Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Frequency | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Ratings | Mounting Type | Package / Case | Size / Dimension | Height - Seated (Max) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS 12.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead |
Stock3 996 |
|
12MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSCILLATOR MEMS 12.5MHZ CMOS SMD
|
paquet: 4-SMD, No Lead |
Stock8 262 |
|
12.5MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 24.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead |
Stock7 542 |
|
24MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | 0°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 30.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock8 496 |
|
30MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 50.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock7 866 |
|
50MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 24.576MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock5 634 |
|
24.576MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 16.384MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock6 606 |
|
16.384MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 10.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock7 884 |
|
10MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 148.5MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock4 842 |
|
148.5MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 65.536MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock8 946 |
|
65.536MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 42.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock5 922 |
|
42MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 32.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock4 176 |
|
32MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 25.0007MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock6 390 |
|
25.0007MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 18.432MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock7 434 |
|
18.432MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSCILLATOR MEMS 12.8MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 708 |
|
12.8MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 40.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 636 |
|
40MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 32.768MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 580 |
|
32.768MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 27.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock5 724 |
|
27MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 12.288MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock8 712 |
|
12.288MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 131.072MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock7 002 |
|
131.072MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 18.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock5 670 |
|
18MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSCILLATOR MEMS 2.44MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock6 012 |
|
2.44MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -20°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 25.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock5 598 |
|
25MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | 0°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 10.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock7 200 |
|
10MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | 0°C ~ 70°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 131.072MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock8 352 |
|
131.072MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | 0°C ~ 70°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSCILLATOR MEMS 3.57MHZ CMOS SMD
|
paquet: 4-SMD, No Lead |
Stock3 042 |
|
3.57MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 2.4576MHZ CMOS SMD
|
paquet: 4-SMD, No Lead |
Stock5 922 |
|
2.4576MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 1.8432MHZ CMOS SMD
|
paquet: 4-SMD, No Lead |
Stock3 348 |
|
1.8432MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |