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Produits NXP

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PMWD20XN,118
NXP

MOSFET 2N-CH 20V 10.4A 8TSSOP

  • FET Type: 2 N-Channel (Dual)
  • FET Feature: Logic Level Gate
  • Drain to Source Voltage (Vdss): 20V
  • Current - Continuous Drain (Id) @ 25°C: 10.4A
  • Rds On (Max) @ Id, Vgs: 22 mOhm @ 4.2A, 10V
  • Vgs(th) (Max) @ Id: 1.5V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: 11.6nC @ 4.5V
  • Input Capacitance (Ciss) (Max) @ Vds: 740pF @ 16V
  • Power - Max: 4.2W
  • Operating Temperature: -55°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 8-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 8-TSSOP
paquet: 8-TSSOP (0.173", 4.40mm Width)
Stock3 552
BC638,126
NXP

TRANS PNP 60V 1A TO-92

  • Transistor Type: PNP
  • Current - Collector (Ic) (Max): 1A
  • Voltage - Collector Emitter Breakdown (Max): 60V
  • Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
  • Current - Collector Cutoff (Max): 100nA (ICBO)
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
  • Power - Max: 830mW
  • Frequency - Transition: 100MHz
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Through Hole
  • Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
  • Supplier Device Package: TO-92-3
paquet: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Stock2 896
BFG67,215
NXP

TRANS RF NPN 8GHZ 10V SOT143B

  • Transistor Type: NPN
  • Voltage - Collector Emitter Breakdown (Max): 10V
  • Frequency - Transition: 8GHz
  • Noise Figure (dB Typ @ f): 1.3dB ~ 3dB @ 1GHz ~ 2GHz
  • Gain: -
  • Power - Max: 380mW
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 5V
  • Current - Collector (Ic) (Max): 50mA
  • Operating Temperature: 175°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: TO-253-4, TO-253AA
  • Supplier Device Package: SOT-143B
paquet: TO-253-4, TO-253AA
Stock5 728
LD6836CX4/36H,315
NXP

IC REG LINEAR 3.6V 300MA 4WLCSP

  • Output Configuration: Positive
  • Output Type: Fixed
  • Number of Regulators: 1
  • Voltage - Input (Max): 5.5V
  • Voltage - Output (Min/Fixed): 3.6V
  • Voltage - Output (Max): -
  • Voltage Dropout (Max): 0.16V @ 300mA
  • Current - Output: 300mA
  • Current - Quiescent (Iq): -
  • Current - Supply (Max): 100µA ~ 250µA
  • PSRR: 55dB (1kHz)
  • Control Features: Enable
  • Protection Features: Over Current, Over Temperature
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 4-XFBGA, WLCSP
  • Supplier Device Package: 4-WLCSP (0.76x0.76)
paquet: 4-XFBGA, WLCSP
Stock3 552
hot MC33886VW
NXP

IC MOTOR DRIVER PAR 20HSOP

  • Motor Type - Stepper: -
  • Motor Type - AC, DC: Brushed DC
  • Function: Driver - Fully Integrated, Control and Power Stage
  • Output Configuration: Half Bridge (2)
  • Interface: Parallel
  • Technology: CMOS
  • Step Resolution: -
  • Applications: General Purpose
  • Current - Output: 5A
  • Voltage - Supply: 5 V ~ 40 V
  • Voltage - Load: 5 V ~ 40 V
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
  • Supplier Device Package: 20-HSOP
paquet: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Stock63 048
PCA9552D,118
NXP

IC LED DRIVER LIN DIM 25MA 24SO

  • Type: Power Switch
  • Topology: -
  • Internal Switch(s): Yes
  • Number of Outputs: 16
  • Voltage - Supply (Min): 2.3V
  • Voltage - Supply (Max): 5.5V
  • Voltage - Output: -
  • Current - Output / Channel: 25mA
  • Frequency: -
  • Dimming: -
  • Applications: -
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 24-SO
paquet: 24-SOIC (0.295", 7.50mm Width)
Stock2 560
74LVC646APW,112
NXP

IC TRANSCVR 8BIT N-INV 24TSSOP

  • Logic Type: Transceiver, Non-Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 24mA, 24mA
  • Voltage - Supply: 1.2 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 24-TSSOP
paquet: 24-TSSOP (0.173", 4.40mm Width)
Stock5 632
CBTL04082BBS,518
NXP

IC MUX/DEMUX 2:1 4CH 42HVQFN

  • Applications: DisplayPort, PCIe, USB
  • Multiplexer/Demultiplexer Circuit: 2:1
  • Switch Circuit: -
  • Number of Channels: 4
  • On-State Resistance (Max): 6 Ohm (Typ)
  • Voltage - Supply, Single (V+): 3 V ~ 3.6 V
  • Voltage - Supply, Dual (V±): -
  • -3db Bandwidth: 6GHz
  • Features: Bi-Directional, SATA
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 42-VFQFN Exposed Pad
  • Supplier Device Package: 42-HVQFN
paquet: 42-VFQFN Exposed Pad
Stock7 216
NX5DV330BQ,115
NXP

IC MUX/DEMUX VIDEO QUAD DHVQFN16

  • Applications: Video
  • Multiplexer/Demultiplexer Circuit: 2:1
  • Switch Circuit: -
  • Number of Channels: 4
  • On-State Resistance (Max): 10 Ohm
  • Voltage - Supply, Single (V+): 4 V ~ 5.5 V
  • Voltage - Supply, Dual (V±): -
  • -3db Bandwidth: 300MHz
  • Features: -
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 16-VFQFN Exposed Pad
  • Supplier Device Package: 16-DHVQFN (2.5x3.5)
paquet: 16-VFQFN Exposed Pad
Stock6 240
MPC8545HXATG
NXP

IC MPU MPC85XX 1.2GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: Signal Processing; SPE
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock6 144
MC68360VR25VLR2
NXP

IC MPU M683XX 25MHZ 357BGA

  • Core Processor: CPU32+
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 25MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
paquet: 357-BBGA
Stock4 048
MC68306AG20B
NXP

IC MPU M683XX 20MHZ 144LQFP

  • Core Processor: EC000
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 20MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
paquet: 144-LQFP
Stock3 072
MC9S08JS16LCWJ
NXP

IC MCU 8BIT 16KB FLASH 20SOIC

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 48MHz
  • Connectivity: LIN, SCI, SPI, USB
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 14
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
paquet: 20-SOIC (0.295", 7.50mm Width)
Stock4 384
hot S9S12P64J0MLH
NXP

IC MCU 16BIT 64KB FLASH 64LQFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: CAN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 49
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
  • Data Converters: A/D 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock11 340
LPC1110FD20,529
NXP

IC MCU 32BIT 4KB FLASH 20SOIC

  • Core Processor: ARM? Cortex?-M0
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, WDT
  • Number of I/O: 16
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 5x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SO
paquet: 20-SOIC (0.295", 7.50mm Width)
Stock5 200
MKV31F128VLH10
NXP

IC MCU 32BIT 128KB FLASH 64LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: I2C, SPI, UART/USART
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 46
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 24K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 24x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP
paquet: 64-LQFP
Stock7 328
PCK3807AD,118
NXP

IC CLK BUFFER 1:10 400MHZ 20SO

  • Type: Fanout Buffer (Distribution)
  • Number of Circuits: 1
  • Ratio - Input:Output: 1:10
  • Differential - Input:Output: No/No
  • Input: LVCMOS, LVTTL
  • Output: LVTTL
  • Frequency - Max: 400MHz
  • Voltage - Supply: 2.3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SO
paquet: 20-SOIC (0.295", 7.50mm Width)
Stock6 976
SA56004AD,112
NXP

SENSOR TEMPERATURE I2C/SMBUS 8SO

  • Sensor Type: Digital, Local/Remote
  • Sensing Temperature - Local: -40°C ~ 125°C
  • Sensing Temperature - Remote: -40°C ~ 125°C
  • Output Type: I2C/SMBus
  • Voltage - Supply: 3 V ~ 5.5 V
  • Resolution: 10 b
  • Features: Output Switch, Programmable Limit
  • Accuracy - Highest (Lowest): ±2°C (±3°C)
  • Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock5 364
hot MPXV7007GC6U
NXP

PRESSURE SENSOR AXIAL PORT 8-SOP

  • Pressure Type: Compound
  • Operating Pressure: ±1.02 PSI (±7 kPa)
  • Output Type: Analog Voltage
  • Output: 0.5 V ~ 4.5 V
  • Accuracy: ±5%
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Port Size: Male - 0.13" (3.17mm) Tube
  • Port Style: Barbless
  • Features: Temperature Compensated
  • Termination Style: PCB
  • Maximum Pressure: ±10.88 PSI (±75 kPa)
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 8-SMD, Gull Wing, Top Port
  • Supplier Device Package: -
paquet: 8-SMD, Gull Wing, Top Port
Stock4 428
MMA6856AKGCWR2
NXP

ACCELEROMETER 10BIT SPI 16QFN

  • Type: -
  • Axis: -
  • Acceleration Range: -
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): -
  • Bandwidth: -
  • Output Type: -
  • Voltage - Supply: -
  • Features: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock6 804
MMA6821BKW
NXP

ACCELEROMETER 120G/25GSPI 16QFN

  • Type: Digital
  • Axis: X, Y
  • Acceleration Range: ±120g, ±25g
  • Sensitivity (LSB/g): 4.096 (X), 20.479 (Y)
  • Sensitivity (mV/g): -
  • Bandwidth: -
  • Output Type: SPI
  • Voltage - Supply: 3.135 V ~ 5.25 V
  • Features: -
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-QFN Exposed Pad
  • Supplier Device Package: 16-QFN (6x6)
paquet: 16-QFN Exposed Pad
Stock8 028
OM7962
NXP

KIT EVAL BFU520, 530, 550

  • Type: Amplifier
  • Frequency: -
  • For Use With/Related Products: BFU520, BFU530, BFU550
  • Supplied Contents: 2 Boards, Samples
paquet: -
Stock4 230
T1042NXE7WQB
NXP

QORIQ 4X E5500 1500MHZ DDR3L/

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 664
S9S12G64F0VLFR
NXP

16-BIT MCU S12 CORE 64KB FLASH

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CANbus, IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 40
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock5 504
LPC1763FBD100Z
NXP

IC MCU 32BIT 256KB FLSH 100LQFP

  • Core Processor: ARM® Cortex®-M3
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
  • Number of I/O: 70
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
  • Data Converters: A/D 8x12b SAR; D/A 1x10b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: -
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MIMX8DX1FVOFZAC
NXP

I.MX 8DUALXPLUS 17X17

  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
  • Number of Cores/Bus Width: 3 Core, 64-Bit
  • Speed: 1.2GHz, 264MHz
  • Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
  • RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
  • Ethernet: 10/100/1000Mbps (2)
  • SATA: -
  • USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: 417-BFBGA
  • Supplier Device Package: 417-FBGA (17x17)
paquet: -
Request a Quote
FS32K118LAT0MLHR
NXP

IC MCU 32BIT 256KB FLASH 64LQFP

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit Single-Core
  • Speed: 48MHz
  • Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 58
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 25K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 16x12b SAR; D/A1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: -
Request a Quote
FS32K146UAT0VLLR
NXP

IC MCU 32BIT 1MB FLASH 100LQFP

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit Single-Core
  • Speed: 112MHz
  • Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 89
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 24x12b SAR; D/A1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: -
Request a Quote