Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FLASH 2MBIT 33MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock16 956 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 33MHz | 20µs | - | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
||
Microchip Technology |
IC FLASH 2MBIT 20MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock7 504 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 20MHz | 20µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
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Microchip Technology |
IC FLASH 2MBIT 20MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 352 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 20MHz | 20µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 5MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 264 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 5MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 808 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 8MBIT 104MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 088 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 8MBIT 104MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 600 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 2MBIT 40MHZ 8TDFN
|
paquet: 8-WDFN Exposed Pad |
Stock4 480 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 40MHz | 3.5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Microchip Technology |
IC FLASH 1MBIT 55NS 32TSOP
|
paquet: 32-TFSOP (0.488", 12.40mm Width) |
Stock5 056 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20µs | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 2MBIT 80MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock11 580 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 80MHz | 10µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
||
Microchip Technology |
IC FLASH 2MBIT 80MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock4 400 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 80MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
||
Microchip Technology |
IC FLASH 1MBIT 70NS 32TSOP
|
paquet: 32-TFSOP (0.488", 12.40mm Width) |
Stock7 856 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 1MBIT 55NS 32TSOP
|
paquet: 32-TFSOP (0.488", 12.40mm Width) |
Stock5 248 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20µs | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 5MHZ M2P
|
paquet: M2 P, Smart Card Module (ISO) |
Stock3 984 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 P, Smart Card Module (ISO) | M2 - P Module (ISO) |
||
Microchip Technology |
IC EEPROM 32KBIT 5MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 192 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 4MBIT 50MHZ 8SOIC
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock5 200 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 4MBIT 50MHZ 8SOIC
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock5 392 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 4MBIT 50MHZ 8SOIC
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock3 312 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 2MBIT 80MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock2 800 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 80MHz | 10µs | - | 2.3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 48WFBGA
|
paquet: 48-WFBGA |
Stock7 408 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 48WFBGA
|
paquet: 48-WFBGA |
Stock7 536 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 48WFBGA
|
paquet: 48-WFBGA |
Stock3 872 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 48WFBGA
|
paquet: 48-WFBGA |
Stock6 992 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Microchip Technology |
IC FLASH 2MBIT 33MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock6 000 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 33MHz | 20µs | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
||
Microchip Technology |
IC FLASH 2MBIT 20MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock70 800 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 20MHz | 20µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
||
Microchip Technology |
IC FLASH 2MBIT 20MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock52 248 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 20MHz | 20µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
||
Microchip Technology |
IC EEPROM 128KBIT 5MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 280 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 5MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 128KBIT 5MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 080 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 5MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |