Page 46 - Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs | Circuits intégrés (CI) | Heisener Electronics
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Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs

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Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
SOMOMAP3503-21-1670AGCR
Logic

SYSTEM ON MODULE LV OMAP3503

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, OMAP3503
  • Co-Processor: -
  • Speed: 600MHz
  • Flash Size: 256MB
  • RAM Size: 128MB
  • Connector Type: Board-to-Board (BTB) Socket - 200
  • Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock7 680
ARM? Cortex?-A8, OMAP3503
-
600MHz
256MB
128MB
Board-to-Board (BTB) Socket - 200
0.59" x 1.06" (15mm x 27mm)
0°C ~ 70°C
CENGPXA270-520-10-550HCR
Logic

CARD ENGINE 64MB SDRAM

  • Module/Board Type: MCU Core
  • Core Processor: PXA270
  • Co-Processor: -
  • Speed: 520MHz
  • Flash Size: 32MB
  • RAM Size: 64MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock6 320
PXA270
-
520MHz
32MB
64MB
SO-DIMM-144
2.37" x 2.67" (60.2mm x 67.8mm)
0°C ~ 70°C
101-0518
Digi International

MODULE RABBITCORE RCM3110

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 29.4MHz
  • Flash Size: 256KB
  • RAM Size: 128KB
  • Connector Type: 2 IDC Headers 2x17
  • Size / Dimension: 1.85" x 1.65" (47mm x 42mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock4 944
Rabbit 3000
-
29.4MHz
256KB
128KB
2 IDC Headers 2x17
1.85" x 1.65" (47mm x 42mm)
-40°C ~ 85°C
101-0507
Digi International

MODULE RABBITCORE RCM3000

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 30MHz
  • Flash Size: 256KB
  • RAM Size: 128KB
  • Connector Type: 2 IDC Headers 2x17
  • Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
  • Operating Temperature: -40°C ~ 70°C
paquet: -
Stock6 976
Rabbit 3000
-
30MHz
256KB
128KB
2 IDC Headers 2x17
1.85" x 2.73" (47mm x 69mm)
-40°C ~ 70°C
TE0720-03-L1IF
Trenz Electronic GmbH

SOM SOC 7Z020-L1CLG484I 512MB L

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock6 528
ARM Cortex-A9
Zynq-7000 (Z-7020)
-
32MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
-40°C ~ 85°C
TE0720-03-2IFC3
Trenz Electronic GmbH

SOM SOC 7Z020-2CLG484I 1GB LOPRO

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock6 304
ARM Cortex-A9
Zynq-7000 (Z-7020)
-
32MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
-40°C ~ 85°C
TE0320-00-EV02I
Trenz Electronic GmbH

SOM SPARTAN-3A 1800K 1333MB DDR

  • Module/Board Type: FPGA, USB Core
  • Core Processor: Spartan-3A DSP
  • Co-Processor: Cypress EZ-USB FX2LP
  • Speed: 100MHz
  • Flash Size: 4MB
  • RAM Size: 128MB
  • Connector Type: B2B
  • Size / Dimension: 2.7" x 1.9" (68mm x 48mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock2 096
Spartan-3A DSP
Cypress EZ-USB FX2LP
100MHz
4MB
128MB
B2B
2.7" x 1.9" (68mm x 48mm)
-40°C ~ 85°C
TE0710-02-100-2CF
Trenz Electronic GmbH

SOM ARTIX-7 100T 512 MBYTE DDR3

  • Module/Board Type: FPGA
  • Core Processor: Artix-7 A100T
  • Co-Processor: -
  • Speed: 100MHz
  • Flash Size: 32MB
  • RAM Size: 512MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock4 864
Artix-7 A100T
-
100MHz
32MB
512MB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
0°C ~ 70°C
DC-ME-01T-MF-VS
Digi International

MOD ME 8MB SDRAM 2MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 2MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock6 784
ARM7TDMI, NS7520
-
55MHz
2MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 85°C
CC-9P-V236-Z1
Digi International

MODULE 9P 64MB SDRAM 64MB FLASH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock6 640
-
-
-
-
-
-
-
-
hot 20-101-0507
Digi International

MODULE RABBITCORE RCM3000

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 30MHz
  • Flash Size: 512KB
  • RAM Size: 512KB
  • Connector Type: 2 IDC Headers 2x17
  • Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
  • Operating Temperature: -40°C ~ 70°C
paquet: -
Stock4 816
Rabbit 3000
-
30MHz
512KB
512KB
2 IDC Headers 2x17
1.85" x 2.73" (47mm x 69mm)
-40°C ~ 70°C
20-101-0383
Digi International

MODULE RABBITCORE RCM2020

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 2000
  • Co-Processor: -
  • Speed: 18.432MHz
  • Flash Size: 256KB
  • RAM Size: 128KB
  • Connector Type: 2 IDC Headers 2x20
  • Size / Dimension: 1.9" x 2.3" (48.3mm x 58.4mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock7 752
Rabbit 2000
-
18.432MHz
256KB
128KB
2 IDC Headers 2x20
1.9" x 2.3" (48.3mm x 58.4mm)
-40°C ~ 85°C
SOMDM3730-11-2783IFCR
Logic

DM3730 SOM-LV TYPE III 256MB LPD

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock7 696
-
-
-
-
-
-
-
-
TE0803-02-04EV-1E3
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Stock3 488
Zynq UltraScale+ XCZU4EV-1SFVC784E
-
-
128MB
2GB
B2B
2.05" x 2.99" (52mm x 76mm)
0°C ~ 85°C
TE0741-05-B2C-1-A
Trenz Electronic GmbH

MODULE FPGA KINTEX

  • Module/Board Type: FPGA
  • Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676C
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Request a Quote
Xilinx Kintex-7 FPGA XC7K160T-2FBG676C
-
-
32MB
-
Board-to-Board (BTB) Socket
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 70°C
ME-XU1-6EG-1I-D11E-R5-0
Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU6EG

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900I
  • Speed: 600MHz, 1.5GHz
  • Flash Size: 16GB
  • RAM Size: 2GB
  • Connector Type: 168 Pin
  • Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900I
600MHz, 1.5GHz
16GB
2GB
168 Pin
2.910" L x 2.130" W (74.00mm x 54.00mm)
-40°C ~ 85°C
TE0823-01-3PIU1MA
Trenz Electronic GmbH

ICOBOARD

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
  • Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 1GB
  • Connector Type: USB
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM Cortex-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
-
128MB
1GB
USB
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
EC-VA-H264-10B-60-4K-OPVIC-0000
System-On-Chip (SOC) Technologies Inc.

ENCODER H264 4K VID/AUD 10BIT

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Request a Quote
-
-
-
-
-
-
-
-
TE0600-04-52I11-A
Trenz Electronic GmbH

IC MODULE GIGABEE

  • Module/Board Type: FPGA
  • Core Processor: Xilinx Spartan™ 6 XC6SLX45-2FGG484I
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 128MB
  • Connector Type: B2B
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
Xilinx Spartan™ 6 XC6SLX45-2FGG484I
-
125MHz
16MB
128MB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
5729-PX-4AA-RI
Critical Link LLC

TEXAS INSTRUMENTS AM5729 SOM (32

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM® Cortex®-A15
  • Co-Processor: -
  • Speed: 1.5GHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310
  • Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM® Cortex®-A15
-
1.5GHz
32MB
1GB
Board-to-Board (BTB) - 100, Edge Connector - 310
3.460" L x 2.730" W (87.88mm x 69.34mm)
-40°C ~ 85°C
TE0727-02-41C34
Trenz Electronic GmbH

ZYNQBERRYZERO MODULE WITH XILINX

  • Module/Board Type: FPGA
  • Core Processor: Zynq™ XC7Z010-1CLG225C
  • Co-Processor: -
  • Speed: -
  • Flash Size: 16MB
  • RAM Size: 512MB
  • Connector Type: USB
  • Size / Dimension: 2.559" L x 1.181" W (65.00mm x 30.00mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Request a Quote
Zynq™ XC7Z010-1CLG225C
-
-
16MB
512MB
USB
2.559" L x 1.181" W (65.00mm x 30.00mm)
0°C ~ 70°C
FORLINX-FET3568-C-202GSE16GCA10
Forlinx Embedded

Rockchip RK3568SOM, 2GB DDR4, 16

  • Module/Board Type: MPU
  • Core Processor: ARM® Cortex®-A55
  • Co-Processor: -
  • Speed: 2.0GHz
  • Flash Size: 16GB eMMC
  • RAM Size: 2GB
  • Connector Type: Board-to-Board (BTB)
  • Size / Dimension: 1.770" L x 2.756" W (45.00mm x 70.00mm)
  • Operating Temperature: 0°C ~ 80°C
paquet: -
Request a Quote
ARM® Cortex®-A55
-
2.0GHz
16GB eMMC
2GB
Board-to-Board (BTB)
1.770" L x 2.756" W (45.00mm x 70.00mm)
0°C ~ 80°C
DC-ME-Y413-AG
Digi

IC

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9210
  • Co-Processor: -
  • Speed: 75MHz
  • Flash Size: 8MB
  • RAM Size: 16MB
  • Connector Type: RJ45
  • Size / Dimension: 1.450" L x 0.750" W (36.70mm x 19.10mm)
  • Operating Temperature: -40°C ~ 75°C
paquet: -
Request a Quote
ARM926EJ-S, NS9210
-
75MHz
8MB
16MB
RJ45
1.450" L x 0.750" W (36.70mm x 19.10mm)
-40°C ~ 75°C
IW-G35M-11EG-4E004G-E008G-BIA
iWave Systems

ZU11EG (-1 speed) MPSoC SOM

  • Module/Board Type: MPU, FPGA
  • Core Processor: ARM® Cortex®-A53 (x4), ARM® Cortex™-M7(x1)
  • Co-Processor: ARM® Mali 400 MP2
  • Speed: 1.5GHz, 600MHz
  • Flash Size: 8GB eMMC
  • RAM Size: 4GB from PS, 4GB from PL
  • Connector Type: 2 x 240 Pin, 2 x 240 Pin
  • Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM® Cortex®-A53 (x4), ARM® Cortex™-M7(x1)
ARM® Mali 400 MP2
1.5GHz, 600MHz
8GB eMMC
4GB from PS, 4GB from PL
2 x 240 Pin, 2 x 240 Pin
4.330" L x 2.950" W (110.00mm x 75.00mm)
-40°C ~ 85°C
TE0782-02-92I33FA
Trenz Electronic GmbH

IC MODULE CORTEX

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7045)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 480
  • Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7045)
-
32MB
1GB
Board-to-Board (BTB) Socket - 480
3.350" L x 3.350" W (85.00mm x 85.00mm)
-40°C ~ 85°C
TE0715-05-51I33-A
Trenz Electronic GmbH

IC SOC MODULE

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7015)
  • Speed: 125MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock36
ARM Cortex-A9
Zynq-7000 (Z-7015)
125MHz
32MB
1GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
SOMIMX8MMQ-11-2AE4SMCR
Beacon EmbeddedWorks

IC MOD I.MX 8M MINI 4GB

  • Module/Board Type: MCU Core
  • Core Processor: ARM® Cortex™-A53, ARM® Cortex™-M4
  • Co-Processor: -
  • Speed: 1.8GHz, 400MHz
  • Flash Size: -
  • RAM Size: 2GB
  • Connector Type: USB
  • Size / Dimension: 1.100" L x 1.500" W (28.00mm x 38.00mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Request a Quote
ARM® Cortex™-A53, ARM® Cortex™-M4
-
1.8GHz, 400MHz
-
2GB
USB
1.100" L x 1.500" W (28.00mm x 38.00mm)
0°C ~ 70°C
EC-V-H264-8B-30-1080-MXC-SL
System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 A200T
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 256KB
  • Connector Type: SO-DIMM-204
  • Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Request a Quote
Artix-7 A200T
-
-
32MB
256KB
SO-DIMM-204
2.700" L x 2.000" W (68.00mm x 51.00mm)
0°C ~ 85°C