Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FLASH 2MBIT 55NS 48TFBGA
|
paquet: 48-TFBGA |
Stock4 576 |
|
FLASH | FLASH | 2Mb (128K x 16) | Parallel | - | 20µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
Microchip Technology |
IC FLASH 8MBIT 80MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock6 704 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (5x6) |
||
Microchip Technology |
IC FLASH 8MBIT 50MHZ 8TDFN
|
paquet: 8-WDFN Exposed Pad |
Stock2 016 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC FLASH 8MBIT 50MHZ 8TDFN
|
paquet: 8-WDFN Exposed Pad |
Stock72 288 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC FLASH 2MBIT 55NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock3 200 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20µs | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock4 432 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20µs | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock4 400 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20µs | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock13 728 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 512KBIT 400KHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 672 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 512KBIT 400KHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock8 916 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 776 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8SOIJ
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock15 588 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 512KBIT 400KHZ 8SOIJ
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock2 432 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 512KBIT 400KHZ 8SOIJ
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock15 744 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 16KBIT 20MHZ 8VFBGA
|
paquet: - |
Stock7 104 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | - | - | - |
||
Microchip Technology |
IC FLASH 8MBIT 40MHZ 8CSP
|
paquet: 8-UFBGA, CSPBGA |
Stock2 560 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 40MHz | 1ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFBGA, CSPBGA | 8-CSP |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 544 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock3 920 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 20µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC FLASH 8MBIT 55NS 48TFBGA
|
paquet: 48-TFBGA |
Stock4 112 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC FLASH 8MBIT 55NS 48TFBGA
|
paquet: 48-TFBGA |
Stock5 136 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TFBGA
|
paquet: 48-TFBGA |
Stock5 056 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TFBGA
|
paquet: 48-TFBGA |
Stock5 152 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TFBGA
|
paquet: 48-TFBGA |
Stock7 392 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TFBGA
|
paquet: 48-TFBGA |
Stock6 064 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC FLASH 8MBIT 80MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock2 928 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (5x6) |
||
Microchip Technology |
IC FLASH 8MBIT 50MHZ 8TDFN
|
paquet: 8-WDFN Exposed Pad |
Stock6 224 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC FLASH 8MBIT 50MHZ 8TDFN
|
paquet: 8-WDFN Exposed Pad |
Stock131 664 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC EEPROM 256KBIT 5MHZ M2J
|
paquet: M2 J, Smart Card Module (ISO) |
Stock6 032 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (ISO) | M2 - J Module (ISO) |