Page 50 - Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs | Circuits intégrés (CI)

Référence	Fabricant	Description	paquet	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0741-02-070-2CF	Trenz Electronic GmbH	SOM KINTEX-7 70T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 70T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock2 752	Kintex-7 70T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
20-101-1314	Digi International	MODULE ETHERNET OP7300 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock6 336	-	-	-	-	-	-	-	-
CENGLH7A400-10-503HC-B	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A400 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock2 560	ARM922T, LH7A400	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CC-MX-PF47-ZK-B	Digi International	MOD WI-IMX287 128M FLASH 25/PK Module/Board Type: MPU Core Core Processor: ARM926EJ-S i.mx287 Co-Processor: - Speed: 454MHz Flash Size: 128MB RAM Size: 128MB Connector Type: Edge Connector - 52 Size / Dimension: 2" x 1.38" (51mm x 35mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock4 832	ARM926EJ-S i.mx287	-	454MHz	128MB	128MB	Edge Connector - 52	2" x 1.38" (51mm x 35mm)	-40°C ~ 85°C
TE0712-02-100-1I	Trenz Electronic GmbH	SOM ARTIX-7 XC7A100T-1I 1GB DDR3 Module/Board Type: FPGA Core Processor: Artix-7 A100T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock5 328	Artix-7 A100T	-	200MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
CC-9C-V212-Z1	Digi International	MODULE 9C 16MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 4MB RAM Size: 16MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock2 768	ARM926EJ-S, NS9360	-	155MHz	4MB	16MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
CC-MX-L76C-Z1-1	Digi International	MOD WI-I.MX6 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A9, i.MX6DualLite Co-Processor: - Speed: 800MHz Flash Size: 4GB RAM Size: 512MB Connector Type: - Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock7 872	ARM? Cortex?-A9, i.MX6DualLite	-	800MHz	4GB	512MB	-	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
DC-ME4-01T-C	Digi International	MODULE ME 8MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: - Operating Temperature: -40°C ~ 85°C	paquet: -	Stock7 552	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	-	-40°C ~ 85°C
SOMAM3517-10-1780FJCR	Logic	IC SOM AM3517 MODULE Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3517 Co-Processor: - Speed: 600MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 300 Size / Dimension: 1.61" x 2.02" (40.9mm x 51.2mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock6 960	ARM? Cortex?-A8, AM3517	-	600MHz	512MB	256MB	Board-to-Board (BTB) Socket - 300	1.61" x 2.02" (40.9mm x 51.2mm)	0°C ~ 70°C
20-101-1179	Digi International	MODULE RABBITCORE RCM3209 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB RAM Size: 768KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock19 632	Rabbit 3000	-	44.2MHz	512KB	768KB	2 IDC Headers 2x17	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 85°C
SOMDM3730-11-1783IFXR	Logic	DM3730 SOM-LV TYPE III 256MB LPD Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock4 976	-	-	-	-	-	-	-	-
TE0841-02-41I21-A	Trenz Electronic GmbH	MOD SOM USCALE 2GB DDR4 Module/Board Type: MCU, FPGA Core Processor: Kintex UltraScale KU40 Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6 560	Kintex UltraScale KU40	-	-	64MB	2GB	B2B	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
DG8065101418900	Intel	INTEL ATOM PROCESSOR Z2580 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
TE0807-03-7DE21-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: 4 x 160 Pin Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	Zynq UltraScale+ XCZU7EV-1FBVB900E	-	-	128MB	4GB	4 x 160 Pin	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0720-04-61C530A	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: Ethernet Core Core Processor: ARM® Cortex®-A9 Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock39	ARM® Cortex®-A9	-	-	32MB	256MB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
20-101-0877	Digi	DEV BOARD RCM330 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
TE0720-03-62I33MA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 8GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	8GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0745-02-72I31-A	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7030)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0808-04-15EG-1EK	Trenz Electronic GmbH	IC MOD SOM MPSOC Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	Zynq UltraScale+ XCZU15EG-1FFVC900E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0820-04-2AI21FA	Trenz Electronic GmbH	MOD MPSOC ZU2CG-1I 2GB DDR4 IND Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	Zynq UltraScale+ XCZU2CG-1SFVC784I	-	-	128MB	2GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0803-03-5DE11-A	Trenz Electronic GmbH	MODULE SOM TE0803-03 Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	Zynq UltraScale+ XCZU5EV-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
OSD32MP153C-512M-IAA	Octavo Systems LLC	SIP: 153C, 512MB, IAA Module/Board Type: MPU Core Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4 Co-Processor: NEON™ SIMD Speed: 650MHz Flash Size: - RAM Size: 512MB Connector Type: 302-BGA Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz	-	512MB	302-BGA	0.710" L x 0.710" W (18.00mm x 18.00mm)	-40°C ~ 85°C
FORLINX-FET3568J-C-182GSE16GIB10	Forlinx Embedded	Rockchip RK3568SOM, 2GB DDR4, 16 Module/Board Type: MPU Core Processor: ARM® Cortex®-A55 Co-Processor: - Speed: 1.8GHz Flash Size: 16GB eMMC RAM Size: 2GB Connector Type: Board-to-Board (BTB) 4 x 80 Pin Size / Dimension: 1.770" L x 2.756" W (45.00mm x 70.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM® Cortex®-A55	-	1.8GHz	16GB eMMC	2GB	Board-to-Board (BTB) 4 x 80 Pin	1.770" L x 2.756" W (45.00mm x 70.00mm)	-40°C ~ 85°C
MAX-10-FPGA	Intel	PROTOTYPE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
TE0803-04-2BE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Stock6	Zynq UltraScale+ XCZU2EG-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0808-04-6BE21-AK	Trenz Electronic GmbH	IC MOD SOM MPSOC 4GB ZU6EG Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	Zynq UltraScale+ XCZU6EG-1FFVC900E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
ME-XU1-15EG-2I-D12E-R4-1	Enclustra FPGA Solutions	SOM ZYNQ US+ ZU15EG 4GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0745-03-71I31-AK	Trenz Electronic GmbH	SOM WITH AMD ZYNQ 7030-1I AND HE Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7030 SoC XC7Z030-1FBG676I Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM Cortex-A9	Xilinx Zynq 7030 SoC XC7Z030-1FBG676I	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C

TE0741-02-070-2CF

Trenz Electronic GmbH

SOM KINTEX-7 70T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 70T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock2 752

Kintex-7 70T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

20-101-1314

Digi International

MODULE ETHERNET OP7300

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock6 336

-

CENGLH7A400-10-503HC-B

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A400
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock2 560

ARM922T, LH7A400

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CC-MX-PF47-ZK-B

Digi International

MOD WI-IMX287 128M FLASH 25/PK

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S i.mx287
Co-Processor: -
Speed: 454MHz
Flash Size: 128MB
RAM Size: 128MB
Connector Type: Edge Connector - 52
Size / Dimension: 2" x 1.38" (51mm x 35mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock4 832

ARM926EJ-S i.mx287

-

454MHz

128MB

Edge Connector - 52

2" x 1.38" (51mm x 35mm)

-40°C ~ 85°C

TE0712-02-100-1I

Trenz Electronic GmbH

SOM ARTIX-7 XC7A100T-1I 1GB DDR3

Module/Board Type: FPGA
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock5 328

Artix-7 A100T

-

200MHz

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

CC-9C-V212-Z1

Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock2 768

ARM926EJ-S, NS9360

-

155MHz

4MB

16MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

CC-MX-L76C-Z1-1

Digi International

MOD WI-I.MX6

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A9, i.MX6DualLite
Co-Processor: -
Speed: 800MHz
Flash Size: 4GB
RAM Size: 512MB
Connector Type: -
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock7 872

ARM? Cortex?-A9, i.MX6DualLite

-

800MHz

4GB

512MB

-

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

DC-ME4-01T-C

Digi International

MODULE ME 8MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock7 552

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

-

-40°C ~ 85°C

SOMAM3517-10-1780FJCR

Logic

IC SOM AM3517 MODULE

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3517
Co-Processor: -
Speed: 600MHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 300
Size / Dimension: 1.61" x 2.02" (40.9mm x 51.2mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock6 960

ARM? Cortex?-A8, AM3517

-

600MHz

512MB

256MB

Board-to-Board (BTB) Socket - 300

1.61" x 2.02" (40.9mm x 51.2mm)

