Produits NXP

BLP7G22-10,135

NXP

TRANSISTOR DRIVER LDMOS 12HVSON

• Transistor Type: LDMOS
• Frequency: 700MHz ~ 2.2GHz
• Gain: 27dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 110mA
• Power - Output: 2W
• Voltage - Rated: 65V
• Package / Case: 12-VDFN Exposed Pad
• Supplier Device Package: 12-HVSON (5x6)

paquet: 12-VDFN Exposed Pad

MRF7S21210HR3

NXP

FET RF 65V 2.17GHZ NI-780

• Transistor Type: LDMOS
• Frequency: 2.17GHz
• Gain: 18.5dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.4A
• Power - Output: 63W
• Voltage - Rated: 65V
• Package / Case: NI-780
• Supplier Device Package: NI-780

paquet: NI-780

MRF7S24250NR3

NXP

TRANS RF LDMOS 250W 32V

• Transistor Type: LDMOS
• Frequency: 2.45GHz
• Gain: 14.7dB
• Voltage - Test: 30V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 256W
• Voltage - Rated: 65V
• Package / Case: OM-780-2
• Supplier Device Package: OM-780-2

paquet: OM-780-2

LD6806CX4/33H,315

NXP

IC REG LINEAR 3.3V 200MA 4WLCSP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 3.3V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.1V @ 200mA
• Current - Output: 200mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 4-XFBGA, WLCSP
• Supplier Device Package: 4-WLCSP (0.76x0.76)

paquet: 4-XFBGA, WLCSP

74ABT574AN,112

NXP

IC D-TYPE POS TRG SNGL 20DIP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 400MHz
• Max Propagation Delay @ V, Max CL: 4.7ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 250µA
• Input Capacitance: 3pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)

paquet: 20-DIP (0.300", 7.62mm)

HEF40374BT,653

NXP

IC D-TYPE POS TRG SNGL 20SOIC

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 17MHz
• Max Propagation Delay @ V, Max CL: 80ns @ 15V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 50mA, 62mA
• Voltage - Supply: 3 V ~ 15 V
• Current - Quiescent (Iq): -
• Input Capacitance: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)

paquet: 20-SOIC (0.295", 7.50mm Width)

TDF8548AJ/N1U

NXP

IC AUDIO DEVICE DBS27P

• Type: Class AB
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 28W x 4 @ 4 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Short-Circuit and Thermal Protection
• Mounting Type: Through Hole
• Operating Temperature: -
• Supplier Device Package: DBS27P
• Package / Case: 27-SIP, Formed Leads

paquet: 27-SIP, Formed Leads

PCA9543APW,112

NXP

IC I2C SWITCH 2CH 14TSSOP

• Applications: 2-Channel I2C Multiplexer
• Interface: I2C
• Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 14-TSSOP
• Mounting Type: Surface Mount

paquet: 14-TSSOP (0.173", 4.40mm Width)

PTN5150AHXMP

NXP

IC USB HOST CTLR 12X2QFN

• Protocol: USB
• Function: Controller
• Interface: USB
• Standards: -
• Voltage - Supply: 2.7 V ~ 5.5 V
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 12-XFQFN
• Supplier Device Package: 12-X2QFN (1.6x1.6)

paquet: 12-XFQFN

P5020NSE1TNB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 2.0GHz
• Co-Processors/DSP: Security; SEC 4.2
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

paquet: 1295-BBGA, FCBGA

MPC8347VVAJF

NXP

IC MPU MPC83XX 533MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

paquet: 672-LBGA

XPC850SRCVR66BU

NXP

IC MPU MPC8XX 66MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

paquet: 256-BBGA

MPC8347CZQAGDB

NXP

IC MPU MPC83XX 400MHZ 620BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

paquet: 620-BBGA Exposed Pad

MPC8313EZQAFFC

NXP

IC MPU MPC83XX 333MHZ 516BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: Security; SEC 2.2
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 516-BBGA Exposed Pad
• Supplier Device Package: 516-TEPBGA (27x27)

paquet: 516-BBGA Exposed Pad

MC9S08RD32CFJE

NXP

IC MCU 8BIT 32KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

SPC5676RDK3MVU1

NXP

IC MCU 32BIT 6MB FLASH 416BGA

• Core Processor: e200z7
• Core Size: 32-Bit Dual-Core
• Speed: 180MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: DMA, POR, PWM
• Number of I/O: -
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
• Data Converters: A/D 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BBGA
• Supplier Device Package: 416-PBGA (27x27)

paquet: 416-BBGA

MCF5251VM140

NXP

IC MCU 32BIT ROMLESS 225MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 140MHz
• Connectivity: ATA, Audio, CAN, EBI/EMI, I2C, IDE, SD, SPI, UART/USART, USB OTG
• Peripherals: DMA
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V
• Data Converters: A/D 6x12b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 225-LFBGA
• Supplier Device Package: 225-MAPBGA (13x13)

paquet: 225-LFBGA

S912XEG128J2CAA

NXP

IC MCU 16BIT 128KB FLASH 80QFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

paquet: 80-QFP

MFA100FBD48/01QL

NXP

IC AUDIO DEVICE 48LQFP

• Function: -
• Applications: -
• Number of Channels: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Specifications: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

SLRC61002HN,557

NXP

IC TXRX CONTACTLESS READ 32HVQFN

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 15693, ISO 18000-3
• Interface: I2C, SPI, UART
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

paquet: 32-VFQFN Exposed Pad

HTSICC5601EW/C7,02

NXP

TRANSPONDER RFIC HITAG S UNCASED

• Type: RFID Transponder
• Frequency: 100kHz ~ 150kHz
• Standards: -
• Interface: -
• Voltage - Supply: 3.5V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: Die
• Supplier Device Package: Die

paquet: Die

PN7462AUHN/C300Y

NXP

IC RFID READER 13.56MHZ 64HVQFN

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443, ISO 15693, ISO 18000-3
• Interface: I2C, SPI, UART
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-VFQFN Dual Rows Exposed Pad
• Supplier Device Package: 64-HVQFN (9x9)

paquet: 64-VFQFN Dual Rows Exposed Pad

PNEV7462BM

NXP

EVAL BOARD FOR PN7462

• Type: Near Field Communication
• Frequency: -
• For Use With/Related Products: PN7462
• Supplied Contents: Board

paquet: -

13226PRO-DBG

NXP

KIT DEV PRO ZIGBEE 1322X

• Type: Transceiver; 802.15.4 (ZigBee?)
• Frequency: 2.4GHz
• For Use With/Related Products: MC1322x
• Supplied Contents: -

paquet: -

LX2120SN72029B

NXP

IC MPU QORLQ LX2 2GHZ 1517FCPBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 12 Core, 64-Bit
• Speed: 2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: -
• Ethernet: 100Gbps (2)
• SATA: SATA 3.0 (4)
• USB: USB 3.0 (2) + PHY (2)
• Voltage - I/O: 1.2V, 1.8V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TJ)
• Security Features: Secure Boot, TrustZone®
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCPBGA (40x40)

paquet: -

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FD32K146HBT0VLHR

NXP

S32K146, M4F, FLASH 1M, LIMITED

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

Request a Quote

FC32K144UAT0VLLT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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MMRF1317H-1030

NXP

RF MOSFET LDMOS 50V NI1230

• Transistor Type: LDMOS (Dual)
• Frequency: 1.03GHz ~ 1.09GHz
• Gain: 18.2dB
• Voltage - Test: 50 V
• Current Rating: 10µA
• Noise Figure: -
• Current - Test: 100 mA
• Power - Output: 1500W
• Voltage - Rated: 105 V
• Package / Case: SOT-979A
• Supplier Device Package: NI-1230-4H

paquet: -

Request a Quote