Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC TXRX LIN 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock9 600 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN 3.3V LDO 8-DFN
|
paquet: 8-VDFN Exposed Pad |
Stock8 724 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock8 616 |
|
Ethernet | 1/1 | - | - | - | 1.6 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 32-VFQFN Exposed Pad | 32-SQFN (5x5) |
||
Microchip Technology |
IC TXRX LIN 5V 70MA 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock8 688 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 14SOIC
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock6 576 |
|
CAN | 2/2 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock9 372 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN HS W/SPLIT 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock6 276 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC LIN BUS BIDIRECT 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock16 056 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX LIN 3.3V 70MA 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock9 636 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock41 352 |
|
MII, RMII | 4/4 | Full | - | - | 1.6 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN Exposed Pad (5x5) |
||
Microchip Technology |
IC TXRX LIN 3.3V LDO 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock565 200 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock51 876 |
|
CAN | 1/1 | Half | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock14 196 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN HIGH SPEED VIO 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock7 840 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX CAN HS W/SPLIT 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock9 204 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock16 908 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX CAN HS W/SPLIT 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock18 096 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX LIN 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock18 432 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock18 732 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSCEIVER LIN 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock16 164 |
|
LIN | 1/1 | Half | - | 20kBaud | 5.5 V ~ 30 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX PHY 10/100 3.3V 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock5 888 |
|
MII, RMII | 1/1 | Full | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 70°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC TXRX ETHERNET 64QFN
|
paquet: 64-VFQFN Exposed Pad |
Stock17 004 |
|
Ethernet | 4/4 | Full | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 70°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (8x8) |
||
Microchip Technology |
IC TXRX ETHERNET 48QFN
|
paquet: 48-VFQFN Exposed Pad |
Stock83 100 |
|
Ethernet | 4/4 | Full | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 70°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microchip Technology |
IC CABLE DRIVER COAXIAL 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 900 |
|
- | 2/0 | - | - | - | 3 V ~ 5.5 V | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock3 872 |
|
MII | 1/1 | Full | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 70°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC TXRX PHY 10/100 3.3V 48SSOP
|
paquet: 48-BSSOP (0.295", 7.50mm Width) |
Stock5 168 |
|
IEEE 802.3 | 1/1 | Full | - | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microchip Technology |
IC TXRX ETHERNET 64QFN
|
paquet: 64-VFQFN Exposed Pad |
Stock19 068 |
|
Ethernet | 4/4 | Full | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 70°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (8x8) |
||
Microchip Technology |
IC TXRX LIN W/REG WDT 20QFN
|
paquet: 20-VQFN Exposed Pad |
Stock5 264 |
|
LIN | 1/1 | - | - | - | 5 V ~ 27 V | - | Surface Mount | 20-VQFN Exposed Pad | 20-QFN-EP (5x5) |