0°C ~ 70°C

20-101-1179

Digi International

MODULE RABBITCORE RCM3209

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB
RAM Size: 768KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock19 632

Rabbit 3000

-

44.2MHz

512KB

768KB

2 IDC Headers 2x17

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 85°C

SOMDM3730-11-1783IFXR

Logic

DM3730 SOM-LV TYPE III 256MB LPD

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock4 976

-

TE0841-02-41I21-A

Trenz Electronic GmbH

MOD SOM USCALE 2GB DDR4

Module/Board Type: MCU, FPGA
Core Processor: Kintex UltraScale KU40
Co-Processor: -
Speed: -
Flash Size: 64MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6 560

Kintex UltraScale KU40

-

64MB

2GB

B2B

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

DG8065101418900

Intel

INTEL ATOM PROCESSOR Z2580

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Request a Quote

-

TE0807-03-7DE21-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: 4 x 160 Pin
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

Request a Quote

Zynq UltraScale+ XCZU7EV-1FBVB900E

-

128MB

4GB

4 x 160 Pin

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0720-04-61C530A

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: Ethernet Core
Core Processor: ARM® Cortex®-A9
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock39

ARM® Cortex®-A9

-

32MB

256MB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

20-101-0877

Digi

DEV BOARD RCM330

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Request a Quote

-

TE0720-03-62I33MA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 8GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

8GB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0745-02-72I31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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ARM Cortex-A9

Zynq-7000 (Z-7030)

-

64MB

1GB

Board-to-Board (BTB) Socket - 480

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0808-04-15EG-1EK

Trenz Electronic GmbH

IC MOD SOM MPSOC

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

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Zynq UltraScale+ XCZU15EG-1FFVC900E

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

TE0820-04-2AI21FA

Trenz Electronic GmbH

MOD MPSOC ZU2CG-1I 2GB DDR4 IND

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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Zynq UltraScale+ XCZU2CG-1SFVC784I

-

128MB

2GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0803-03-5DE11-A

Trenz Electronic GmbH

MODULE SOM TE0803-03

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

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Zynq UltraScale+ XCZU5EV-1SFVC784E

-

128MB

2GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

OSD32MP153C-512M-IAA

Octavo Systems LLC

SIP: 153C, 512MB, IAA

Module/Board Type: MPU Core
Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4
Co-Processor: NEON™ SIMD
Speed: 650MHz
Flash Size: -
RAM Size: 512MB
Connector Type: 302-BGA
Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm)
Operating Temperature: -40°C ~ 85°C

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Arm® Dual Cortex®-A7, Arm® Cortex®-M4

NEON™ SIMD

650MHz

-

512MB

302-BGA

0.710" L x 0.710" W (18.00mm x 18.00mm)

-40°C ~ 85°C

FORLINX-FET3568J-C-182GSE16GIB10

Forlinx Embedded

Rockchip RK3568SOM, 2GB DDR4, 16

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A55
Co-Processor: -
Speed: 1.8GHz
Flash Size: 16GB eMMC
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) 4 x 80 Pin
Size / Dimension: 1.770" L x 2.756" W (45.00mm x 70.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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ARM® Cortex®-A55

-

1.8GHz

16GB eMMC

2GB

Board-to-Board (BTB) 4 x 80 Pin

1.770" L x 2.756" W (45.00mm x 70.00mm)

-40°C ~ 85°C

MAX-10-FPGA

Intel

PROTOTYPE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

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-

TE0803-04-2BE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

Stock6

Zynq UltraScale+ XCZU2EG-1SFVC784E

-

128MB

2GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

TE0808-04-6BE21-AK

Trenz Electronic GmbH

IC MOD SOM MPSOC 4GB ZU6EG

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

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Zynq UltraScale+ XCZU6EG-1FFVC900E

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

ME-XU1-15EG-2I-D12E-R4-1

Enclustra FPGA Solutions

SOM ZYNQ US+ ZU15EG 4GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0745-03-71I31-AK

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7030-1I AND HE

Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7030 SoC XC7Z030-1FBG676I
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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ARM Cortex-A9

Xilinx Zynq 7030 SoC XC7Z030-1FBG676I

-

64MB

1GB

Samtec ST5

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C