Produits NXP

BZX284-B56,115

NXP

DIODE ZENER 56V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 56V
• Tolerance: ±2%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 120 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 39.2V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

paquet: SOD-110

BAP70AM,135

NXP

DIODE PIN 50V 100MA 6TSSOP

• Diode Type: PIN - 2 Pair Series
• Voltage - Peak Reverse (Max): 50V
• Current - Max: 100mA
• Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz
• Resistance @ If, F: 1.9 Ohm @ 100mA, 100MHz
• Power Dissipation (Max): 300mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

paquet: 6-TSSOP, SC-88, SOT-363

TLVH431CDBZR,215

NXP

IC VREF SHUNT ADJ SOT23-3

• Reference Type: Shunt
• Output Type: Adjustable
• Voltage - Output (Min/Fixed): 1.24V
• Voltage - Output (Max): 18V
• Current - Output: 70mA
• Tolerance: ±1.5%
• Temperature Coefficient: -
• Noise - 0.1Hz to 10Hz: -
• Noise - 10Hz to 10kHz: -
• Voltage - Input: -
• Current - Supply: -
• Current - Cathode: 80µA
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

paquet: TO-236-3, SC-59, SOT-23-3

PCA9685PW,112

NXP

IC LED DRVR LIN DIM 25MA 28TSSOP

• Type: Linear
• Topology: -
• Internal Switch(s): Yes
• Number of Outputs: 16
• Voltage - Supply (Min): 2.3V
• Voltage - Supply (Max): 5.5V
• Voltage - Output: 5.5V
• Current - Output / Channel: 25mA
• Frequency: -
• Dimming: PWM
• Applications: Backlight
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 28-TSSOP

paquet: 28-TSSOP (0.173", 4.40mm Width)

74ABT899DB,118

NXP

IC 9BIT DUAL LATCH TXRX 28SSOP

• Logic Type: Parity Generator/Checker
• Supply Voltage: 4.5 V ~ 5.5 V
• Number of Bits: 9
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

paquet: 28-SSOP (0.209", 5.30mm Width)

74HCT151N,652

NXP

IC MULTIPLEXER 8-INPUT 16-DIP

• Type: Multiplexer
• Circuit: 1 x 8:1
• Independent Circuits: 1
• Current - Output High, Low: 4mA, 4mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

paquet: 16-DIP (0.300", 7.62mm)

74HC7731D,112

NXP

IC QUAD 64BIT SHIFT REGIS 16SOIC

• Logic Type: Register, Multiplexed
• Output Type: Push-Pull
• Number of Elements: 4
• Number of Bits per Element: 64
• Function: Universal
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

paquet: 16-SOIC (0.154", 3.90mm Width)

MCIMX6L3DVN10AA

NXP

IC MPU I.MX6SL 1.0GHZ 432MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (3)
• Voltage - I/O: 1.2V, 1.8V, 3.0V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 432-TFBGA
• Supplier Device Package: 432-MAPBGA (13x13)

paquet: 432-TFBGA

MPC8572VTAULE

NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BFBGA, FCBGA
• Supplier Device Package: 1023-FCPBGA (33x33)

paquet: 1023-BFBGA, FCBGA

XPC8240RZU250E

NXP

IC MPU MPC82XX 250MHZ 352TBGA

• Core Processor: PowerPC 603e
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 250MHz
• Co-Processors/DSP: -
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 352-LBGA
• Supplier Device Package: 352-TBGA (35x35)

paquet: 352-LBGA

MC68SEC000AA20R2

NXP

IC MPU M680X0 20MHZ 64QFP

• Core Processor: EC000
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 20MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V, 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

paquet: 64-QFP

SPC5516SBMLQ66

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

• Core Processor: e200z1
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 111
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

MC908QL4MDW

NXP

IC MCU 8BIT 4KB FLASH 16SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: LIN
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

paquet: 16-SOIC (0.295", 7.50mm Width)

S912XEQ384F1VAL

NXP

IC MCU 16BIT 384KB FLASH 112LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

MC56F84789VLL

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: 56800EX
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 86
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x12b, 16x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

UDA1361TS/N1,112

NXP

IC ADC STEREO AUDIO 24BIT 16SSOP

• Type: ADC, Audio
• Number of Channels: -
• Resolution (Bits): 24 b
• Sampling Rate (Per Second): 110k
• Data Interface: Serial
• Voltage Supply Source: Analog and Digital
• Voltage - Supply: 2.4 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-SSOP

paquet: 16-LSSOP (0.173", 4.40mm Width)

MMA8125EGR2

NXP

ACCEL 250G DSI/SPI 16SOIC

• Type: Digital
• Axis: Z
• Acceleration Range: ±250g
• Sensitivity (LSB/g): 1
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: DSI, SPI
• Voltage - Supply: 6.3 V ~ 30 V
• Features: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

paquet: 16-SOIC (0.295", 7.50mm Width)

OL2381AHN/C0B,515

NXP

IC RF TXRX ISM<1GHZ 32-VFQFN

• Type: TxRx Only
• RF Family/Standard: General ISM < 1GHz
• Protocol: -
• Modulation: ASK, FSK, GFSK
• Frequency: 315MHz, 434MHz, 868MHz, 915MHz
• Data Rate (Max): 20kbps
• Power - Output: 11dBm
• Sensitivity: -118dBm
• Memory Size: -
• Serial Interfaces: SPI
• GPIO: -
• Voltage - Supply: 2.1 V ~ 3.6 V
• Current - Receiving: 16.5mA
• Current - Transmitting: 14mA ~ 22mA
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad

paquet: 32-VFQFN Exposed Pad

BGU8M1UKAZ

NXP

IC MMIC AMP LNA WLCSP6

• Frequency: 1.8GHz ~ 2.2GHz
• P1dB: -
• Gain: 17dB
• Noise Figure: 0.7dB
• RF Type: Cellular
• Voltage - Supply: 1.5 V ~ 3.1 V
• Current - Supply: 5mA
• Test Frequency: 2.2GHz
• Package / Case: 6-XFBGA, WLCSP
• Supplier Device Package: 6-WLCSP (0.65x0.44)

paquet: 6-XFBGA, WLCSP

MC9S08AC96CFGER

NXP

S08AC 8-BIT MCU S08 CORE 96KB

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

paquet: 44-LQFP

FH32K142HFT0MLHT

NXP

S32K142 32-BIT MCU, ARM CORTEX-M

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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LPC5526JEV98K

NXP

IC MCU 32BIT 256KB FLASH 98VFBGA

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 64
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 144K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 10x16b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 98-VFBGA
• Supplier Device Package: 98-VFBGA (7x7)

paquet: -

MPF5024CMBA0ESR2

NXP

POWER MANAGEMENT IC, PRE-PROG, 4

• Applications: High Performance i.MX 8 Processor Based
• Current - Supply: -
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)

paquet: -

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MC35FS6516CAE

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 2.7V ~ 40V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

paquet: -

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SAF7730HV-N317D-S1

NXP

SAF7730HV/N317D/S1

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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PCA85073ADP-Q900Z

NXP

IC RTC CLK/CALENDAR I2C 8TSSOP

• Type: Clock/Calendar
• Features: Alarm
• Memory Size: -
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I2C
• Voltage - Supply: 1.8V ~ 5.5V
• Voltage - Supply, Battery: -
• Current - Timekeeping (Max): -
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

paquet: -

MC35FS4508CAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

paquet: -

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MGD3162AM551EKR2

NXP

IC

• Driven Configuration: -
• Channel Type: -
• Number of Drivers: -
• Gate Type: -
• Voltage - Supply: -
• Logic Voltage - VIL, VIH: -
• Current - Peak Output (Source, Sink): -
• Input Type: -
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

Request a Quote