Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC DGTL TELEPHONE CIRCUIT 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock4 352 |
|
- | 1 | 4.75 V ~ 5.25 V | 400µA | - | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microsemi Corporation |
IC DIGITAL SWITCH 32K CH 484BGA
|
paquet: 484-BGA |
Stock7 488 |
|
- | 1 | 1.71 V ~ 1.89 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-PBGA (23x23) |
||
Maxim Integrated |
IC LIU 8PORT T3E3 484BGA
|
paquet: 484-BGA |
Stock7 920 |
|
LIU | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 484-BGA
|
paquet: 484-BGA |
Stock5 808 |
|
LIU | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144-CSBGA
|
paquet: 144-BGA, CSPBGA |
Stock2 368 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 290mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK 196LBGA
|
paquet: 196-LBGA |
Stock3 776 |
|
LVTTL | 2 | 3.135 V ~ 3.465 V | 570µA | - | -40°C ~ 85°C | Surface Mount | 196-LBGA | 196-FBGA (15x15) |
||
Maxim Integrated |
IC TXRX DS3/E3 100-CSBGA
|
paquet: 100-LBGA, CSBGA |
Stock4 336 |
|
DS3, E3 | 1 | 3.135 V ~ 3.465 V | 120mA | - | -40°C ~ 85°C | Surface Mount | 100-LBGA, CSBGA | 100-CSBGA (11x11) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
paquet: 38-VFQFN Exposed Pad |
Stock6 688 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Maxim Integrated |
IC LIU QUAD E1/T1/J1 144-BGA
|
paquet: 144-BGA |
Stock4 528 |
|
- | 4 | 3.135 V ~ 3.465 V | 320mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA | 144-TEPBGA (17x17) |
||
IXYS Integrated Circuits Division |
IC MOD DAA FULL-WAVE CID PCB
|
paquet: 18-DIP Module (0.850", 21.59mm), 11 Leads |
Stock7 952 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 11 Leads | 18-DIP |
||
Inphi Corporation |
IC SDH FRAMER MAPPER 1020-FCBGA
|
paquet: 1020-BGA |
Stock2 128 |
|
SFI-4.1, SFI-4.2, SFI-5.1, XAUI, XFI | - | - | - | - | - | Surface Mount | 1020-BGA | 1020-FCBGA (33x33) |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 256X256 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock6 528 |
|
- | 1 | 3 V ~ 3.6 V | 4mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
||
Silicon Labs |
IC PROSLIC FXS ISI -106V 48QFN
|
paquet: - |
Stock6 128 |
|
3-Wire, PCM | 2 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
Microsemi Corporation |
IC RECEIVER DTMF 16PAIR 20SSOP
|
paquet: 20-SSOP (0.209", 5.30mm Width) |
Stock6 512 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Silicon Labs |
IC PROSLIC FXS ISI -106V 36QFN
|
paquet: - |
Stock3 632 |
|
3-Wire | 1 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
IXYS Integrated Circuits Division |
IC ADSL/VDSL DC TERM 16-SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock7 952 |
|
- | 1 | - | - | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Broadcom Limited |
INTEGRATED GBE CONTROLLER
|
paquet: - |
Stock6 528 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
4P Q/SGMII CU/FI 3E, 256, 4NS CO
|
paquet: - |
Stock5 616 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
32 CHANNEL SHORT HAUL T1/E1 LIU
|
paquet: - |
Stock7 184 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 1CH UNIV 100V 48TQFP
|
paquet: - |
Stock2 000 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microchip Technology |
IC RECEIVER DTMF 16PAIR 20SSOP
|
paquet: 20-SSOP (0.209", 5.30mm Width) |
Stock2 016 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC TXRX DTMF 20DIP
|
paquet: 24-DIP (0.600", 15.24mm) |
Stock5 792 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Microchip Technology |
IC CODEC U-LAW PCM 20DIP
|
paquet: 20-DIP (0.300", 7.62mm) |
Stock3 392 |
|
PCM | 1 | 4.75V ~ 5.25V | 3mA | - | 0°C ~ 70°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
Microchip Technology |
IC ABS VOICEPORT 2CH 64QFN
|
paquet: 64-VFQFN Exposed Pad |
Stock4 096 |
|
PCM | 1 | 3.135V ~ 3.465V | - | - | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Infineon Technologies |
ISDN HIGH VOLTAGE POWER CONTROLL
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Zarlink |
ZARLINK TELECOM CIRCUIT 1-FUNC
|
paquet: - |
Request a Quote |
|
- | - | 3.75V | 15mA | - | -40°C ~ 85°C | Surface Mount | 64-QFP | 64-QFP |
||
Skyworks Solutions Inc. |
WIDEBAND DUAL FXS, ISI INTERFACE
|
paquet: - |
Request a Quote |
|
3-Wire, PCM, SPI | 2 | 3.13V ~ 3.47V | 51.71mA | - | 0°C ~ 70°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Cirrus Logic Inc. |
CS61535
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |