Page 185 - Produits NXP | Heisener Electronics

Référence	Fabricant	Description	paquet	Stock
BUK9Y41-80E/GFX	NXP	MOSFET N-CH LFPAK Transistor Type: - Current - Collector (Ic) (Max): - Voltage - Collector Emitter Breakdown (Max): - Vce Saturation (Max) @ Ib, Ic: - Current - Collector Cutoff (Max): - DC Current Gain (hFE) (Min) @ Ic, Vce: - Power - Max: - Frequency - Transition: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Stock2 896
PN2222A,116	NXP	TRANS NPN 40V 0.6A TO92 Transistor Type: NPN Current - Collector (Ic) (Max): 600mA Voltage - Collector Emitter Breakdown (Max): 40V Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA Current - Collector Cutoff (Max): 10nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V Power - Max: 500mW Frequency - Transition: 300MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	paquet: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	Stock3 536
BZX284-B75,115	NXP	DIODE ZENER 75V 400MW SOD2 Voltage - Zener (Nom) (Vz): 75V Tolerance: ±2% Power - Max: 400mW Impedance (Max) (Zzt): 175 Ohms Current - Reverse Leakage @ Vr: 50nA @ 52.5V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	paquet: SOD-110	Stock2 928
TEA1610T/N5,118	NXP	IC RESONANT CONVRTR CTRLR 16SOIC Applications: Resonant Converter Controller Voltage - Input: - Voltage - Supply: 0 V ~ 15 V Current - Supply: 2.4mA Operating Temperature: -25°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	paquet: 16-SOIC (0.154", 3.90mm Width)	Stock6 400
MC33982BPNA	NXP	IC SWITCH HI SIDE SINGLE 16-PQFN Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 6 V ~ 27 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): - Rds On (Typ): 2 mOhm Input Type: - Features: Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 16-PowerDFN Supplier Device Package: 16-PQFN (12x12)	paquet: 16-PowerDFN	Stock7 456
PCA9635PW,118	NXP	IC LED DRVR LIN DIM 25MA 28TSSOP Type: Linear Topology: - Internal Switch(s): Yes Number of Outputs: 16 Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Voltage - Output: 5.5V Current - Output / Channel: 25mA Frequency: 100kHz ~ 1MHz Dimming: PWM Applications: Backlight Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	paquet: 28-TSSOP (0.173", 4.40mm Width)	Stock38 892
SSTUA32S868ET,518	NXP	IC BUFFER 1.8V 56BIT 176-TFBGA Logic Type: 1:2 Registered Buffer with Parity Supply Voltage: 1.7 V ~ 2 V Number of Bits: 28 Operating Temperature: - Mounting Type: Surface Mount Package / Case: 176-TFBGA Supplier Device Package: 176-TFBGA (6x15)	paquet: 176-TFBGA	Stock7 584
74LVC821ABQ,118	NXP	IC D-TYPE POS TRG SNGL 24DHVQFN Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 10 Clock Frequency: 200MHz Max Propagation Delay @ V, Max CL: 7.3ns @ 3.3V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.65 V ~ 3.6 V Current - Quiescent (Iq): 10µA Input Capacitance: 5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad	paquet: 24-VFQFN Exposed Pad	Stock5 344
74LVC2952APW,118	NXP	IC REGISTERED TXRX 8BIT 24TSSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	paquet: 24-TSSOP (0.173", 4.40mm Width)	Stock2 192
TDA18291HN/C1,157	NXP	IC DVB-H LOW PWR TUNER 32-HVQFN Type: Tuner Applications: Mobile Phones, Cellular, Video Displays Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	paquet: 32-VFQFN Exposed Pad	Stock6 976
TDA8024T-T	NXP	IC SMART CARD INTERFACE 28-SOIC Applications: - Interface: Analog Voltage - Supply: 2.7 V ~ 6.5 V Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SO Mounting Type: Surface Mount	paquet: 28-SOIC (0.295", 7.50mm Width)	Stock2 064
TJA1054AT/M,518	NXP	IC CAN TXRX FAULT-TOL 14-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: - Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	paquet: 14-SOIC (0.154", 3.90mm Width)	Stock7 088
MPC8280CZUUPEA	NXP	IC MPU MPC82XX 450MHZ 408TBGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 450MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	paquet: 480-LBGA	Stock19 488
S912ZVML64F2WKH	NXP	IC MCU 16BIT 64KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	paquet: 64-LQFP Exposed Pad	Stock4 528
MC9S08SH16MTG	NXP	IC MCU 8BIT 16KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 13 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	paquet: 16-TSSOP (0.173", 4.40mm Width)	Stock3 200
MCF52234CAL60	NXP	IC MCU 32BIT 256KB FLASH 112LQFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 60MHz Connectivity: CAN, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 73 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	paquet: 112-LQFP	Stock7 280
MCF5272VM66	NXP	IC MCU 32BIT 16KB ROM 196MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, WDT Number of I/O: 32 Program Memory Size: 16KB (4K x 32) Program Memory Type: ROM EEPROM Size: - RAM Size: 1K x 32 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	paquet: 196-LBGA	Stock16 164
MSC8157TVT1000A	NXP	IC DSP 6-CORE DGTL 783FCBGA Type: SC3850 Six Core Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 6.375MB Voltage - I/O: 1.0V, 1.5V, 2.5V Voltage - Core: 1.00V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	paquet: 783-BBGA, FCBGA	Stock2 880
MMA5212LWR2	NXP	ACCELEROMETER PSI5 16QFN Type: Digital Axis: X Acceleration Range: ±120g Sensitivity (LSB/g): 4 Sensitivity (mV/g): - Bandwidth: - Output Type: PCM, SPI Voltage - Supply: 4.2 V ~ 17 V Features: - Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	paquet: 16-QFN Exposed Pad	Stock4 536
CLRC66303HNY	NXP	IC NFC CONTACTLESS TXRX 32HVQFN Type: RFID Reader Frequency: 13.56MHz Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC Interface: I2C, SPI, UART Voltage - Supply: 2.5 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	paquet: 32-VFQFN Exposed Pad	Stock57 636
PCF7939MA/CABC0800	NXP	IC TRANSPONDER IMMOBILIZER PLLMC Style: - Technology: - Frequency: - Memory Type: - Writable Memory: - Standards: - Operating Temperature: - Size / Dimension: -	paquet: -	Stock3 454
S912XDP512J1CAG	NXP	16-BIT MCU S12X CORE 512KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b, 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	paquet: 144-LQFP	Stock4 720
S912XEP768BVAG	NXP	16-BIT MCU S12X CORE 768KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	paquet: 144-LQFP	Stock6 608
SPC5643LFK0MLL6R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 64MHz Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 32x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	paquet: 100-LQFP	Stock4 288
S912XEQ512BMAGR	NXP	16-BIT MCU S12X CORE 512KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	paquet: 144-LQFP	Stock5 296
TJR1442ATK-S1Z	NXP	IC TRANSCEIVER HALF 1/1 8HVSON Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 50 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 175°C (TJ) Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	paquet: -	Request a Quote
MF3DH4201DUF-01V	NXP	IC MIFARE DESFIRE EV2 FFC Applications: - Core Processor: - Program Memory Type: - Controller Series: - RAM Size: - Interface: - Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Request a Quote
LPC1759FBD80Y	NXP	IC MCU 32BIT 512KB FLASH 80LQFP Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Speed: 120MHz Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 52 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 6x12b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	paquet: -	Request a Quote

BUK9Y41-80E/GFX

NXP

MOSFET N-CH LFPAK

Transistor Type: -
Current - Collector (Ic) (Max): -
Voltage - Collector Emitter Breakdown (Max): -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Power - Max: -
Frequency - Transition: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock2 896

PN2222A,116

NXP

TRANS NPN 40V 0.6A TO92

Transistor Type: NPN
Current - Collector (Ic) (Max): 600mA
Voltage - Collector Emitter Breakdown (Max): 40V
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Power - Max: 500mW
Frequency - Transition: 300MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

paquet: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

Stock3 536

BZX284-B75,115

NXP

DIODE ZENER 75V 400MW SOD2

Voltage - Zener (Nom) (Vz): 75V
Tolerance: ±2%
Power - Max: 400mW
Impedance (Max) (Zzt): 175 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 52.5V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

paquet: SOD-110

Stock2 928

TEA1610T/N5,118

NXP

IC RESONANT CONVRTR CTRLR 16SOIC

Applications: Resonant Converter Controller
Voltage - Input: -
Voltage - Supply: 0 V ~ 15 V
Current - Supply: 2.4mA
Operating Temperature: -25°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

paquet: 16-SOIC (0.154", 3.90mm Width)

Stock6 400

MC33982BPNA

NXP

IC SWITCH HI SIDE SINGLE 16-PQFN

Switch Type: General Purpose
Number of Outputs: 1
Ratio - Input:Output: 1:1
Output Configuration: High Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 6 V ~ 27 V
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Current - Output (Max): -
Rds On (Typ): 2 mOhm
Input Type: -
Features: Slew Rate Controlled, Watchdog Timer
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 16-PowerDFN
Supplier Device Package: 16-PQFN (12x12)

paquet: 16-PowerDFN

Stock7 456

PCA9635PW,118

NXP

IC LED DRVR LIN DIM 25MA 28TSSOP

Type: Linear
Topology: -
Internal Switch(s): Yes
Number of Outputs: 16
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Voltage - Output: 5.5V
Current - Output / Channel: 25mA
Frequency: 100kHz ~ 1MHz
Dimming: PWM
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

paquet: 28-TSSOP (0.173", 4.40mm Width)

Stock38 892

SSTUA32S868ET,518

NXP

IC BUFFER 1.8V 56BIT 176-TFBGA

Logic Type: 1:2 Registered Buffer with Parity
Supply Voltage: 1.7 V ~ 2 V
Number of Bits: 28
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 176-TFBGA
Supplier Device Package: 176-TFBGA (6x15)

paquet: 176-TFBGA

Stock7 584

74LVC821ABQ,118

NXP

IC D-TYPE POS TRG SNGL 24DHVQFN

Function: Standard
Type: D-Type
Output Type: Tri-State, Non-Inverted
Number of Elements: 1
Number of Bits per Element: 10
Clock Frequency: 200MHz
Max Propagation Delay @ V, Max CL: 7.3ns @ 3.3V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.65 V ~ 3.6 V
Current - Quiescent (Iq): 10µA
Input Capacitance: 5pF
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad

paquet: 24-VFQFN Exposed Pad

Stock5 344

74LVC2952APW,118

NXP

IC REGISTERED TXRX 8BIT 24TSSOP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

paquet: 24-TSSOP (0.173", 4.40mm Width)

Stock2 192

TDA18291HN/C1,157

NXP

IC DVB-H LOW PWR TUNER 32-HVQFN

Type: Tuner
Applications: Mobile Phones, Cellular, Video Displays
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

paquet: 32-VFQFN Exposed Pad

Stock6 976

TDA8024T-T

NXP

IC SMART CARD INTERFACE 28-SOIC

Applications: -
Interface: Analog
Voltage - Supply: 2.7 V ~ 6.5 V
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SO
Mounting Type: Surface Mount

paquet: 28-SOIC (0.295", 7.50mm Width)

Stock2 064

TJA1054AT/M,518

NXP

IC CAN TXRX FAULT-TOL 14-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

paquet: 14-SOIC (0.154", 3.90mm Width)

Stock7 088

MPC8280CZUUPEA

NXP

IC MPU MPC82XX 450MHZ 408TBGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 450MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

paquet: 480-LBGA

Stock19 488

S912ZVML64F2WKH

NXP

IC MCU 16BIT 64KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

Stock4 528

MC9S08SH16MTG

NXP

IC MCU 8BIT 16KB FLASH 16TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 13
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

paquet: 16-TSSOP (0.173", 4.40mm Width)

Stock3 200

MCF52234CAL60

NXP

IC MCU 32BIT 256KB FLASH 112LQFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 60MHz
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 73
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

Stock7 280

MCF5272VM66

NXP

IC MCU 32BIT 16KB ROM 196MAPBGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Number of I/O: 32
Program Memory Size: 16KB (4K x 32)
Program Memory Type: ROM
EEPROM Size: -
RAM Size: 1K x 32
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 196-LBGA
Supplier Device Package: 196-MAPBGA (15x15)

paquet: 196-LBGA

Stock16 164

MSC8157TVT1000A

NXP

IC DSP 6-CORE DGTL 783FCBGA

Type: SC3850 Six Core
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Clock Rate: 1GHz
Non-Volatile Memory: ROM (96 kB)
On-Chip RAM: 6.375MB
Voltage - I/O: 1.0V, 1.5V, 2.5V
Voltage - Core: 1.00V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

Stock2 880

MMA5212LWR2

NXP

ACCELEROMETER PSI5 16QFN

Type: Digital
Axis: X
Acceleration Range: ±120g
Sensitivity (LSB/g): 4
Sensitivity (mV/g): -
Bandwidth: -
Output Type: PCM, SPI
Voltage - Supply: 4.2 V ~ 17 V
Features: -
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

paquet: 16-QFN Exposed Pad

Stock4 536

CLRC66303HNY

NXP

IC NFC CONTACTLESS TXRX 32HVQFN

Type: RFID Reader
Frequency: 13.56MHz
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Interface: I2C, SPI, UART
Voltage - Supply: 2.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 105°C
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

paquet: 32-VFQFN Exposed Pad

Stock57 636

PCF7939MA/CABC0800

NXP

IC TRANSPONDER IMMOBILIZER PLLMC

Style: -
Technology: -
Frequency: -
Memory Type: -
Writable Memory: -
Standards: -
Operating Temperature: -
Size / Dimension: -

paquet: -

Stock3 454

S912XDP512J1CAG

NXP

16-BIT MCU S12X CORE 512KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b, 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

Stock4 720

S912XEP768BVAG

NXP

16-BIT MCU S12X CORE 768KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

Stock6 608

SPC5643LFK0MLL6R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 64MHz
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 32x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

Stock4 288

S912XEQ512BMAGR

NXP

16-BIT MCU S12X CORE 512KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

Stock5 296

TJR1442ATK-S1Z

NXP

IC TRANSCEIVER HALF 1/1 8HVSON

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 50 mV
Data Rate: 5Mbps
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Supplier Device Package: 8-HVSON (3x3)

paquet: -

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MF3DH4201DUF-01V

NXP

IC MIFARE DESFIRE EV2 FFC

Applications: -
Core Processor: -
Program Memory Type: -
Controller Series: -
RAM Size: -
Interface: -
Number of I/O: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

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LPC1759FBD80Y

NXP

IC MCU 32BIT 512KB FLASH 80LQFP

Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit Single-Core
Speed: 120MHz
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 52
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Data Converters: A/D 6x12b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

paquet: -

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