Produits NXP

AFT20S015NR1

NXP

FET RF 65V 2.17GHZ TO270-2

• Transistor Type: LDMOS
• Frequency: 2.17GHz
• Gain: 17.6dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 132mA
• Power - Output: 1.5W
• Voltage - Rated: 65V
• Package / Case: TO-270AA
• Supplier Device Package: TO-270-2

paquet: TO-270AA

PVR100AD-B5V0,115

NXP

TRANS NPN 45V 0.1A 6TSOP

• Transistor Type: NPN + Zener
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 45V
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): 100nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
• Power - Max: 300mW
• Frequency - Transition: -
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-74, SOT-457
• Supplier Device Package: 6-TSOP

paquet: SC-74, SOT-457

MC34844EP

NXP

IC LED DRVR RGLTR DIM 50MA 32QFN

• Type: DC DC Regulator
• Topology: Step-Up (Boost)
• Internal Switch(s): Yes
• Number of Outputs: 10
• Voltage - Supply (Min): 7V
• Voltage - Supply (Max): 28V
• Voltage - Output: 8 V ~ 60 V
• Current - Output / Channel: 50mA
• Frequency: -
• Dimming: Analog, PWM
• Applications: Backlight
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN Exposed Pad (5x5)

paquet: 32-VFQFN Exposed Pad

74HCT299D,652

NXP

IC UNIV SHIFT REGISTER 20SOIC

• Logic Type: Universal Shift Register
• Number of Circuits: 8-Bit
• Current - Output High, Low: 6mA, 6mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

paquet: 20-SOIC (0.295", 7.50mm Width)

74HCT165N,652

NXP

IC SHIFT REG 8BIT PI-SO 16DIP

• Logic Type: Shift Register
• Output Type: Complementary
• Number of Elements: 1
• Number of Bits per Element: 8
• Function: Parallel or Serial to Serial
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

paquet: 16-DIP (0.300", 7.62mm)

74HCT688PW,118

NXP

IC COMPARATOR MAGNITUDE 20TSSOP

• Type: Identity Comparator
• Number of Bits: 8
• Output: Active Low
• Output Function: A=B
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Output High, Low: 4mA, 4mA
• Max Propagation Delay @ V, Max CL: 34ns @ 4.5V, 50pF
• Current - Quiescent (Iq): 8µA
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Mounting Type: Surface Mount

paquet: 20-TSSOP (0.173", 4.40mm Width)

N74F367D,602

NXP

IC BUFFER DVR HEX N-INV 16SOIC

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 2, 4 (Hex)
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 15mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

paquet: 16-SOIC (0.154", 3.90mm Width)

TDF8546JS/N2ZS

NXP

IC AMP AUDIO BTL DBSMS27P

• Type: Class AB
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 25W x 4 @ 4 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -
• Supplier Device Package: 27-DBSMS
• Package / Case: 27-DBSMS

paquet: 27-DBSMS

SAA1305T/N1,118

NXP

IC ON/OFF LOGIC 24SOIC

• Applications: Automotive Audio
• Interface: I2C
• Voltage - Supply: 4.5 V ~ 5.5 V
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO
• Mounting Type: Surface Mount

paquet: 24-SOIC (0.295", 7.50mm Width)

TJA1051T/3,112

NXP

IC CAN TRANSEIVER HS 8SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 120mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

P1025NXN5DFB

NXP

IC MPU Q OR IQ 667MHZ 561TEBGA1

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 561-FBGA
• Supplier Device Package: 561-TEPBGA1 (23x23)

paquet: 561-FBGA

MPC860SRVR66D4R2

NXP

IC MPU MPC8XX 66MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

paquet: 357-BBGA

T4160NSE7PQB

NXP

IC SOC 64BIT 16X 1.5GHZ 1932BGA

• Core Processor: PowerPC e6500
• Number of Cores/Bus Width: 8 Core, 64-Bit
• Speed: 1.8GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (13), 10 Gbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FCPBGA (45x45)

paquet: 1932-BBGA, FCBGA

MPC8358CVRAGDGA

NXP

IC MPU MPC83XX 400MHZ 668BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 668-BBGA Exposed Pad
• Supplier Device Package: 668-PBGA-PGE (29x29)

paquet: 668-BBGA Exposed Pad

MCIMX6S4AVM08AC

NXP

IC MPU I.MX6S 800MHZ 624MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

paquet: 624-LFBGA

MC9328MXLDVP20

NXP

IC MPU I.MXL 200MHZ 225MAPBGA

• Core Processor: ARM920T
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 200MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: LCD
• Ethernet: -
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 3.0V
• Operating Temperature: -30°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 225-LFBGA
• Supplier Device Package: 225-MAPBGA (13x13)

paquet: 225-LFBGA

MC908GZ48VFJE

NXP

IC MCU 8BIT 48KB FLASH 32LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 21
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

MC68334GCEH16

NXP

IC MCU 32BIT ROMLESS 132QFP

• Core Processor: CPU32
• Core Size: 32-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: -
• Number of I/O: 47
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x8/10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 132-BQFP Bumpered
• Supplier Device Package: 132-PQFP (24.13x24.13)

paquet: 132-BQFP Bumpered

LPC1817JET100E

NXP

IC MCU 32BIT 1MB FLASH 100TFBGA

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
• Number of I/O: 49
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 16K x 8
• RAM Size: 136K x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 4x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-TFBGA
• Supplier Device Package: -

paquet: 100-TFBGA

S912ZVMBA6F0WLF

NXP

IC MCU 16BIT 16KB FLASH 48LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: LIN, SCI, SPI
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 15
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

MKL33Z64VLH4

NXP

IC MCU 32BIT 64KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
• Peripherals: DMA, LCD, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 20x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

MK51DX256CLL7

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 57
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 35x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

KMC8113TVT4800V

NXP

IC DSP 300/400MHZ 431FCBGA

• Type: SC140 Core
• Interface: Ethernet, I2C, TDM, UART
• Clock Rate: 400MHz
• Non-Volatile Memory: External
• On-Chip RAM: 1.436MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.10V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 431-BFBGA, FCBGA
• Supplier Device Package: 431-FCPBGA (20x20)

paquet: 431-BFBGA, FCBGA

KMSC8122MP8000

NXP

DSP 16BIT QUAD 500MHZ 431FCBGA

• Type: SC140 Core
• Interface: DSI, Ethernet, RS-232
• Clock Rate: 500MHz
• Non-Volatile Memory: External
• On-Chip RAM: 1.436MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: 0°C ~ 90°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 431-BFBGA, FCBGA
• Supplier Device Package: 431-FCPBGA (20x20)

paquet: 431-BFBGA, FCBGA

PCA9412UKZ

NXP

2.5 MHZ 300 MA STEP-UP DC-DC CVR

• Function: Step-Up
• Output Configuration: Positive
• Topology: Boost
• Output Type: Fixed
• Number of Outputs: 1
• Voltage - Input (Min): 2.5V
• Voltage - Input (Max): 5.25V
• Voltage - Output (Min/Fixed): 5.4V
• Voltage - Output (Max): 5.56V
• Current - Output: 300mA
• Frequency - Switching: 3MHz
• Synchronous Rectifier: Yes
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 9-UFBGA
• Supplier Device Package: 9-WLCSP (1.24x1.24)

paquet: 9-UFBGA

T4080NSE7QTB

NXP

QORIQ 64B POWER ARCH 8X 1.67GH

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

S912XDG128F2MAAR

NXP

16-BIT MCU S12X CORE 128KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CANbus, I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b, 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

paquet: 80-QFP

TJA1049TK-1Z

NXP

IC TXRX HS-CAN HALF 1/1 8HVSON

• Type: -
• Protocol: -
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-HVSON (3x3)

paquet: -

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