Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
64K SPI SERIAL EEPROM
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 752 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
64K SPI SERIAL EEPROM
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 288 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
64K SPI SERIAL EEPROM
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 640 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
512K SPI SERIAL EEPROM
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 176 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
512K SPI SERIAL EEPROM
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock7 616 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
512K SPI SERIAL EEPROM
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 752 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
512K SPI SERIAL EEPROM
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock7 360 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
32K-BIT SEEPROM DLM
|
paquet: 8-WFDFN Exposed Pad |
Stock6 880 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
32K 4KX8 2.5V SER EE HIGH TEMP
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 472 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
32K-BIT SPI SEEPROM 2.5V
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock3 680 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
32K-BIT SPI SEEPROM 2.5V
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 944 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
32K 4KX8 2.5V SER EE HIGH TEMP
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 808 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
32K-BIT SPI SEEPROM 2.5V
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock5 312 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
32K-BIT SPI SEEPROM 2.5V
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 840 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
256K 32KX8 2.5V SER EE EXT
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock7 104 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
APG STANDARD
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 504 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
256K 32KX8 2.5V SER EE EXT
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock2 928 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
256K 32KX8 2.5V SER EE EXT
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock4 704 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
APG STANDARD
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 504 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
256K 32KX8 2.5V SER EE EXT
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock7 776 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
16K 32B PAGE 2.5V SER EE
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock4 784 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
16K 32B PAGE 2.5V SER EE
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 456 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16K 32B PAGE 2.5V SER EE
|
paquet: 8-WFDFN Exposed Pad |
Stock3 344 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
16K 32B PAGE 2.5V SER EE
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock7 424 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
16K 32B PAGE 2.5V SER EE
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 192 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16K 32B PAGE 2.5V SER EE
|
paquet: 8-WFDFN Exposed Pad |
Stock3 712 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
16K 2KX8 16B PAGE 2.5V SER EE
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 384 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16K 16B PAGE 2.5V SER EE
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 792 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |