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Nouvelles Technologies

Dossiers 4 647
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Technology Cover

2018-01-29, The new power MOSFETs provide low resistance, increasing efficiency and power density

The new power MOSFETs provide low resistance, increasing efficiency and power density

Technology Cover

2018-01-29, New range of power devices

New range of power devices offers complete power solutions with enhanced energy efficiency

Technology Cover

2018-01-25, Panasonic’s integrated WiFi module

Panasonic introduced a Wi-Fi module(PAN9420) with 2.4GHz 802.11 b / g / n Wi-Fi that integrates stack and API to minimize firmware development and includes a complete security suite.

Technology Cover

2018-01-25, A 20A buck regulator - Vicor

Vicor has introduced the highest current output ZVS buck regulator for 24V / 28V applications, delivering up to 20A regulated 5V output.

Technology Cover

2018-01-25, The A3941 is an H-bridge device that complements the existing automotive-grade MOSFET pre-integrated circuit product line.

The A3941 is an H-bridge device that complements the existing automotive-grade MOSFET pre-integrated circuit product line.

Technology Cover

2018-01-25, 16-bit ADC for digital communication

16-bit ADC for digital communication

Technology Cover

2018-01-25, Toshiba introduces Small 300mA LDO Regulator

Toshiba introduced the first product in the TCR3UG family of small package LDO regulators with an output current of 300mA for power management of IoT modules, wearable devices and smartphones.

Technology Cover

2018-01-24, 5G goes to 60GHz and multiport

With 5G mobile communications expected to run on networks operating in the 60GHz millimetre-wave band, Jean Pierre Guillemet describes a technique for testing multi-port broadband components up to 145GHz

Technology Cover

2018-01-23, Flyback controller includes primary-side regulation and peak power mode (UCC28634)

Flyback controller includes primary-side regulation and peak power mode (UCC28634)

Technology Cover

2018-01-19, On-chip metal-to-metal tunnelling makes light without lasers

On-chip metal-to-metal tunnelling makes light without lasers

Technology Cover

2018-01-18, Xilinx Announces Availability of Automotive Qualified Zynq UltraScale+ MPSoC Family

Xilinx, Inc. announced availability of the automotive qualified Zynq® UltraScale+™ MPSoC family, enabling development of safety critical ADAS and Autonomous Driving Systems.

Technology Cover

2018-01-17, TSMC 12FFC offers Moortec PVT monitoring IP

TSMC 12FFC is now available Moortec embedded chip monitoring subsystem.

Technology Cover

2018-01-17, Infineon introduced IPOL series

Infineon is manufacturing the latest integrated point of load (IPOL), a fully integrated voltage regulator that provides PMBUS, SVID and PVID capabilities to power Intel CPU POL rails, chipsets and ASICs / FPGAs.

Technology Cover

2018-01-17, A switching frequency of up to 3MHz allows us to achieve a much greater power density

A switching frequency of up to 3MHz allows us to achieve a much greater power density

Technology Cover

2018-01-16, Fujitsu shrink FRAM process; launch 2Mbit chip Fujitsu's first

Fujitsu's first FRAM mold shrinkage product MB85RS2MTA

Technology Cover

2018-01-16, SMD resistors shrug off big pulses

TT Electronics announced the HPWC (High Pulse) series of high-energy surge resistors designed to maximize the surge performance of thick, single-sided, flat-die designs.