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Produits Epson Electronics America Inc-Semiconductor Div

Dossiers 203
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S1F75540F5A0000
Epson Electronics America Inc-Semiconductor Div

IC DC/DC CONV W/VOLT REG 64-QFN

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 64-QFN
  • Supplier Device Package: -
paquet: 64-QFN
Stock5 952
S1F77603Y0A000L
Epson Electronics America Inc-Semiconductor Div

IC BATTERY LEAK PREVENTION SOT89

  • Function: -
  • Battery Chemistry: -
  • Number of Cells: -
  • Fault Protection: -
  • Interface: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: SOT-89-3
paquet: -
Stock3 104
S1D13709F00A100
Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 80TQFP

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 80-TQFP
  • Supplier Device Package: 80-TQFP (12x12)
paquet: 80-TQFP
Stock2 224
S2D13782F00A100
Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 100BFQFP

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 100-BFQFP
  • Supplier Device Package: 100-QFP (14x14)
paquet: 100-BFQFP
Stock4 608
S1D13L01F00A100
Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128QFP

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 128-LQFP
  • Supplier Device Package: 128-QFP (14x14)
paquet: 128-LQFP
Stock6 384
hot S1D13706F00A200
Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 100TQFP

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP
paquet: 100-TQFP
Stock15 432
hot S1D13781F00A100
Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 100LQFP

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-QFP15 (14x14)
paquet: 100-LQFP
Stock8 280
S1R72C05B08E100
Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 121BGA

  • Protocol: USB
  • Function: Host Controller
  • Interface: USB
  • Standards: USB 2.0
  • Voltage - Supply: 1.8V, 3.3V
  • Current - Supply: 75mA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 121-TFBGA
  • Supplier Device Package: 121-TFBGA (8x8)
paquet: 121-TFBGA
Stock3 472
S1R72C05F15E100
Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 128QFP

  • Protocol: USB
  • Function: Host Controller
  • Interface: USB
  • Standards: USB 2.0
  • Voltage - Supply: 1.8V, 3.3V
  • Current - Supply: 75mA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 128-LQFP
  • Supplier Device Package: 128-LQFP (14x14)
paquet: 128-LQFP
Stock6 560
S1C17W22F00B100
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 128TQFP

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 4.2MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: LCD, PWM, RFC, WDT
  • Number of I/O: 41
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 128-TQFP
  • Supplier Device Package: -
paquet: 128-TQFP
Stock2 864
S1C17704F101100
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 144TQFP

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 8.2MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: LCD, PWM, WDT
  • Number of I/O: 28
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -20°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 144-TQFP
  • Supplier Device Package: -
paquet: 144-TQFP
Stock5 088
S1C17W22F101100
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 128TQFP

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 4.2MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: LCD, PWM, RFC, WDT
  • Number of I/O: 41
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 128-TQFP
  • Supplier Device Package: 128-TQFP (14x14)
paquet: 128-TQFP
Stock5 296
S1C17W22D101100
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH DIE

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 4.2MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: LCD, PWM, RFC, WDT
  • Number of I/O: 41
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: Die
  • Supplier Device Package: Die
paquet: Die
Stock5 424
hot S1V3G340F00A900
Epson Electronics America Inc-Semiconductor Div

OSC TEXT TO SPEECH LSI 52QFP

  • Function: Voice Processor
  • Applications: Signal Mixing
  • Number of Channels: 1
  • Interface: SPI
  • Voltage - Supply: 2.2 V ~ 5.5 V
  • Operating Temperature: -
  • Specifications: -
  • Package / Case: 52-LQFP
  • Supplier Device Package: 52-QFP (10x10)
paquet: 52-LQFP
Stock4 960
S7U4E0020030000
Epson Electronics America Inc-Semiconductor Div

MICRO GPS EVALUATION MODULE

  • Type: GPS Receiver
  • Frequency: 1575MHz
  • For Use With/Related Products: -
  • Supplied Contents: Module
paquet: -
Stock3 780
S1C31W74B201000-348
Epson Electronics America Inc-Semiconductor Div

32BIT-MCU ARM CORETEX M0+ 21.7MH

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 376
S1C17W15F005100-160
Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock2 288
S1C17W15F004100
Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 264
S1C17W13F001100
Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 48KB FLASH 2KB

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock4 960
S1C17M10F101100
Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 16MHZ 64KB FLASH 4K R

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 968
S2D13515F00A100-36
Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER FOR AUTOMOTIVE UP

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 256-LQFP
  • Supplier Device Package: 256-QFP22 (28x28)
paquet: 256-LQFP
Stock7 648
S1D13513F01A100-36
Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 16MB EXTERN

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 208-LQFP
  • Supplier Device Package: 208-QFP22 (28x28)
paquet: 208-LQFP
Stock4 800
S1D13709F00A100-119
Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 32KB SRA

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 80-TQFP
  • Supplier Device Package: 80-TQFP14 (12x12)
paquet: 80-TQFP
Stock2 976
S1D13517F00A100-90
Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 16MB SDRAM

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 128-LQFP
  • Supplier Device Package: 128-QFP15 (14x14)
paquet: 128-LQFP
Stock4 592
S1C17F63F101100-90
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 100QFP15

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 16.8MHz
  • Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
  • Number of I/O: 17
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
  • Data Converters: A/D 7x12b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-QFP15 (14x14)
paquet: -
Request a Quote
S1C17M25F001100-250
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 48TQFP12

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 21MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
  • Number of I/O: 39
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
  • Data Converters: A/D 8x12b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-TQFP
  • Supplier Device Package: 48-TQFP12 (7x7)
paquet: -
Request a Quote
S1C17M22F001100-250
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 16KB FLASH 48TQFP12

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 21MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
  • Number of I/O: 39
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
  • Data Converters: A/D 8x12b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-TQFP
  • Supplier Device Package: 48-TQFP12 (7x7)
paquet: -
Request a Quote
S1S60000F00A500
Epson Electronics America Inc-Semiconductor Div

IC NETWORK CONTROLLER

  • Protocol: -
  • Function: -
  • Interface: -
  • Standards: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote