Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
5MHZ AUTO TEMP 8-TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock3 072 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
5MHZ AUTO GRADE 8-SOIC-N
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 536 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock2 720 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock7 008 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
5MHZ AUTO TEMP 8-TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 096 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
5MHZ AUTO GRADE 8-SOIC-N
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 408 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock2 016 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock7 568 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
5MHZ AUTO TEMP 8-TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock5 664 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
5MHZ AUTO GRADE 8-SOIC-N
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 984 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock4 304 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock2 032 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 768 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 288 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock5 680 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock5 456 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock4 816 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
32KB I2C EEPROM AUTO GRADE 1
|
paquet: SOT-23-5 Thin, TSOT-23-5 |
Stock3 808 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | TSOT-23-5 |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 752 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock2 512 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock6 960 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 304 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock6 992 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock2 416 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO TMP 8-TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 544 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | 550ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
16KB I2C EEPROM AUTO GRADE 1
|
paquet: SOT-23-5 Thin, TSOT-23-5 |
Stock5 072 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | 550ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | TSOT-23-5 |
||
Microchip Technology |
1MHZ AUTO TMP 8-SOIC-N
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 968 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | 550ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1.7-5.5V 1MHZ AUTO GRADE3 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock5 584 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | 550ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |