Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC VOICE ACCESS CODEC TQFP64
|
paquet: 64-LQFP |
Stock3 520 |
|
- | 1 | - | - | - | 0°C ~ 70°C | Surface Mount | 64-LQFP | P-TQFP-64 |
||
Infineon Technologies |
IC LINE CARD CTRLR HDLC TQFP-100
|
paquet: 100-LQFP |
Stock7 728 |
|
ISDN | - | 3.13 V ~ 3.47 V | 272.6mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | P-TQFP-100 |
||
NXP |
IC VOIP PROCESSOR 4CH 672BGA
|
paquet: 672-BGA |
Stock2 320 |
|
- | - | - | - | - | - | Surface Mount | 672-BGA | 672-TEPBGA (27x27) |
||
Microsemi Corporation |
IC VOICE ECHO CANCELLER 535BGA
|
paquet: 535-BGA |
Stock3 968 |
|
- | 1 | 1.6 V ~ 2 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 535-BGA | 535-PBGA (31x31) |
||
Silicon Labs |
IC SLIC/CODEC 2CHANNEL 64TQFP
|
paquet: 64-TQFP |
Stock4 752 |
|
GCI, PCM, SPI | 2 | 3.3V | - | - | - | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
paquet: 144-BGA, CSPBGA |
Stock5 792 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 290mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
paquet: 144-BGA, CSPBGA |
Stock5 600 |
|
LIU | 2 | 3.3V | 150mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Silicon Labs |
IC PROSLIC LINE FEED 150V 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock7 120 |
|
GCI, PCM, SPI | 4 | 3.3V | - | - | - | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
paquet: 217-BBGA |
Stock2 496 |
|
LIU | 6 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16MLP
|
paquet: 16-VDFN Exposed Pad |
Stock6 176 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
STMicroelectronics |
IC PCM TONE CIRCUIT 24-DIP
|
paquet: 24-DIP (0.600", 15.24mm) |
Stock12 888 |
|
PCM | 1 | 4.75 V ~ 5.25 V | 50mA | 500mW | 0°C ~ 70°C | Through Hole | 24-DIP (0.600", 15.24mm) | 24-DIP |
||
Microsemi Corporation |
IC CESOP PROCESSOR 552BGA
|
paquet: 552-BGA |
Stock11 820 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
IDT, Integrated Device Technology Inc |
IC LINE INTERFC UNIT 4CH 128TQFP
|
paquet: 128-LQFP |
Stock2 224 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
Microsemi Corporation |
IC TXRX DTMF 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock9 000 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC TXRX DTMF 20DIP
|
paquet: 20-DIP (0.300", 7.62mm) |
Stock5 536 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
Microchip Technology |
4P QGMII CU 3E, IND, NO SYNCE, G
|
paquet: - |
Stock5 424 |
|
- | - | - | - | - | - | Surface Mount | - | 138-QFN (12x12) |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 68QFN
|
paquet: - |
Stock10 056 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | - | 68-QFN (8x8) |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 20SSOP
|
paquet: 20-SSOP (0.209", 5.30mm Width) |
Stock4 192 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC ECHO CANCEL DUAL CODEC 81CBGA
|
paquet: 81-LBGA |
Stock2 752 |
|
Serial | 1 | - | - | - | -40°C ~ 85°C | Surface Mount | 81-LBGA | 81-CABGA (10x10) |
||
Microchip Technology |
IC LINE CARD LCAS 2CH 44TQFP
|
paquet: 44-TQFP |
Stock3 904 |
|
- | 2 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Analog Devices Inc./Maxim Integrated |
TEMPE T3/E3 MULTIPLEXER 3.3V T3/
|
paquet: - |
Request a Quote |
|
E3, T3 | 1 | 3.135V ~ 3.465V | 150mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (27x27) |
||
Analog Devices Inc./Maxim Integrated |
5V T1 SINGLE-CHIP TRANSCEIVER
|
paquet: - |
Request a Quote |
|
E1, HDLC, J1, T1 | 1 | 4.75V ~ 5.25V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Analog Devices Inc./Maxim Integrated |
3.3V T1 SINGLE-CHIP TRANSCEIVERS
|
paquet: - |
Request a Quote |
|
E1, HDLC, J1, T1 | 1 | 3.135V ~ 3.465V | 75mA | - | -40°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Broadcom Limited |
2XNGPON2/2XXGS-PON OLT, I-TEMP
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | -40°C ~ 85°C | - | - | - |
||
Skyworks Solutions Inc. |
WIDEBAND DUAL FXS, PCM INTERFACE
|
paquet: - |
Request a Quote |
|
3-Wire, PCM, SPI | 2 | 3.13V ~ 3.47V | 51.71mA | - | 0°C ~ 70°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Infineon Technologies |
ISAC-S TE ISDN ACCESS CONTROLLER
|
paquet: - |
Request a Quote |
|
4-Wire, IOM-2 | 1 | 4.75V ~ 5.25V | 17mA | - | 0°C ~ 70°C | Surface Mount | 64-QFP | P-MQFP-64 |
||
Infineon Technologies |
MUSLIC MULTICHANNEL SLIC
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Zarlink |
ZARLINK FRAMER PQCC44
|
paquet: - |
Request a Quote |
|
- | - | 5V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 44-QCC |