Les dernières technologies de Bivar Inc. | Heisener Electronics
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Les dernières technologies de Bivar Inc.

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Technology Cover

2023-05-15, Basic Semiconductor released the second generation of silicon carbide MOSFET series new products

Basic semiconductor once again appeared in the world's most powerful semiconductor exhibition - PCIM Europe 2023, in Nuremberg, Germany, the official release of the second generation of silicon carbide MOSFET products. The performance of the new generation of products has been greatly improved, and the product types have been further enriched, helping to achieve better energy efficiency and application reliability in the industries of new energy vehicles, DC fast charging, photovoltaic energy storage, industrial power supply, communication power supply and so on.

Technology Cover

2022-06-19, ABS sink box provides protection for small electronic circuits

BCL enclosures offer two series of competitively priced potting boxes made of tough, high-quality ABS that protect delicate electronics in a variety of applications. The GPL range has fixed lugs that attach securely to the surface and is available in standard colours of black, white, or grey, each in three different sizes, the smallest in the range, the PB109, measures just 11mm x 11mm x 9mm, while the largest It is 100mm x 60mm x 25mm.

Technology Cover

2022-06-10, Connectors and more designed for North American power applications

Binder releases the 823 and 824 series cable connectors for the North American continent. The K code indicates that the five-pin connector is ideal for AC power supplies, including drives or inverters up to 630VAC and up to 12A. They feature M12x1 threads, 8mm to 13mm cable outlets and screw clamp terminals.