier Device Package: 128-TQFP15 (14x14)
paquet: 128-TQFP
Stock5 280
S1D13L02F00A100-36
Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 1024KB S

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 208-LQFP
  • Supplier Device Package: 208-QFP22 (28x28)
paquet: 208-LQFP
Stock2 640
S1D13746F01A600-90
Epson Electronics America Inc-Semiconductor Div

TV OUT CONTROLLER; 312KB SRAM+ A

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 128-LQFP
  • Supplier Device Package: 128-QFP15 (14x14)
paquet: 128-LQFP
Stock3 104
S1D13781F00A100-90
Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 384KB SR

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-QFP15 (14x14)
paquet: 100-LQFP
Stock2 512
S1D13746B01B600-416
Epson Electronics America Inc-Semiconductor Div

TV OUT CONTROLLER; 312KB SRAM+ A

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 160-TFBGA
  • Supplier Device Package: 100-PFBGA (7x7)
paquet: 160-TFBGA
Stock2 928
S1D13U11F00A100
Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 16MB EXTERN

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-QFP20 (20x20)
paquet: 144-LQFP
Stock4 064
S1D13L01F00A100-90
Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 384KB SR

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 128-LQFP
  • Supplier Device Package: 128-QFP15 (14x14)
paquet: 128-LQFP
Stock3 424
hot S1D13A04F00A100
Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128TQFP

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 128-TQFP
  • Supplier Device Package: 128-TQFP (14x14)
paquet: 128-TQFP
Stock7 968
S1C17M22F001100
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 16KB FLASH 48TQFP12

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 21MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
  • Number of I/O: 39
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
  • Data Converters: A/D 8x12b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-TQFP
  • Supplier Device Package: 48-TQFP12 (7x7)
paquet: -
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