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Produits Xilinx Inc.

Dossiers 7 167
Page  178/256
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hot XC17S200APDG8I
Xilinx Inc.

IC PROM SER 200K I-TEMP 8-DIP

  • Programmable Type: OTP
  • Memory Size: 2Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
paquet: 8-DIP (0.300", 7.62mm)
Stock6 336
hot XC17S15AVO8C
Xilinx Inc.

IC PROM SER 5K 8-SOIC

  • Programmable Type: OTP
  • Memory Size: 150kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-TSOP
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock127 392
hot XC1765EPD8I
Xilinx Inc.

IC PROM SER I-TEMP 3.3V 8-DIP

  • Programmable Type: OTP
  • Memory Size: 65kb
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
paquet: 8-DIP (0.300", 7.62mm)
Stock13 800
XC18V01SO20C0100
Xilinx Inc.

RE-PROGRAMMABLE 1MB PROM

  • Programmable Type: In System Programmable
  • Memory Size: 1Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
paquet: 20-SOIC (0.295", 7.50mm Width)
Stock4 832
XCZU4CG-L1SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock3 168
XC6SLX25T-N3FG484C
Xilinx Inc.

IC FPGA 250 I/O 484FBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 250
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock4 864
XC2V2000-5FFG896I
Xilinx Inc.

IC FPGA 624 I/O 896FCBGA

  • Number of LABs/CLBs: 2688
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 1032192
  • Number of I/O: 624
  • Number of Gates: 2000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FCBGA (31x31)
paquet: 896-BBGA, FCBGA
Stock3 296
XC2V1000-5BGG575C
Xilinx Inc.

IC FPGA 328 I/O 575MBGA

  • Number of LABs/CLBs: 1280
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 737280
  • Number of I/O: 328
  • Number of Gates: 1000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 575-BBGA
  • Supplier Device Package: 575-BGA (31x31)
paquet: 575-BBGA
Stock5 504
XC3S1500L-4FGG456C
Xilinx Inc.

IC FPGA 333 I/O 456FBGA

  • Number of LABs/CLBs: 2816
  • Number of Logic Elements/Cells: 29952
  • Total RAM Bits: 589824
  • Number of I/O: 333
  • Number of Gates: 1500000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
paquet: 456-BBGA
Stock4 512
hot XCV400-6FG676C
Xilinx Inc.

IC FPGA 404 I/O 676FBGA

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 10800
  • Total RAM Bits: 81920
  • Number of I/O: 404
  • Number of Gates: 468252
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock6 192
hot XCS30XL-5TQ144C
Xilinx Inc.

IC FPGA 113 I/O 144TQFP

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 113
  • Number of Gates: 30000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock18 000
hot XC3042-100PC84C
Xilinx Inc.

IC FPGA 74 I/O 84PLCC

  • Number of LABs/CLBs: 144
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 30784
  • Number of I/O: 74
  • Number of Gates: 3000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
paquet: 84-LCC (J-Lead)
Stock18 648
XQ5VFX130T-1EF1738I4156
Xilinx Inc.

IC FPGA VIRTEX 5 130K 1738FFGBGA

  • Number of LABs/CLBs: 10240
  • Number of Logic Elements/Cells: 131072
  • Total RAM Bits: 10985472
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1738-BBGA, FCBGA
  • Supplier Device Package: 1738-FCBGA (42.5x42.5)
paquet: 1738-BBGA, FCBGA
Stock5 280
hot XC4VFX140-10FF1517C
Xilinx Inc.

IC FPGA 768 I/O 1517FCBGA

  • Number of LABs/CLBs: 15792
  • Number of Logic Elements/Cells: 142128
  • Total RAM Bits: 10174464
  • Number of I/O: 768
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock8 088
XQ6VLX240T-1RF1156M
Xilinx Inc.

IC FPGA VIRTEX 6 241K 1156-BGA

  • Number of LABs/CLBs: 18840
  • Number of Logic Elements/Cells: 241152
  • Total RAM Bits: 15335424
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock3 360
XC6VLX130T-L1FFG784I
Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

  • Number of LABs/CLBs: 10000
  • Number of Logic Elements/Cells: 128000
  • Total RAM Bits: 9732096
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.91 V ~ 0.97 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (29x29)
paquet: 784-BBGA, FCBGA
Stock4 704
XC6VLX75T-L1FFG484C
Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

  • Number of LABs/CLBs: 5820
  • Number of Logic Elements/Cells: 74496
  • Total RAM Bits: 5750784
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock7 776
XC2VP7-5FF896I
Xilinx Inc.

IC FPGA 396 I/O 896FCBGA

  • Number of LABs/CLBs: 1232
  • Number of Logic Elements/Cells: 11088
  • Total RAM Bits: 811008
  • Number of I/O: 396
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FCBGA (31x31)
paquet: 896-BBGA, FCBGA
Stock7 104
XC2VP2-6FF672C
Xilinx Inc.

IC FPGA 204 I/O 672FCBGA

  • Number of LABs/CLBs: 352
  • Number of Logic Elements/Cells: 3168
  • Total RAM Bits: 221184
  • Number of I/O: 204
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FCBGA (27x27)
paquet: 672-BBGA, FCBGA
Stock7 792
hot XC3S1500-4FGG320I
Xilinx Inc.

IC FPGA 221 I/O 320 FBGA

  • Number of LABs/CLBs: 3328
  • Number of Logic Elements/Cells: 29952
  • Total RAM Bits: 589824
  • Number of I/O: 221
  • Number of Gates: 1500000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 320-BGA
  • Supplier Device Package: 320-FBGA (19x19)
paquet: 320-BGA
Stock13 320
XC6SLX25-N3FGG484I
Xilinx Inc.

IC FPGA 266 I/O 484FBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 266
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock6 256
hot XC3S400-4FGG320I
Xilinx Inc.

IC FPGA 221 I/O 320 FBGA

  • Number of LABs/CLBs: 896
  • Number of Logic Elements/Cells: 8064
  • Total RAM Bits: 294912
  • Number of I/O: 221
  • Number of Gates: 400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 320-BGA
  • Supplier Device Package: 320-FBGA (19x19)
paquet: 320-BGA
Stock6 336
XC3S200A-4FG320I
Xilinx Inc.

IC FPGA 248 I/O 320FBGA

  • Number of LABs/CLBs: 448
  • Number of Logic Elements/Cells: 4032
  • Total RAM Bits: 294912
  • Number of I/O: 248
  • Number of Gates: 200000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 320-BGA
  • Supplier Device Package: 320-FBGA (19x19)
paquet: 320-BGA
Stock5 984
hot XC6SLX150-2FGG484C
Xilinx Inc.

IC FPGA 338 I/O 484FBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 338
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock23 616
XCR3384XL-10PQG208C
Xilinx Inc.

IC CPLD 384MC 9NS 208QFP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 24
  • Number of Macrocells: 384
  • Number of Gates: 9000
  • Number of I/O: 172
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock2 336
hot XC9536XL-7CSG48C
Xilinx Inc.

IC CPLD 36MC 7.5NS 48CSBGA

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 36
  • Number of Gates: 800
  • Number of I/O: 36
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-FBGA, CSPBGA
  • Supplier Device Package: 48-CSBGA (7x7)
paquet: 48-FBGA, CSPBGA
Stock7 936
hot XC2C256-7VQG100I
Xilinx Inc.

IC CPLD 256MC 6.7NS 100VQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.7ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 80
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
paquet: 100-TQFP
Stock35 016
hot XC95288XL-10PQ208C
Xilinx Inc.

IC CPLD 288 MCELL C-TEMP 208PQFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 10ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 288
  • Number of Gates: 6400
  • Number of I/O: 168
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock4 304