Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Frequency | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Ratings | Mounting Type | Package / Case | Size / Dimension | Height - Seated (Max) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS 29.4912MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock2 000 |
|
29.4912MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 105°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 27.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock8 298 |
|
27MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 105°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 26.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock8 046 |
|
26MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±50ppm | -40°C ~ 105°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 50.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock4 806 |
|
50MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 24.576MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock2 160 |
|
24.576MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 20.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock4 446 |
|
20MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 19.44MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock7 470 |
|
19.44MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 16.384MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock5 994 |
|
16.384MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 10.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock5 940 |
|
10MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 148.5MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock4 878 |
|
148.5MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 108.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock2 556 |
|
108MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 83.333MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 096 |
|
83.333MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 80.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 436 |
|
80MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSCILLATOR MEMS 77.7MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock5 274 |
|
77.7MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 75.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock2 430 |
|
75MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 74.25MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock6 786 |
|
74.25MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 74.25MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 834 |
|
74.25MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 73.728MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock2 646 |
|
73.728MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 66.66MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock2 934 |
|
66.66MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 65.55MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 060 |
|
65.55MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 65.536MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock36 000 |
|
65.536MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 60.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock6 714 |
|
60MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 55.296MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock3 780 |
|
55.296MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSCILLATOR MEMS 51.8MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock4 554 |
|
51.8MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 50.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock5 778 |
|
50MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 42.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock4 554 |
|
42MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 40.32MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock2 124 |
|
40.32MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
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Microchip Technology |
OSC MEMS 40.000MHZ CMOS SMD
|
paquet: 4-SMD, No Lead Exposed Pad |
Stock2 000 |
|
40MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |