Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CODEC W/TRANSCEIVER MQFP-64
|
paquet: 64-QFP |
Stock7 744 |
|
IOM-2, Parallel, SCI | 1 | 3.3V, 5V | 27mA | - | - | Surface Mount | 64-QFP | P-64-MQFP |
||
Infineon Technologies |
IC ECHO CANCELLER DGTL TQFP144
|
paquet: 144-LQFP |
Stock2 896 |
|
PCM, Serial, UCC | 1 | 3 V ~ 3.6 V | 350mA | 900mW | 0°C ~ 70°C | Surface Mount | 144-LQFP | P-TQFP-144 |
||
Microsemi Corporation |
IC SLIC 1CH UNIV 145V 48TQFP
|
paquet: - |
Stock3 376 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microsemi Corporation |
IC RECEIVER DTMF 50DB 18SOIC
|
paquet: 18-SOIC (0.295", 7.50mm Width) |
Stock5 648 |
|
Parallel | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 32QFN
|
paquet: 32-VQFN Exposed Pad |
Stock7 776 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
Maxim Integrated |
IC FRAMER TRPL DS3/E3 144TCBGA
|
paquet: 144-BGA, CSPBGA |
Stock4 864 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 225mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-CSPBGA (13x13) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
paquet: 217-BBGA |
Stock5 392 |
|
LIU | 6 | 3.135 V ~ 3.465 V | 725mA | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Maxim Integrated |
IC MICRODAA VOICE 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock3 232 |
|
Serial | 1 | 3 V ~ 3.6 V | - | - | 0°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (8x8) |
||
Maxim Integrated |
IC FRAMER T1 4X4 16CH 300-BGA
|
paquet: 300-BBGA |
Stock6 640 |
|
Parallel/Serial | - | 2.97 V ~ 3.63 V | 300mA | - | 0°C ~ 70°C | Surface Mount | 300-BBGA | 300-PBGA (27x27) |
||
IXYS Integrated Circuits Division |
IC MOD PHONE LINE HALF 1.07" PCB
|
paquet: 18-DIP Module (0.850", 21.59mm), 9 Leads |
Stock7 360 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 9 Leads | 18-DIP |
||
Silicon Labs |
IC DAA FCC+ EMBEDDED 10SOIC
|
paquet: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Stock7 360 |
|
- | 1 | - | 9mA | - | 0°C ~ 70°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
Silicon Labs |
IC PROSLIC FXS FXO -136V 42QFN
|
paquet: 42-WFQFN Exposed Pad |
Stock5 456 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Linear Technology |
IC RING TONE GENERATOR 14-SOIC
|
paquet: 14-SOIC (0.154", 3.90mm Width) |
Stock7 392 |
|
- | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Silicon Labs |
IC PROSLIC/CODEC DTMF 38VQFN
|
paquet: 38-VFQFN Exposed Pad |
Stock2 864 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
IXYS Integrated Circuits Division |
DAA LITELINK III RING DETECT
|
paquet: - |
Stock5 968 |
|
- | - | - | - | - | - | - | - | - |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock6 272 |
|
- | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
6-PORT CE SWITCH
|
paquet: - |
Stock3 440 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
WIDEBAND FXS WITH ISI INTERFACE
|
paquet: 38-QFN |
Stock5 616 |
|
3-Wire | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 38-QFN | 38-QFN (4x6) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
paquet: 256-BGA |
Stock2 352 |
|
- | - | - | - | - | - | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC OLAC CHIPSET 1CHAN 48LQFP
|
paquet: - |
Stock7 392 |
|
- | 1 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
Microchip Technology |
IC TDM/TSI SWITCH 256X256 44MQFP
|
paquet: 44-QFP |
Stock7 712 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | 44-QFP | 44-MQFP (10x10) |
||
Microchip Technology |
SONET/SDH INTERFACE FOR 622 & 15
|
paquet: 196-LBGA |
Stock3 664 |
|
Serial | - | - | - | - | - | Surface Mount | 196-LBGA | 196-CABGA (15x15) |
||
Microchip Technology |
IC VOICEPORT ABS 2CH 80LQFP
|
paquet: 80-LQFP |
Stock4 448 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Skyworks Solutions Inc. |
WIDEBAND DUAL FXS, PCM INTERFACE
|
paquet: - |
Request a Quote |
|
3-Wire, PCM, SPI | 2 | 3.13V ~ 3.47V | 51.71mA | - | -40°C ~ 85°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Texas Instruments |
320C6202 352PIN BGA REV3.1 FOR A
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
SWITCH FABRIC
|
paquet: - |
Request a Quote |
|
PCI Express | - | - | - | - | - | - | - | - |
||
Intersil |
SLIC, 2-4 CONVERSION, BIPOLAR
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Cirrus Logic Inc. |
DUAL T1/E1 LINE INTERFACE
|
paquet: - |
Request a Quote |
|
E1, T1 | 2 | 4.75V ~ 5.25V | - | 310 mW | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-TQFP (10x10) |