Page 184 - Produits Xilinx Inc. | Heisener Electronics
Contactez nous
SalesDept@heisener.com +86-755-83210559 ext. 807
Connexion/S'inscrire
Language Translation

* Please refer to the English Version as our Official Version.

BOM
Chariot 0

Produits Xilinx Inc.

Dossiers 7 167
Page  184/256
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
XCMECH-FFG1517
Xilinx Inc.

FFG1517 MECHANICAL SAMPLE

  • Type: Mechanical Sample
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock4 544
hot XC18V512VQ44I
Xilinx Inc.

IC PROM SER I-TEMP 3.3V 44-VQFP

  • Programmable Type: In System Programmable
  • Memory Size: 512kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-VQFP (10x10)
paquet: 44-TQFP
Stock5 776
XCZU17EG-1FFVD1760I
Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock2 016
XCZU5CG-L1SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock5 968
XC7Z035-1FFG676C
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock7 056
XCV600E-7FG900C
Xilinx Inc.

IC FPGA 512 I/O 900FBGA

  • Number of LABs/CLBs: 3456
  • Number of Logic Elements/Cells: 15552
  • Total RAM Bits: 294912
  • Number of I/O: 512
  • Number of Gates: 985882
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
paquet: 900-BBGA
Stock2 096
hot XCV50E-7FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 65536
  • Number of I/O: 176
  • Number of Gates: 71693
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock6 576
hot XCV2600E-8FG1156C
Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

  • Number of LABs/CLBs: 12696
  • Number of Logic Elements/Cells: 57132
  • Total RAM Bits: 753664
  • Number of I/O: 804
  • Number of Gates: 3263755
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
paquet: 1156-BBGA
Stock5 584
hot XCV200-4BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 260
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
paquet: 352-LBGA, Metal
Stock6 300
hot XCS40XL-4CS280C
Xilinx Inc.

IC FPGA 224 I/O 280CSBGA

  • Number of LABs/CLBs: 784
  • Number of Logic Elements/Cells: 1862
  • Total RAM Bits: 25088
  • Number of I/O: 224
  • Number of Gates: 40000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 280-TFBGA, CSPBGA
  • Supplier Device Package: 280-CSBGA (16x16)
paquet: 280-TFBGA, CSPBGA
Stock10 236
hot XC4010E-2PG191C
Xilinx Inc.

IC FPGA 160 I/O 191CPGA

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 160
  • Number of Gates: 10000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Through Hole
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 191-BCPGA
  • Supplier Device Package: 191-CPGA (47.25x47.25)
paquet: 191-BCPGA
Stock6 544
XCVU125-2FLVD1517I
Xilinx Inc.

IC FPGA 338 I/O 1517FCBGA

  • Number of LABs/CLBs: 89520
  • Number of Logic Elements/Cells: 1566600
  • Total RAM Bits: 90726400
  • Number of I/O: 338
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock3 552
XQ6VSX315T-2RF1759I
Xilinx Inc.

IC FPGA VIRTEX 6 314K 1759-BGA

  • Number of LABs/CLBs: 24600
  • Number of Logic Elements/Cells: 314880
  • Total RAM Bits: 25952256
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1759-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock5 104
hot XC2VP70-6FF1517I
Xilinx Inc.

IC FPGA 964 I/O 1517FCBGA

  • Number of LABs/CLBs: 8272
  • Number of Logic Elements/Cells: 74448
  • Total RAM Bits: 6045696
  • Number of I/O: 964
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock5 904
XC6VLX240T-L1FFG1759C
Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

  • Number of LABs/CLBs: 18840
  • Number of Logic Elements/Cells: 241152
  • Total RAM Bits: 15335424
  • Number of I/O: 720
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1759-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock2 352
XQ6VLX130T-L1FFG1156I
Xilinx Inc.

IC FPGA VIRTEX 6 128K 1156-BGA

  • Number of LABs/CLBs: 10000
  • Number of Logic Elements/Cells: 128000
  • Total RAM Bits: 9732096
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.91 V ~ 0.97 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock5 472
XC5VLX50T-2FF1136C
Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

  • Number of LABs/CLBs: 3600
  • Number of Logic Elements/Cells: 46080
  • Total RAM Bits: 2211840
  • Number of I/O: 480
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1136-BBGA, FCBGA
  • Supplier Device Package: 1136-FCBGA (35x35)
paquet: 1136-BBGA, FCBGA
Stock2 416
hot XC3S4000-5FG900C
Xilinx Inc.

IC FPGA 633 I/O 900FBGA

  • Number of LABs/CLBs: 6912
  • Number of Logic Elements/Cells: 62208
  • Total RAM Bits: 1769472
  • Number of I/O: 633
  • Number of Gates: 4000000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
paquet: 900-BBGA
Stock4 400
hot XC3S5000-4FGG676I
Xilinx Inc.

IC FPGA 489 I/O 676FBGA

  • Number of LABs/CLBs: 8320
  • Number of Logic Elements/Cells: 74880
  • Total RAM Bits: 1916928
  • Number of I/O: 489
  • Number of Gates: 5000000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
paquet: 676-BGA
Stock7 476
hot XC3S500E-4FG320C
Xilinx Inc.

IC FPGA 232 I/O 320FBGA

  • Number of LABs/CLBs: 1164
  • Number of Logic Elements/Cells: 10476
  • Total RAM Bits: 368640
  • Number of I/O: 232
  • Number of Gates: 500000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 320-BGA
  • Supplier Device Package: 320-FBGA (19x19)
paquet: 320-BGA
Stock4 480
XA6SLX16-2CSG324I
Xilinx Inc.

IC FPGA 232 I/O 324CSGBGA

  • Number of LABs/CLBs: 1139
  • Number of Logic Elements/Cells: 14579
  • Total RAM Bits: 589824
  • Number of I/O: 232
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
paquet: 324-LFBGA, CSPBGA
Stock3 616
hot XC3S400A-5FTG256C
Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

  • Number of LABs/CLBs: 896
  • Number of Logic Elements/Cells: 8064
  • Total RAM Bits: 368640
  • Number of I/O: 195
  • Number of Gates: 400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock6 480
XC7K410T-1FBG676C
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 31775
  • Number of Logic Elements/Cells: 406720
  • Total RAM Bits: 29306880
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock4 480
hot XC9536-5VQ44C
Xilinx Inc.

IC CPLD 36MC 5NS 44VQFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 5.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 36
  • Number of Gates: 800
  • Number of I/O: 34
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-VQFP (10x10)
paquet: 44-TQFP
Stock20 160
hot XC2C512-7FTG256I
Xilinx Inc.

IC CPLD 512MC 7.1NS 256FTBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.1ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 32
  • Number of Macrocells: 512
  • Number of Gates: 12000
  • Number of I/O: 212
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock5 520
hot XCR3064XL-10CS48C
Xilinx Inc.

IC CPLD 64MC 9.1NS 48CSP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.1ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1500
  • Number of I/O: 40
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-FBGA, CSPBGA
  • Supplier Device Package: 48-CSBGA (7x7)
paquet: 48-FBGA, CSPBGA
Stock2 000
hot XCR3032XL-10CS48I
Xilinx Inc.

IC CPLD 32MC 9.1NS 48CSP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.1ns
  • Voltage Supply - Internal: 2.7 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 32
  • Number of Gates: 750
  • Number of I/O: 36
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-FBGA, CSPBGA
  • Supplier Device Package: 48-CSBGA (7x7)
paquet: 48-FBGA, CSPBGA
Stock16 404
XAZU3EG-1SFVA625Q
Xilinx Inc.

XAZU3EG-1SFVA625Q

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 424