Page 45 - Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs | Circuits intégrés (CI)

Référence	Fabricant	Description	paquet	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
SOMOMAP3530-20-1670AGIR	Logic	SYSTEM ON MODULE LV OMAP3530 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, OMAP3530 Co-Processor: - Speed: 600MHz Flash Size: 256MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.06" (15mm x 27mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock3 920	ARM? Cortex?-A8, OMAP3530	-	600MHz	256MB	128MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.06" (15mm x 27mm)	-40°C ~ 85°C
M5485EFE	NXP	MODULE FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5485 Co-Processor: - Speed: 200MHz Flash Size: 2MB (Boot) RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock3 056	ColdFire V4e, MCF5485	-	200MHz	2MB (Boot)	64MB	-	3.7" x 4.5" (93.4mm x 114.3mm)	-40°C ~ 85°C
CENGLH7A400-10-503HCR	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A400 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock5 664	ARM922T, LH7A400	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
30064	Parallax Inc.	STAMP PLC Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock7 552	-	-	-	-	-	-	-	-
BS2SX-IC	Parallax Inc.	BASIC STAMP 2SX MODULE Module/Board Type: MCU Core Core Processor: SX28AC Co-Processor: - Speed: 50MHz Flash Size: 16KB EEPROM RAM Size: 32B Connector Type: - Size / Dimension: 1.2" x 0.6" (30mm x 15mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock4 544	SX28AC	-	50MHz	16KB EEPROM	32B	-	1.2" x 0.6" (30mm x 15mm)	0°C ~ 70°C
TE0782-02-100-2I	Trenz Electronic GmbH	SOM ZYNQ XC7Z100-2I 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7100) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec QTH Size / Dimension: 3.35" x 3.35" (85mm x 85mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6 384	ARM Cortex-A9	Zynq-7000 (Z-7100)	-	32MB	1GB	Samtec QTH	3.35" x 3.35" (85mm x 85mm)	-40°C ~ 85°C
TE0841-01-035-1I	Trenz Electronic GmbH	SOM USCALE XCKU035-1I 1GB DDR4 Module/Board Type: FPGA Core Processor: Kintex UltraScale KU35 Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 4GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock7 744	Kintex UltraScale KU35	-	-	32MB	4GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
CC-MX-LD69-ZM	Digi International	MODULE I.MX53 800MHZ 512MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock6 560	-	-	-	-	-	-	-	-
TE0720-03-1CF	Trenz Electronic GmbH	SOM SOC 7Z020-1CLG484C 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock5 120	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
3354-HX-X38-RI	Critical Link LLC	MITYSOM-3354 W/ AM3354 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3354 Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 512MB RAM Size: 512MB Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6 864	ARM? Cortex?-A8, AM3354	NEON SIMD	800MHz	512MB	512MB	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	-40°C ~ 85°C
TE0741-03-160-2C1	Trenz Electronic GmbH	SOM KINTEX-7 160T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 160T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock3 840	Kintex-7 160T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
CC-MX-LD6A-ZM	Digi International	MOD I.MX53 1GB FLASH 512MB RAM Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, i.MX53 Co-Processor: - Speed: 800MHz Flash Size: 1GB RAM Size: 512MB Connector Type: Board-to-Board (BTB) Socket - 360 Size / Dimension: 3.23" x 1.97" (82mm x 50mm Operating Temperature: -20°C ~ 85°C	paquet: -	Stock5 760	ARM? Cortex?-A8, i.MX53	-	800MHz	1GB	512MB	Board-to-Board (BTB) Socket - 360	3.23" x 1.97" (82mm x 50mm	-20°C ~ 85°C
DC-ME4-01T-S	Digi International	MOD ME 8MB SDRAM 4MB FLASH SGL Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6 096	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
BS2-IC	Parallax Inc.	BASIC STAMP II MODULE Module/Board Type: MCU Core Core Processor: PIC16C57C Co-Processor: - Speed: 20MHz Flash Size: 2KB EEPROM RAM Size: 32B Connector Type: - Size / Dimension: 1.2" x 0.6" (30mm x 15mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock10 224	PIC16C57C	-	20MHz	2KB EEPROM	32B	-	1.2" x 0.6" (30mm x 15mm)	0°C ~ 70°C
DC-ME4-01T-VTY	Digi International	MODULE DIGI CONNECT ME Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6 960	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
DC-ME4-01T-HPA-1	Digi International	MODULE DIGI CONNECT ME Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock7 072	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
TE0720-03-61C33FA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 125MHz Flash Size: 4GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	125MHz	4GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
EC-VA-MPEG2-8B-60-1080-MD00C-A200T	System-On-Chip (SOC) Technologies Inc.	MOD MPEG2 ENC 60FPS 1080 SODIMM Module/Board Type: DSP, FPGA Core Core Processor: - Co-Processor: Xilinx Artix-7 XC7A200T Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: SO-DIMM Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	Xilinx Artix-7 XC7A200T	-	32MB	512MB	SO-DIMM	-	-
DC-V-H264-8B-30-1080-MXC-SL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C
TE0808-05-9BE81-L	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: - Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -	paquet: -	Request a Quote	-	-	-	128MB	4GB	-	2.990" L x 2.050" W (76.00mm x 52.00mm)	-
FORLINX-FETMX6ULL-S-08512SE8GED13	Forlinx Embedded	NXP i.MX6ULLSOM,512MB DDR3,8GB e Module/Board Type: MPU Core Processor: ARM® Cortex®-A7 Co-Processor: - Speed: 800MHz Flash Size: 8GB eMMC RAM Size: 512MB Connector Type: Edge Connector Size / Dimension: 1.380" L x 1.732" W (35.00mm x 44.00mm) Operating Temperature: -25°C ~ 85°C	paquet: -	Request a Quote	ARM® Cortex®-A7	-	800MHz	8GB eMMC	512MB	Edge Connector	1.380" L x 1.732" W (35.00mm x 44.00mm)	-25°C ~ 85°C
TE0712-03-82C36-AW	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 XC7A200T-2FBG484C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Request a Quote	Artix-7 XC7A200T-2FBG484C	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
A20-SOM204-1GS16ME16G-MC	Olimex LTD	IC Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A7 Co-Processor: - Speed: 1GHz Flash Size: 16MB RAM Size: 1GB Connector Type: 204 Pin Size / Dimension: 3.307" L x 2.638" W (84.00mm x 67.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Request a Quote	ARM® Cortex®-A7	-	1GHz	16MB	1GB	204 Pin	3.307" L x 2.638" W (84.00mm x 67.00mm)	0°C ~ 70°C
ME-XU5-5EV-2I-D12E-R1-2	Enclustra FPGA Solutions	SOM ZYNQ US+ ZU5EV 4GB+1GB PL Module/Board Type: MPU, FPGA Core Core Processor: ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 1GB, 4GB Connector Type: 168 Pin Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock153	ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU	-	600MHz, 1.5GHz	16GB	1GB, 4GB	168 Pin	2.200" L x 2.130" W (56.00mm x 54.00mm)	-40°C ~ 85°C
TE0745-03-81C31-A	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Xilinx Zynq 7035 SoC XC7Z035-1FBG676C Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Request a Quote	ARM® Cortex®-A9	Xilinx Zynq 7035 SoC XC7Z035-1FBG676C	-	64MB	1GB	Board-to-Board (BTB) Socket	2.047" L x 2.992" W (52.00mm x 76.00mm)	0°C ~ 70°C
MA-XU3-2CG-1E-D10-R2	Enclustra FPGA Solutions	SOM ZYNQ US+ ZU2CG 1GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Quad-/Dual-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 1GB Connector Type: SO-DIMM-200 Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	ARM® Quad-/Dual-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU	-	533MHz, 1.333GHz	16GB	1GB	SO-DIMM-200	2.660" L x 1.180" W (67.60mm x 30.00mm)	0°C ~ 85°C
TE0741-04-D2I-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K325T-2FBG676I	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0720-03-S003C1	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: - Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 8GB RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	Zynq-7000 (Z-7020)	-	8GB	-	-	-	-

SOMOMAP3530-20-1670AGIR

Logic

SYSTEM ON MODULE LV OMAP3530

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, OMAP3530
Co-Processor: -
Speed: 600MHz
Flash Size: 256MB
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock3 920

ARM? Cortex?-A8, OMAP3530

-

600MHz

256MB

128MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.06" (15mm x 27mm)

-40°C ~ 85°C

M5485EFE

NXP

MODULE FIRE ENGINE

Module/Board Type: MPU Core
Core Processor: ColdFire V4e, MCF5485
Co-Processor: -
Speed: 200MHz
Flash Size: 2MB (Boot)
RAM Size: 64MB
Connector Type: -
Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock3 056

ColdFire V4e, MCF5485

-

200MHz

2MB (Boot)

64MB

-

3.7" x 4.5" (93.4mm x 114.3mm)

-40°C ~ 85°C

CENGLH7A400-10-503HCR

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A400
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock5 664

ARM922T, LH7A400

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

30064

Parallax Inc.

STAMP PLC

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock7 552

-

BS2SX-IC

Parallax Inc.

BASIC STAMP 2SX MODULE

Module/Board Type: MCU Core
Core Processor: SX28AC
Co-Processor: -
Speed: 50MHz
Flash Size: 16KB EEPROM
RAM Size: 32B
Connector Type: -
Size / Dimension: 1.2" x 0.6" (30mm x 15mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock4 544

SX28AC

-

50MHz

16KB EEPROM

32B

-

1.2" x 0.6" (30mm x 15mm)

0°C ~ 70°C

TE0782-02-100-2I

Trenz Electronic GmbH

SOM ZYNQ XC7Z100-2I 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7100)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec QTH
Size / Dimension: 3.35" x 3.35" (85mm x 85mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6 384

ARM Cortex-A9

Zynq-7000 (Z-7100)

-

32MB

1GB

Samtec QTH

3.35" x 3.35" (85mm x 85mm)

-40°C ~ 85°C

TE0841-01-035-1I

Trenz Electronic GmbH

SOM USCALE XCKU035-1I 1GB DDR4

Module/Board Type: FPGA
Core Processor: Kintex UltraScale KU35
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 4GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock7 744

Kintex UltraScale KU35

-

32MB

4GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

CC-MX-LD69-ZM

Digi International

MODULE I.MX53 800MHZ 512MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock6 560

-

TE0720-03-1CF

Trenz Electronic GmbH

SOM SOC 7Z020-1CLG484C 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock5 120

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

3354-HX-X38-RI

Critical Link LLC

MITYSOM-3354 W/ AM3354

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3354
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 512MB
RAM Size: 512MB
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6 864

ARM? Cortex?-A8, AM3354

NEON SIMD

800MHz

512MB

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

-40°C ~ 85°C

TE0741-03-160-2C1

Trenz Electronic GmbH

SOM KINTEX-7 160T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 160T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock3 840

Kintex-7 160T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

CC-MX-LD6A-ZM

Digi International

MOD I.MX53 1GB FLASH 512MB RAM

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, i.MX53
Co-Processor: -
Speed: 800MHz
Flash Size: 1GB
RAM Size: 512MB
Connector Type: Board-to-Board (BTB) Socket - 360
Size / Dimension: 3.23" x 1.97" (82mm x 50mm
Operating Temperature: -20°C ~ 85°C

paquet: -

Stock5 760

ARM? Cortex?-A8, i.MX53

-

800MHz

1GB

512MB

Board-to-Board (BTB) Socket - 360

3.23" x 1.97" (82mm x 50mm

-20°C ~ 85°C

DC-ME4-01T-S

Digi International

MOD ME 8MB SDRAM 4MB FLASH SGL

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6 096

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

BS2-IC

Parallax Inc.

BASIC STAMP II MODULE

Module/Board Type: MCU Core
Core Processor: PIC16C57C
Co-Processor: -
Speed: 20MHz
Flash Size: 2KB EEPROM
RAM Size: 32B
Connector Type: -
Size / Dimension: 1.2" x 0.6" (30mm x 15mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock10 224

PIC16C57C

-

20MHz

2KB EEPROM

32B

-

1.2" x 0.6" (30mm x 15mm)

0°C ~ 70°C

DC-ME4-01T-VTY

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6 960

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

DC-ME4-01T-HPA-1

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock7 072

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

TE0720-03-61C33FA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 125MHz
Flash Size: 4GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

125MHz

4GB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

EC-VA-MPEG2-8B-60-1080-MD00C-A200T

System-On-Chip (SOC) Technologies Inc.

MOD MPEG2 ENC 60FPS 1080 SODIMM

Module/Board Type: DSP, FPGA Core
Core Processor: -
Co-Processor: Xilinx Artix-7 XC7A200T
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: SO-DIMM
Size / Dimension: -
Operating Temperature: -

paquet: -

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-

Xilinx Artix-7 XC7A200T

-

32MB

512MB

SO-DIMM

-

DC-V-H264-8B-30-1080-MXC-SL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C

TE0808-05-9BE81-L

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: -
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -

paquet: -

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-

128MB

4GB

-

2.990" L x 2.050" W (76.00mm x 52.00mm)

-

FORLINX-FETMX6ULL-S-08512SE8GED13

Forlinx Embedded

NXP i.MX6ULLSOM,512MB DDR3,8GB e

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A7
Co-Processor: -
Speed: 800MHz
Flash Size: 8GB eMMC
RAM Size: 512MB
Connector Type: Edge Connector
Size / Dimension: 1.380" L x 1.732" W (35.00mm x 44.00mm)
Operating Temperature: -25°C ~ 85°C

paquet: -

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ARM® Cortex®-A7

-

800MHz

8GB eMMC

512MB

Edge Connector

1.380" L x 1.732" W (35.00mm x 44.00mm)

-25°C ~ 85°C

TE0712-03-82C36-AW

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 XC7A200T-2FBG484C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

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Artix-7 XC7A200T-2FBG484C

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

A20-SOM204-1GS16ME16G-MC

Olimex LTD

IC

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A7
Co-Processor: -
Speed: 1GHz
Flash Size: 16MB
RAM Size: 1GB
Connector Type: 204 Pin
Size / Dimension: 3.307" L x 2.638" W (84.00mm x 67.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

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ARM® Cortex®-A7

-

1GHz

16MB

1GB

204 Pin

3.307" L x 2.638" W (84.00mm x 67.00mm)

0°C ~ 70°C

ME-XU5-5EV-2I-D12E-R1-2

Enclustra FPGA Solutions

SOM ZYNQ US+ ZU5EV 4GB+1GB PL

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 1GB, 4GB
Connector Type: 168 Pin
Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock153

ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU

-

600MHz, 1.5GHz

16GB

1GB, 4GB

168 Pin

2.200" L x 2.130" W (56.00mm x 54.00mm)

-40°C ~ 85°C

TE0745-03-81C31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Xilinx Zynq 7035 SoC XC7Z035-1FBG676C
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

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ARM® Cortex®-A9

Xilinx Zynq 7035 SoC XC7Z035-1FBG676C

-

64MB

1GB

Board-to-Board (BTB) Socket

2.047" L x 2.992" W (52.00mm x 76.00mm)

0°C ~ 70°C

MA-XU3-2CG-1E-D10-R2

Enclustra FPGA Solutions

SOM ZYNQ US+ ZU2CG 1GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Quad-/Dual-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 1GB
Connector Type: SO-DIMM-200
Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

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ARM® Quad-/Dual-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU

-

533MHz, 1.333GHz

16GB

1GB

SO-DIMM-200

2.660" L x 1.180" W (67.60mm x 30.00mm)

0°C ~ 85°C

TE0741-04-D2I-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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Xilinx Kintex-7 FPGA XC7K325T-2FBG676I

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0720-03-S003C1

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: -
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 8GB
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

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-

Zynq-7000 (Z-7020)

-

8GB

-