Ideal for EMI suppression in X1 circuits (L-N), TDK’s new X1 Series capacitors.
TDK’s CLF-NI-D series of rugged power inductors for use in automotive electronics feature high efficiency and reliability over a very wide temperature range extending from -55C to +150C and offer rated inductance values from 1μH to 470μH (E6 series).
TDK Epcos’ current-compensated chokes are designed for a maximum voltage of 300VAC and offering inductance values of between 10mH and 100mH.
TDK’s CLF-NI-D Series of rugged power inductors feature high efficiency and reliability over a very wide temperature range extending from -55C to +150C and offer rated inductance values from 1μH to 470μH (E6 series).
TDK CGJ Series multilayer ceramic chip capacitors are high-reliability MLCCs with long lifespans. They feature an ultra high-frequency (UHF) RFID tag to allow integration with RFID programs such as inventory management.
The TDK SESUB-PAN-T2541 Bluetooth v4.0 module, the ultra-compact Bluetooth low energy modules offer a tiny 4.6m x 5.6mm x 1mm footprint. The module is based on proprietary semiconductor embedded in substrate (SESUB) technology.
The SESUB-PAN-T2541 Bluetooth v4.0 Module from TDK, an ultra-compact, Bluetooth 4.0 Low Energy (LE) micro module, is one of the world’s smallest modules for Bluetooth Smart devices, says the company.
TDK has expanded its CCT series of clamp AC current sensors with two new types that are rated for 300A and 80A. The new sensors are designed for use in the power distribution panels in a variety of systems such as power distribution panels of energy-management systems (EMS) for homes, buildings, factories and stores (HEMS, BEMS, FEMS, SEMS)
TDK’s new SDS1B series of 6Gbps serial ATA-compatible 2.5-inch solid-state drives for industrial applications, feature the NAND flash memory controller chip GBDriver GS1.
