Produits NXP

TEA1532AT/N1,118

NXP

IC PFC CONTROLLER CCM 8SOIC

• Mode: Continuous Conduction (CCM)
• Frequency - Switching: 50kHz ~ 75kHz
• Current - Startup: 1.2mA
• Voltage - Supply: 8.7 V ~ 20 V
• Operating Temperature: -25°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

74LVC841APW,112

NXP

IC 10BIT TRANSP LATCH 24TSSOP

• Logic Type: D-Type Transparent Latch
• Circuit: 10:10
• Output Type: Tri-State
• Voltage - Supply: 2.7 V ~ 3.6 V
• Independent Circuits: 1
• Delay Time - Propagation: 1.5ns
• Current - Output High, Low: 24mA, 24mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

paquet: 24-TSSOP (0.173", 4.40mm Width)

74LVC38ABQ,115

NXP

IC GATE NAND 4CH 2-INP 14-DHVQFN

• Logic Type: NAND Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: Open Drain
• Voltage - Supply: 1.2 V ~ 5.5 V
• Current - Quiescent (Max): 40µA
• Current - Output High, Low: -, 32mA
• Logic Level - Low: 0.7 V ~ 0.8 V
• Logic Level - High: 1.7 V ~ 2 V
• Max Propagation Delay @ V, Max CL: 2.3ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-DHVQFN (2.5x3)
• Package / Case: 14-VFQFN Exposed Pad

paquet: 14-VFQFN Exposed Pad

74HC14N,652

NXP

IC HEX INVERTER SCHM TRIG 14DIP

• Logic Type: Inverter
• Number of Circuits: 6
• Number of Inputs: 6
• Features: Schmitt Trigger
• Voltage - Supply: 2 V ~ 6 V
• Current - Quiescent (Max): 2µA
• Current - Output High, Low: 5.2mA, 5.2mA
• Logic Level - Low: 0.3 V ~ 1.2 V
• Logic Level - High: 1.5 V ~ 4.2 V
• Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Supplier Device Package: 14-DIP
• Package / Case: 14-DIP (0.300", 7.62mm)

paquet: 14-DIP (0.300", 7.62mm)

CGY887B,112

NXP

IC PUSH-PULL AMP 860MHZ SOT115J

• Applications: CATV
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 310mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Mounting Type: -
• Package / Case: SOT-115J
• Supplier Device Package: SOT115J

paquet: SOT-115J

NE5232D/01,112

NXP

IC OPAMP GP 2.5MHZ RRO 8SO

• Amplifier Type: General Purpose
• Number of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 0.8 V/µs
• Gain Bandwidth Product: -
• -3db Bandwidth: 2.5MHz
• Current - Input Bias: 90nA
• Voltage - Input Offset: 200µV
• Current - Supply: 1.4mA
• Current - Output / Channel: 12mA
• Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

SC18IS602IPW,112

NXP

IC BRIDGE SPI/I2C 16-TSSOP

• Protocol: I2C
• Function: Controller
• Interface: SPI
• Standards: -
• Voltage - Supply: 2.4 V ~ 3.6 V
• Current - Supply: 11mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

paquet: 16-TSSOP (0.173", 4.40mm Width)

MPC8379VRAJF

NXP

IC MPU MPC83XX 533MHZ 689TEBGA

• Core Processor: PowerPC e300c4s
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (4)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

paquet: 689-BBGA Exposed Pad

MPC8323EVRADDCA

NXP

IC MPU MPC83XX 266MHZ 516BGA

• Core Processor: PowerPC e300c2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

paquet: 516-BBGA

MVF60NS151CMK40

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

• Core Processor: ARM? Cortex?-A5 + Cortex?-M4
• Core Size: 32-Bit Dual-Core
• Speed: 400MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
• Peripherals: DMA, LVD, WDT
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 1.5MB
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D Dual x 12b, D/A Dual x 12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 364-LFBGA
• Supplier Device Package: 364-MAPBGA (17x17)

paquet: 364-LFBGA

MCF5234CVM100J

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number of I/O: 97
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPBGA

paquet: 256-LBGA

MC908QC8VDSE

NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 16
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

paquet: 20-TSSOP (0.173", 4.40mm Width)

LPC1837JET256,551

NXP

IC MCU 32BIT 1MB FLASH 256LBGA

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 164
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 16K x 8
• RAM Size: 136K x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-LBGA (17x17)

paquet: 256-LBGA

MC9S08DZ96CLL

NXP

IC MCU 8BIT 96KB FLASH 100LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 87
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

MC9S12XDT256CAL

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

XC56309VL100A

NXP

IC DSP 24BIT 100MHZ 196-MAPBGA

• Type: Fixed Point
• Interface: Host Interface, SSI, SCI
• Clock Rate: 100MHz
• Non-Volatile Memory: ROM (576 B)
• On-Chip RAM: 24kB
• Voltage - I/O: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

paquet: 196-LBGA

MPC962305D-1

NXP

IC CLOCK BUFFER 1:5 8-SOIC

• Type: Fanout Distribution, Spread Spectrum Clock Generator, Zero Delay Buffer
• PLL: Yes
• Input: LVCMOS
• Output: LVCMOS
• Number of Circuits: 1
• Ratio - Input:Output: 1:5
• Differential - Input:Output: No/No
• Frequency - Max: 133.33MHz
• Divider/Multiplier: No/No
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

paquet: 8-SOIC (0.154", 3.90mm Width)

PESD5V0L1USF-H250,

NXP

TVS DIODE 5VWM 10.5VC SOD962

• Type: Zener
• Unidirectional Channels: 1
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): 5V (Max)
• Voltage - Breakdown (Min): 6V
• Voltage - Clamping (Max) @ Ipp: 10.5V
• Current - Peak Pulse (10/1000µs): 1.2A (8/20µs)
• Power - Peak Pulse: 11W
• Power Line Protection: No
• Applications: General Purpose
• Capacitance @ Frequency: 12pF @ 1MHz
• Operating Temperature: -55°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 2-XFDFN
• Supplier Device Package: 2-DSN (0.60x0.30)

paquet: 2-XFDFN

PRTR5V0U1T,215

NXP

TVS DIODE 5.5VWM SOT23

• Type: Steering (Rail to Rail)
• Unidirectional Channels: 1
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): 5.5V (Max)
• Voltage - Breakdown (Min): 6V
• Voltage - Clamping (Max) @ Ipp: -
• Current - Peak Pulse (10/1000µs): -
• Power - Peak Pulse: -
• Power Line Protection: Yes
• Applications: General Purpose
• Capacitance @ Frequency: 1pF @ 1MHz
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SOT-23 (TO-236AB)

paquet: TO-236-3, SC-59, SOT-23-3

MMA5124LVWR2

NXP

ACCELEROMETER PSI5 16QFN

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

OM7921,598

NXP

RF EVAL AMP VGA FOR BGA7210

• Type: Amplifier
• Frequency: -
• For Use With/Related Products: BGA7120
• Supplied Contents: 2 Boards, Cables, Samples, Software, Documentation

paquet: -

MIMXRT1061CVL5A

NXP

I.MXRT1061 MPU 196MAPBGA

• Core Processor: ARM® Cortex®-M7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 528MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: Yes
• Display & Interface Controllers: LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: BEE, DCP, HAB, SJC, SNVS, TRNG
• Package / Case: 196-LFBGA
• Supplier Device Package: 196-MAPBGA (10x10)

paquet: 196-LFBGA

S9S08RNA60W1VLH

NXP

8-BIT MCU S08 CORE 60KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 55
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

MC33PF8100CFEP

NXP

IC POWER MANAGEMENT I.MX8QXP

• Applications: High Performance i.MX 8, S32x Processor Based
• Current - Supply: -
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

paquet: 56-VFQFN Exposed Pad

MIMXRT1024CAG4B

NXP

IC MCU 32BIT 4MB FLASH 144LQFP

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit
• Speed: 396MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 90
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: A/D 19x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: -

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LPC1112FHN33-102K

NXP

IC MCU 32BIT 16KB FLASH 32HVQFN

• Core Processor: ARM® Cortex®-M0
• Core Size: 32-Bit Single-Core
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 28
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 8x10b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-VQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (7x7)

paquet: -

S32G398AACK1VUCR

NXP

8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
• Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
• Speed: 400MHz, 1.3GHz
• Co-Processors/DSP: Multimedia; NEON
• RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 2.5Gbps (3)
• SATA: -
• USB: USB 2.0 OTG (1)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

paquet: -

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A3G26H502W17SR3

NXP

RF MOSFET GAN 48V NI780

• Transistor Type: GaN
• Frequency: 2.496GHz ~ 2.69GHz
• Gain: 13.1dB
• Voltage - Test: 48 V
• Current Rating: -
• Noise Figure: -
• Current - Test: 370 mA
• Power - Output: 80W
• Voltage - Rated: 125 V
• Package / Case: NI-780-4S2S
• Supplier Device Package: NI-780-4S2S

paquet: -

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