Page 47 - Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs | Circuits intégrés (CI) | Heisener Electronics
Contactez nous
SalesDept@heisener.com 86-755-83210559-843
Connexion/S'inscrire
Language Translation

* Please refer to the English Version as our Official Version.

BOM
Chariot 0

Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs

Dossiers 1 650
Page  47/59
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
100-1214-1
Bluetechnix GmbH

MODULE ECM-BF561-C-C-Q25S128F32

  • Module/Board Type: MPU Core
  • Core Processor: CM-BF561 (Dual Core)
  • Co-Processor: -
  • Speed: 600MHz x 2
  • Flash Size: 32MB
  • RAM Size: 128KB
  • Connector Type: Expansion 2 x 100
  • Size / Dimension: 1.73" x 1.3" (44mm x 33mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock4 352
CM-BF561 (Dual Core)
-
600MHz x 2
32MB
128KB
Expansion 2 x 100
1.73" x 1.3" (44mm x 33mm)
0°C ~ 70°C
SOMDM3730-30-2780AKCR
Logic

SYSTEM ON MODULE TORP+ DM3730

  • Module/Board Type: MPU, DSP Core
  • Core Processor: ARM? Cortex?-A8, DM3730
  • Co-Processor: TMS320C64x (DSP)
  • Speed: 1GHz
  • Flash Size: 512MB
  • RAM Size: 256MB
  • Connector Type: Board-to-Board (BTB) Socket - 200
  • Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock4 384
ARM? Cortex?-A8, DM3730
TMS320C64x (DSP)
1GHz
512MB
256MB
Board-to-Board (BTB) Socket - 200
0.59" x 1.3" (15mm x 33mm)
0°C ~ 70°C
DC-ME-Y413-C
Digi International

MOD ME 9210 16MB SDRAM 8MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9210
  • Co-Processor: -
  • Speed: 75MHz
  • Flash Size: 16MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 80°C
paquet: -
Stock2 400
ARM926EJ-S, NS9210
-
75MHz
16MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 80°C
SOMOMAP3530-10-1670EFCR
Logic

SYSTEM ON MODULE LV OMAP3530

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, OMAP3503
  • Co-Processor: -
  • Speed: 600MHz
  • Flash Size: 256MB
  • RAM Size: 128MB
  • Connector Type: Board-to-Board (BTB) Socket - 480
  • Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock7 456
ARM? Cortex?-A8, OMAP3503
-
600MHz
256MB
128MB
Board-to-Board (BTB) Socket - 480
1.23" x 3.01" (31.2mm x 76.5mm)
0°C ~ 70°C
20-101-1217
Digi International

MODULE RABBITCORE RCM3229

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 44.2MHz
  • Flash Size: 512KB
  • RAM Size: 768KB
  • Connector Type: 2 IDC Headers 2x17
  • Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock3 952
Rabbit 3000
-
44.2MHz
512KB
768KB
2 IDC Headers 2x17
1.85" x 2.73" (47mm x 69mm)
-40°C ~ 85°C
101-1055
Digi International

MODULE RABBIT CORE RCM3375

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 44.2MHz
  • Flash Size: 512KB (Internal), 32MB (External)
  • RAM Size: 1MB
  • Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card
  • Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock6 464
Rabbit 3000
-
44.2MHz
512KB (Internal), 32MB (External)
1MB
2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card
1.85" x 2.73" (47mm x 69mm)
0°C ~ 70°C
DC-EM-02T-NS-25
Digi International

EM 8MB SDRAM 4MB FLASH 25 PAK

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 4MB
  • RAM Size: 8MB
  • Connector Type: Pin Header
  • Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock5 344
ARM7TDMI, NS7520
-
55MHz
4MB
8MB
Pin Header
1.94" x 1.58" (49.2mm x 40.0mm)
-40°C ~ 85°C
CC-MX-KD69-ZM-B
Digi International

MOD I.MX53 1GHZ 512MB FLASH 25PK

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, i.MX53
  • Co-Processor: -
  • Speed: 1GHz
  • Flash Size: 512MB
  • RAM Size: 512MB
  • Connector Type: Board-to-Board (BTB) Socket - 360
  • Size / Dimension: 3.23" x 1.97" (82mm x 50mm
  • Operating Temperature: -20°C ~ 85°C
paquet: -
Stock6 176
ARM? Cortex?-A8, i.MX53
-
1GHz
512MB
512MB
Board-to-Board (BTB) Socket - 360
3.23" x 1.97" (82mm x 50mm
-20°C ~ 85°C
CC-7U-Z111-Z1-B
Digi International

UMOD CONNECT 7U 16MB SDRAM 25PK

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 2MB
  • RAM Size: 16MB
  • Connector Type: 48-DIP
  • Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock2 400
ARM7TDMI, NS7520
-
55MHz
2MB
16MB
48-DIP
2.48" x 0.73" (62.9mm x 18.5mm)
0°C ~ 70°C
3354-HX-X38-RC
Critical Link LLC

MOD MITYSOM-3354 W/ AM3354

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, AM3354
  • Co-Processor: NEON SIMD
  • Speed: 800MHz
  • Flash Size: 512MB
  • RAM Size: 512MB
  • Connector Type: SO-DIMM-204
  • Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock2 096
ARM? Cortex?-A8, AM3354
NEON SIMD
800MHz
512MB
512MB
SO-DIMM-204
2.66" x 1.5" (67.6mm x 38.1mm)
0°C ~ 70°C
TE0745-02-35-1C
Trenz Electronic GmbH

SOM MIT XILINX ZYNQ XC7Z035-1FBG

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM? Cortex?-A9
  • Co-Processor: Zynq-7000 (Z-7035)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec UFPS
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock7 456
ARM? Cortex?-A9
Zynq-7000 (Z-7035)
-
32MB
1GB
Samtec UFPS
2.05" x 2.99" (52mm x 76mm)
0°C ~ 70°C
DC-ME-Y401-C
Digi International

ENCRYPTION ENGINE 10/100 INT

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9210
  • Co-Processor: -
  • Speed: 75MHz
  • Flash Size: 2MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 80°C
paquet: -
Stock7 072
ARM926EJ-S, NS9210
-
75MHz
2MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 80°C
DLP-232PC
DLP Design Inc.

MODULE USB-MCU FT232R W/18F2410

  • Module/Board Type: MCU, USB Core
  • Core Processor: PIC18F2410
  • Co-Processor: FT232R
  • Speed: 25MHz
  • Flash Size: 16KB
  • RAM Size: 768B
  • Connector Type: USB - B, Pin Header
  • Size / Dimension: 1.37" x 0.6" (34.8mm x 15.2mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock4 448
PIC18F2410
FT232R
25MHz
16KB
768B
USB - B, Pin Header
1.37" x 0.6" (34.8mm x 15.2mm)
0°C ~ 70°C
20-101-1321
Digi International

MODULE MINICORE RCM6760

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 6000
  • Co-Processor: -
  • Speed: 162.5MHz
  • Flash Size: 4MB
  • RAM Size: 1.032MB (Internal), 1MB (External)
  • Connector Type: Edge Connector - 52
  • Size / Dimension: 1.2" x 2" (30mm x 51mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock11 304
Rabbit 6000
-
162.5MHz
4MB
1.032MB (Internal), 1MB (External)
Edge Connector - 52
1.2" x 2" (30mm x 51mm)
-40°C ~ 85°C
DC-ME-01T-S
Digi International

ME 8MB SDRAM 2MB FLASH SINGLE

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 2MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock8 292
ARM7TDMI, NS7520
-
55MHz
2MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 85°C
TE0745-02-30-2I
Trenz Electronic GmbH

SOM DDR3

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock4 160
-
-
-
-
-
-
-
-
TE0820-02-02CG-1EA
Trenz Electronic GmbH

SOM USCALE+ XCZU2CG-1S 1GB DDR4

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock5 856
-
-
-
-
-
-
-
-
IW-G30M-C7EV-4E004G-E008G-BEA
iWave Systems

ZYNQ ULTRASCALE+ ZU7EV MPSOC SOM

  • Module/Board Type: -
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5, ARM Mali 400 MP2, ZU7EV
  • Co-Processor: -
  • Speed: 1.5GHz
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: 3.740" x 2.950" (94.99mm x 74.93mm)
  • Operating Temperature: -20°C ~ 85°C
paquet: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5, ARM Mali 400 MP2, ZU7EV
-
1.5GHz
-
-
-
3.740" x 2.950" (94.99mm x 74.93mm)
-20°C ~ 85°C
ME-XU9-4CG-1E-D11E-R2-1
Enclustra FPGA Solutions

