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Produits Epson Electronics America Inc-Semiconductor Div

Dossiers 203
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S1F77600Y0A000L
Epson Electronics America Inc-Semiconductor Div

IC BATTERY LEAK PREVENTION SOT89

  • Function: -
  • Battery Chemistry: -
  • Number of Cells: -
  • Fault Protection: -
  • Interface: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: SOT-89-3
paquet: -
Stock2 576
S1D13A03B00B200
Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 121PFBGA

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 121-BGA
  • Supplier Device Package: -
paquet: 121-BGA
Stock2 976
S1D13748B00B100
Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 121BGA

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 121-TFBGA
  • Supplier Device Package: 121-PFBGA (10x10)
paquet: 121-TFBGA
Stock5 328
S1D13748F00A100
Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 144QFP

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 144-QFP
  • Supplier Device Package: 144-QFP20 (20x20)
paquet: 144-QFP
Stock5 616
S1D15712D01B000
Epson Electronics America Inc-Semiconductor Div

IC DRIVER LCD

  • Type: Display Driver
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: Die
  • Supplier Device Package: Chip
paquet: Die
Stock6 096
hot S1D13743F00A200
Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 144QFP

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-QFP (20x20)
paquet: 144-LQFP
Stock60 264
hot S1D13746F01A600
Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128QFP

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 128-LQFP
  • Supplier Device Package: 128-QFP15 (14x14)
paquet: 128-LQFP
Stock3 776
hot S1D13700F01A100
Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 64TQFP

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 64-TQFP
  • Supplier Device Package: -
paquet: 64-TQFP
Stock4 208
S1R720G0F00A000
Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 2.0 64-QFP

  • Protocol: -
  • Function: -
  • Interface: -
  • Standards: -
  • Voltage - Supply: 3.3V
  • Current - Supply: -
  • Operating Temperature: -
  • Package / Case: 64-QFP
  • Supplier Device Package: -
paquet: 64-QFP
Stock2 240
S1R72U16F14E200
Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 80QFP

  • Protocol: USB
  • Function: Host Controller
  • Interface: USB
  • Standards: USB 2.0
  • Voltage - Supply: 1.8V, 3.3V
  • Current - Supply: 65mA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-QFP (12x12)
paquet: 80-LQFP
Stock2 432
hot S1R72V17F00C200
Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 80QFP

  • Protocol: USB
  • Function: Host Controller
  • Interface: USB
  • Standards: USB 2.0
  • Voltage - Supply: 1.8V, 3.3V
  • Current - Supply: 39.3mA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-QFP (12x12)
paquet: 80-LQFP
Stock7 836
S1C17704B103100
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 144VFBGA

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 8.2MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: LCD, PWM, WDT
  • Number of I/O: 28
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -20°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 144-VFBGA
  • Supplier Device Package: -
paquet: 144-VFBGA
Stock5 712
S1C17F57D402000
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH DIE

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 4.2MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: PWM, WDT
  • Number of I/O: 29
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: Die
  • Supplier Device Package: -
paquet: Die
Stock6 112
S1C17W15F003100
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 64TQFP

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 4.2MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: LCD, POR, PWM, RFC, SNDA, WDT
  • Number of I/O: 27
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-TQFP
  • Supplier Device Package: 64-TQFP (10x10)
paquet: 64-TQFP
Stock4 784
S1C17W15D001000
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH DIE

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 4.2MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: LCD, POR, PWM, RFC, SNDA, WDT
  • Number of I/O: 35
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: Die
  • Supplier Device Package: Die
paquet: Die
Stock7 152
S1C17M13F101100
Epson Electronics America Inc-Semiconductor Div

16-BIT SNGL CHIP MICROCONTROLLER

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 16.8MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
  • Number of I/O: 38
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-TQFP
  • Supplier Device Package: 48-TQFP (7x7)
paquet: 48-TQFP
Stock2 688
S1C17M12F101100
Epson Electronics America Inc-Semiconductor Div

16-BIT SNGL CHIP MICROCONTROLLER

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 16.8MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
  • Number of I/O: 38
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-TQFP
  • Supplier Device Package: 48-TQFP (7x7)
paquet: 48-TQFP
Stock5 216
S1C17W34F001100
Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 128KB FLASH 12

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 568
S1C17W16F102100-90
Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 8KB

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 840
S1C17W18F102100
Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 128KB FLASH 8K

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock2 528
S1C17W04F102100-490
Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ32KB FLASH 2KB

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock4 736
S2D13P04B00B100-240
Epson Electronics America Inc-Semiconductor Div

CAMERA INTERFACE CHIP WITH 4 CHA

  • Type: Graphic Controller
  • Applications: LCD Display
  • Mounting Type: Surface Mount
  • Package / Case: 121-TFBGA
  • Supplier Device Package: 121-PFBGA (10x10)
paquet: 121-TFBGA
Stock2 800
S1C17M20F001100
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 16KB FLASH 24SQFN4

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 21MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
  • Number of I/O: -
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
  • Data Converters: A/D 12b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-SQFN4 (4x4)
paquet: -
Request a Quote
S1C17M24F001100
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 32TQFP15

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 21MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
  • Number of I/O: 23
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
  • Data Converters: A/D 6x12b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 32-TQFP
  • Supplier Device Package: 32-TQFP15 (7x7)
paquet: -
Request a Quote
S1C31D01F101000-119
Epson Electronics America Inc-Semiconductor Div

IC MCU 32BIT 256KB FLSH 80TQFP14

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit
  • Speed: 21MHz
  • Connectivity: I2C, IrDA, QSPI, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT
  • Number of I/O: 57
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
  • Data Converters: A/D 8x12b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 80-TQFP
  • Supplier Device Package: 80-TQFP14 (12x12)
paquet: -
Request a Quote
S1C17M20F001100-490
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 16KB FLASH 24SQFN4

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 21MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
  • Number of I/O: -
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
  • Data Converters: A/D 12b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-SQFN4 (4x4)
paquet: -
Request a Quote
S1D13C00F00C100-160
Epson Electronics America Inc-Semiconductor Div

S1D13C00 MEMORY DISPLAY CONTROLL

  • Type: Interface
  • Applications: Video Display
  • Mounting Type: Surface Mount
  • Package / Case: 64-TQFP
  • Supplier Device Package: 64-TQFP13 (10x10)
paquet: -
Request a Quote
S1C17M30F001100-250
Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 48KB FLASH 48TQFP12

  • Core Processor: S1C17
  • Core Size: 16-Bit
  • Speed: 17.12MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT
  • Number of I/O: 37
  • Program Memory Size: 48KB (48K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
  • Data Converters: A/D 3x12b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-TQFP
  • Supplier Device Package: 48-TQFP12 (7x7)
paquet: -
Request a Quote