Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Frequency | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Ratings | Mounting Type | Package / Case | Size / Dimension | Height - Seated (Max) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS 38.88MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock4 662 |
|
38.88MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 33.784MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 276 |
|
33.784MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 33.333MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock5 004 |
|
33.333MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 33.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock5 472 |
|
33MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 32.768MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock48 000 |
|
32.768MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 30.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock8 406 |
|
30MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 27.12MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock2 100 |
|
27.12MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 24.576MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock2 862 |
|
24.576MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 20.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock2 970 |
|
20MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 18.432MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock6 462 |
|
18.432MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 17.734MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 222 |
|
17.734MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 16.9988MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock6 426 |
|
16.9988MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSCILLATOR MEMS 16.5MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock7 434 |
|
16.5MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSCILLATOR MEMS 15.5MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 168 |
|
15.5MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 15.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock4 842 |
|
15MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSCILLATOR MEMS 14.5MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock5 148 |
|
14.5MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 14.318MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock4 356 |
|
14.318MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSCILLATOR MEMS 13.5MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 490 |
|
13.5MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSCILLATOR MEMS 12.8MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock4 014 |
|
12.8MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 11.2896MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 564 |
|
11.2896MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 8.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock72 000 |
|
8MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 4.1943MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock2 520 |
|
4.1943MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 4.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 564 |
|
4MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 2.048MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 870 |
|
2.048MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 66.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock4 572 |
|
66MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 40.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock5 544 |
|
40MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 33.333MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock5 760 |
|
33.333MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 30.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 276 |
|
30MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |