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Produits Xilinx Inc.

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XCZU7EV-3FBVB900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock6 864
XCZU5EV-2SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock5 648
XCZU3EG-2SFVA625E
Xilinx Inc.

IC FPGA 180 I/O 625FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)
paquet: 625-BFBGA, FCBGA
Stock4 752
hot XC2V3000-5FF1152I
Xilinx Inc.

IC FPGA 720 I/O 1152FCBGA

  • Number of LABs/CLBs: 3584
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 1769472
  • Number of I/O: 720
  • Number of Gates: 3000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-CFCBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock3 408
XC2V250-5FGG256C
Xilinx Inc.

IC FPGA 172 I/O 256FBGA

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 442368
  • Number of I/O: 172
  • Number of Gates: 250000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock7 664
hot XC2S600E-6FGG456C
Xilinx Inc.

IC FPGA 329 I/O 456FBGA

  • Number of LABs/CLBs: 3456
  • Number of Logic Elements/Cells: 15552
  • Total RAM Bits: 294912
  • Number of I/O: 329
  • Number of Gates: 600000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
paquet: 456-BBGA
Stock8 556
XCV1600E-6BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 404
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
paquet: 560-LBGA, Metal
Stock4 912
hot XCS30XL-4TQ144I
Xilinx Inc.

IC FPGA 113 I/O 144TQFP

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 113
  • Number of Gates: 30000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock7 120
XC4044XL-09HQ160C
Xilinx Inc.

IC FPGA 129 I/O 160HQFP

  • Number of LABs/CLBs: 1600
  • Number of Logic Elements/Cells: 3800
  • Total RAM Bits: 51200
  • Number of I/O: 129
  • Number of Gates: 44000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 160-BQFP Exposed Pad
  • Supplier Device Package: 160-PQFP (28x28)
paquet: 160-BQFP Exposed Pad
Stock5 568
XC4013XL-2HT176I
Xilinx Inc.

IC FPGA 145 I/O 176HTQFP

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 145
  • Number of Gates: 13000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-TQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock3 360
hot XC4013XL-1BG256C
Xilinx Inc.

IC FPGA 192 I/O 256BGA

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 192
  • Number of Gates: 13000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
paquet: 256-BBGA
Stock18 180
hot XC4006E-4PG156I
Xilinx Inc.

IC FPGA 125 I/O 156CPGA

  • Number of LABs/CLBs: 256
  • Number of Logic Elements/Cells: 608
  • Total RAM Bits: 8192
  • Number of I/O: 125
  • Number of Gates: 6000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Through Hole
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 156-BCPGA
  • Supplier Device Package: 156-CPGA (42.17x42.17)
paquet: 156-BCPGA
Stock6 528
XC4006E-2TQ144C
Xilinx Inc.

IC FPGA 113 I/O 144TQFP

  • Number of LABs/CLBs: 256
  • Number of Logic Elements/Cells: 608
  • Total RAM Bits: 8192
  • Number of I/O: 113
  • Number of Gates: 6000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock7 904
XC4003E-1PG120C
Xilinx Inc.

IC FPGA 80 I/O 120CPGA

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 80
  • Number of Gates: 3000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Through Hole
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 120-BCPGA
  • Supplier Device Package: 120-CPGA (34.55x34.55)
paquet: 120-BCPGA
Stock3 888
hot XC2S15-5CS144C
Xilinx Inc.

IC FPGA 86 I/O 144CSBGA

  • Number of LABs/CLBs: 96
  • Number of Logic Elements/Cells: 432
  • Total RAM Bits: 16384
  • Number of I/O: 86
  • Number of Gates: 15000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
paquet: 144-TFBGA, CSPBGA
Stock93 204
XC6VLX760-L1FFG1760I
Xilinx Inc.

IC FPGA 1200 I/O 1760FBGA

  • Number of LABs/CLBs: 59280
  • Number of Logic Elements/Cells: 758784
  • Total RAM Bits: 26542080
  • Number of I/O: 1200
  • Number of Gates: -
  • Voltage - Supply: 0.91 V ~ 0.97 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock7 776
XC7VX1140T-1FLG1928I
Xilinx Inc.

IC FPGA 480 I/O 1928FCBGA

  • Number of LABs/CLBs: 89000
  • Number of Logic Elements/Cells: 1139200
  • Total RAM Bits: 69304320
  • Number of I/O: 480
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1928-FCBGA (45x45)
paquet: 1924-BBGA, FCBGA
Stock5 216
XC5VLX155T-2FF1738I
Xilinx Inc.

IC FPGA 680 I/O 1738FCBGA

  • Number of LABs/CLBs: 12160
  • Number of Logic Elements/Cells: 155648
  • Total RAM Bits: 7815168
  • Number of I/O: 680
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1738-BBGA, FCBGA
  • Supplier Device Package: 1738-FCBGA (42.5x42.5)
paquet: 1738-BBGA, FCBGA
Stock3 584
XC6VLX550T-L1FF1759C
Xilinx Inc.

IC FPGA 840 I/O 1759FCBGA

  • Number of LABs/CLBs: 42960
  • Number of Logic Elements/Cells: 549888
  • Total RAM Bits: 23298048
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1759-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock4 576
XC5VLX155-2FF1760I
Xilinx Inc.

IC FPGA 800 I/O 1760FBGA

  • Number of LABs/CLBs: 12160
  • Number of Logic Elements/Cells: 155648
  • Total RAM Bits: 7077888
  • Number of I/O: 800
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock6 688
XCKU060-2FFVA1517I
Xilinx Inc.

IC FPGA 624 I/O 1517FCBGA

  • Number of LABs/CLBs: 41460
  • Number of Logic Elements/Cells: 725550
  • Total RAM Bits: 38912000
  • Number of I/O: 624
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock3 568
XC2VP40-5FGG676I
Xilinx Inc.

IC FPGA 416 I/O 676FBGA

  • Number of LABs/CLBs: 4848
  • Number of Logic Elements/Cells: 43632
  • Total RAM Bits: 3538944
  • Number of I/O: 416
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
paquet: 676-BGA
Stock4 464
XA7A50T-1CSG324Q
Xilinx Inc.

IC FPGA 210 I/O 324BGA

  • Number of LABs/CLBs: 4075
  • Number of Logic Elements/Cells: 52160
  • Total RAM Bits: 2764800
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
paquet: 324-LFBGA, CSPBGA
Stock3 568
hot XC3S500E-4FTG256C
Xilinx Inc.

IC FPGA 190 I/O 256FTBGA

  • Number of LABs/CLBs: 1164
  • Number of Logic Elements/Cells: 10476
  • Total RAM Bits: 368640
  • Number of I/O: 190
  • Number of Gates: 500000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock36 060
hot XC6SLX9-2CSG225C
Xilinx Inc.

IC FPGA 160 I/O 225CSBGA

  • Number of LABs/CLBs: 715
  • Number of Logic Elements/Cells: 9152
  • Total RAM Bits: 589824
  • Number of I/O: 160
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 225-LFBGA, CSPBGA
  • Supplier Device Package: 225-CSPBGA (13x13)
paquet: 225-LFBGA, CSPBGA
Stock374 220
hot XC2S30-5TQG144C
Xilinx Inc.

IC FPGA 92 I/O 144TQFP

  • Number of LABs/CLBs: 216
  • Number of Logic Elements/Cells: 972
  • Total RAM Bits: 24576
  • Number of I/O: 92
  • Number of Gates: 30000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock35 820
XC9572-7PQG100C
Xilinx Inc.

IC CPLD 72MC 7.5NS 100QFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 72
  • Number of Gates: 1600
  • Number of I/O: 72
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-BQFP
  • Supplier Device Package: 100-PQFP (14x20)
paquet: 100-BQFP
Stock4 256
hot XC2C512-7FT256I
Xilinx Inc.

IC CPLD 512MC 7.1NS 256BGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.1ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 32
  • Number of Macrocells: 512
  • Number of Gates: 12000
  • Number of I/O: 212
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock17 328