Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock2 640 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 536 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock5 440 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock4 544 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 944 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
8KB I2C EEPROM AUTO GRADE 1
|
paquet: SOT-23-5 Thin, TSOT-23-5 |
Stock6 976 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | TSOT-23-5 |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 680 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock2 048 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock6 304 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock5 568 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
4KB I2C EEPROM AUTO GRADE 1
|
paquet: SOT-23-5 Thin, TSOT-23-5 |
Stock7 200 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 1MHz | 5ms | 450ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | TSOT-23-5 |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 488 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock2 656 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock4 112 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock2 496 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
2KB I2C EEPROM AUTO GRADE 1
|
paquet: SOT-23-5 Thin, TSOT-23-5 |
Stock4 304 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | TSOT-23-5 |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 904 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock5 632 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock3 840 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock3 104 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
1KB I2C EEPROM AUTO GRADE 1
|
paquet: SOT-23-5 Thin, TSOT-23-5 |
Stock3 584 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | TSOT-23-5 |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 616 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock3 136 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
paquet: 8-UFDFN Exposed Pad |
Stock5 696 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
APG STANDARD
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 224 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 2MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16K 1024X16 OR 2048X8 SERIAL EE
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 584 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 2MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16K 1024X16 OR 2048X8 SERIAL EE
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 992 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 2MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 072 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |