Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock7 136 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 14SOIC
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock17 172 |
|
CAN | 2/2 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 14SOIC
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock2 100 |
|
CAN | 2/2 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 14SOIC
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock2 624 |
|
CAN | 2/2 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 696 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock5 824 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 232 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock4 736 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC USB TRANSCEIVER 14-MLF
|
paquet: 14-VFQFN Exposed Pad, 14-MLF? |
Stock5 792 |
|
USB 2.0 | 1/1 | Half | 200mV | 12Mbps | 4 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 14-VFQFN Exposed Pad, 14-MLF? | 14-MLF? (2.5x2.5) |
||
Microchip Technology |
IC USB TRANSCEIVER 16-MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock6 448 |
|
USB 2.0 | 1/1 | Half | 200mV | 12Mbps | 4 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (4x4) |
||
Microchip Technology |
IC USB TRANSCEIVER 14-TSSOP
|
paquet: 14-TSSOP (0.173", 4.40mm Width) |
Stock4 544 |
|
USB 2.0 | 1/1 | Half | 200mV | 12Mbps | 4 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC USB TRANSCEIVER 14-TSSOP
|
paquet: 14-TSSOP (0.173", 4.40mm Width) |
Stock5 712 |
|
USB 2.0 | 1/1 | Half | 200mV | 12Mbps | 4 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC USB TRANSCEIVER 14-MLF
|
paquet: 14-VFQFN Exposed Pad, 14-MLF? |
Stock6 304 |
|
USB 2.0 | 1/1 | Half | 200mV | 12Mbps | 4 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 14-VFQFN Exposed Pad, 14-MLF? | 14-MLF? (2.5x2.5) |
||
Microchip Technology |
IC TXRX CAN 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock2 464 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock2 672 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock5 392 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock7 392 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX CAN 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock5 584 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock7 456 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 096 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 968 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 032 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock2 832 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock39 876 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 088 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 200 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX LIN B/DIR 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock6 208 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock6 704 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |