Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC TXRX CAN 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock2 944 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX LIN B/DIR 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 256 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX LIN 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 016 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX LIN W/VREG 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock2 464 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN W/VREG 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock6 304 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN W/VREG 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock3 936 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN W/VREG 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock5 728 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-VDFN Exposed Pad |
Stock4 800 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-WFDFN Exposed Pad |
Stock7 536 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-VDFN Exposed Pad |
Stock5 456 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-VDFN Exposed Pad |
Stock2 656 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-WFDFN Exposed Pad |
Stock5 408 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-VDFN Exposed Pad |
Stock2 000 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-VDFN Exposed Pad |
Stock2 880 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-WFDFN Exposed Pad |
Stock2 992 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-VDFN Exposed Pad |
Stock2 832 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX LIN W/VREG 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock16 728 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX LIN W/VREG 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock3 568 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX LIN W/VREG 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock7 632 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX LIN W/VREG 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 992 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX LIN W/VREG 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 336 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock6 960 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock5 472 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock3 792 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock3 824 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 072 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 680 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 736 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |