Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FLASH 4MBIT 50MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock3 024 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
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Microchip Technology |
IC EEPROM 32KBIT 5MHZ M2J
|
paquet: M2 J, Smart Card Module (TWI) |
Stock2 464 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (TWI) | M2 - J Module (TWI) |
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Microchip Technology |
IC EEPROM 256KBIT 5MHZ M2J
|
paquet: M2 J, Smart Card Module (TWI) |
Stock2 064 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (TWI) | M2 - J Module (TWI) |
||
Microchip Technology |
IC EEPROM 128KBIT 5MHZ M2J
|
paquet: M2 J, Smart Card Module (TWI) |
Stock7 728 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (TWI) | M2 - J Module (TWI) |
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Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock4 256 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock6 384 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
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Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8SOIJ
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock31 680 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 48TFBGA
|
paquet: 48-TFBGA |
Stock1 372 512 |
|
FLASH | FLASH | 2Mb (128K x 16) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8CSP
|
paquet: 8-UFBGA, CSPBGA |
Stock5 008 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFBGA, CSPBGA | 8-CSP |
||
Microchip Technology |
IC EEPROM 256KBIT 5MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 216 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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Microchip Technology |
IC FLASH 4MBIT 55NS 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock7 680 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC SRAM 256KBIT 20MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 664 |
|
SRAM | SRAM | 256Kb (32K x 8) | SPI | 20MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC FLASH 1MBIT 70NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock14 388 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20µs | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC FLASH 4MBIT 104MHZ 8WDFN
|
paquet: 8-WDFN Exposed Pad |
Stock6 464 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC FLASH 4MBIT 40MHZ 8CSP
|
paquet: 8-UFBGA, CSPBGA |
Stock6 272 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 40MHz | 1ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFBGA, CSPBGA | 8-CSP |
||
Microchip Technology |
IC FLASH 8MBIT 104MHZ 8WDFN
|
paquet: 8-WDFN Exposed Pad |
Stock5 808 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC FLASH 8MBIT 104MHZ 8WDFN
|
paquet: 8-WDFN Exposed Pad |
Stock5 136 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC FLASH 4MBIT 104MHZ 8CSP
|
paquet: 8-UFBGA, CSPBGA |
Stock4 560 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFBGA, CSPBGA | 8-CSP |
||
Microchip Technology |
IC FLASH 8MBIT 40MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 744 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 40MHz | 1ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 8MBIT 55NS 48TSOP
|
paquet: 48-WFBGA |
Stock5 344 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-WFBGA | 48-TSOP |
||
Microchip Technology |
IC FLASH 8MBIT 55NS 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock3 280 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock4 240 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 5MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock7 136 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock5 136 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock2 896 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock4 112 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock7 808 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 32KBIT 5MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock3 648 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |