The company stated that TDK's SESUB-PAN-T2541 Bluetooth v4.0 module is an ultra-compact Bluetooth 4.0 low energy (LE) micromodule and is one of the world's smallest Bluetooth smart device modules.
SESUB-PAN-T2541 is based on TDK's proprietary semiconductor embedded substrate (SESUB) technology, and its size is much smaller than modules using discrete components. Power consumption is about 25% lower than traditional Bluetooth devices. The module only needs to be connected to the power supply, the microcontroller interface and the antenna to easily achieve Bluetooth connection.
Texas Instruments' (TI) CC2541 Bluetooth SoC chip is mounted on a thin substrate along with all peripheral circuits (including 32MHz crystals, bandpass filters, and capacitors). This reduced the most competitive solution of the module by approximately 65%. All I / O from the substrate layer is also routed to the ball grid array (BGA) on the bottom of the module to take up space. Interfaces include UART, SPI, I2C and I / O. All these functions help to speed up the hardware design process, so that Bluetooth connection can be realized quickly and easily. According to the line of sight and antenna characteristics, the output power is rated at 0 dBm (typical) and the communication range is 10 meters.
The TDK SESUB-PAN-T2541 Bluetooth v4.0 module is targeted at low-power wireless applications, including consumer applications and wireless sensors, cable replacement applications, instruments, heart rate monitors and blood glucose meters. Other applications include the Internet of Things and wearable devices.