SOM XU9 ZYNQ 4CG REV2.1

  • Module/Board Type: FPGA
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: -
  • Speed: 533MHz, 1.333GHz
  • Flash Size: 16GB
  • RAM Size: 4GB
  • Connector Type: 168 Pin
  • Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
-
533MHz, 1.333GHz
16GB
4GB
168 Pin
2.910" L x 2.130" W (74.00mm x 54.00mm)
0°C ~ 85°C
MYC-C7Z010-V2-4E1D-667-I
MYIR Tech Limited

System-On-Module, Zynq-7010

  • Module/Board Type: MPU, FPGA
  • Core Processor: ARM® Cortex®-A9
  • Co-Processor: Zynq-7000 (Z-7010)
  • Speed: 866MHz
  • Flash Size: 4GB eMMC, 32MB QSPI
  • RAM Size: 1GB
  • Connector Type: Pin(s)
  • Size / Dimension: 2.953" L x 2.165" W (75.00mm x 55.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM® Cortex®-A9
Zynq-7000 (Z-7010)
866MHz
4GB eMMC, 32MB QSPI
1GB
Pin(s)
2.953" L x 2.165" W (75.00mm x 55.00mm)
-40°C ~ 85°C
TE0600-03-52I11-W
Trenz Electronic GmbH

IC MODULE GIGABEE

  • Module/Board Type: FPGA Core
  • Core Processor: Spartan-6 LX-45
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 256MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
Spartan-6 LX-45
-
125MHz
16MB
256MB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
20-101-1142
Digi

20-101-1142

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 4000
  • Co-Processor: -
  • Speed: 58.98MHz
  • Flash Size: 4MB
  • RAM Size: 512KB
  • Connector Type: Header
  • Size / Dimension: 1.850" L x 2.840" W (47.00mm x 72.00mm)
  • Operating Temperature: -20°C ~ 85°C
paquet: -
Request a Quote
Rabbit 4000
-
58.98MHz
4MB
512KB
Header
1.850" L x 2.840" W (47.00mm x 72.00mm)
-20°C ~ 85°C
MYS-7Z010-V2-0E1D-667-C-S
MYIR Tech Limited

Zynq-7010 SBC, Z-turn Board V2

  • Module/Board Type: MPU, FPGA
  • Core Processor: ARM® Cortex®-A9
  • Co-Processor: -
  • Speed: 667MHz
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: 4.016" x 2.480" (102.00mm x 63.00mm)
  • Operating Temperature: -
paquet: -
Request a Quote
ARM® Cortex®-A9
-
667MHz
-
-
-
4.016" x 2.480" (102.00mm x 63.00mm)
-
TE0813-01-4DE11-AZ
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Request a Quote
-
-
-
-
-
-
-
-
TE0813-02-4DE81-A
Trenz Electronic GmbH

TE0813-02-4DE81-A STARTER KIT

  • Module/Board Type: FPGA
  • Core Processor: Zynq™ UltraScale+™ ZU4EV
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: BGA
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Request a Quote
Zynq™ UltraScale+™ ZU4EV
-
-
128MB
4GB
BGA
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
ME-XU1-9EG-2I-D12E-R4-2
Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU9EG

  • Module/Board Type: FPGA
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: -
  • Speed: 600MHz, 1.5GHz
  • Flash Size: 16GB
  • RAM Size: 4GB
  • Connector Type: 168 Pin
  • Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
-
600MHz, 1.5GHz
16GB
4GB
168 Pin
2.910" L x 2.130" W (74.00mm x 54.00mm)
-40°C ~ 85°C
TE0729-02-62I63FAK
Trenz Electronic GmbH

IC SOC MODULE ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 512MB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7020)
-
32MB
512MB
B2B
2.050" L x 2.990" W (52.00mm x 76.00mm)
-40°C ~ 85°C
TE0808-05-6BE81-AK
Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Request a Quote
-
-
-
-
-
-
-
-