Page 7 - Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs | Circuits intégrés (CI)

Référence	Fabricant	Description	paquet	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0741-02-410-2CF	Trenz Electronic GmbH	SOM KINTEX-7 410T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 410T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock7 232	Kintex-7 410T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
TE0600-02IVFN	Trenz Electronic GmbH	SOM GIGABEE XC6SLX150 2X128MB 3I Module/Board Type: FPGA Core Processor: Spartan-6 LX-150 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock4 352	Spartan-6 LX-150	-	125MHz	16MB	256MB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
CC-WMX-LB69-CV-1	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock2 112	-	-	-	-	-	-	-	-
CC-MX-MB58-ZM-B	Digi International	MODULE I.MX51 256MB FLASH 25PK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock7 440	-	-	-	-	-	-	-	-
M53017MOD	NXP	MODULE MCF5301 32-BIT VOIP Module/Board Type: MCU, VOIP Core Core Processor: ColdFire V3, MCF53017 Co-Processor: - Speed: 80MHz Flash Size: 32MB RAM Size: 64MB Connector Type: Edge Connector Size / Dimension: - Operating Temperature: -	paquet: -	Stock6 080	ColdFire V3, MCF53017	-	80MHz	32MB	64MB	Edge Connector	-	-
DLP-245PB-G	DLP Design Inc.	MODULE USB-MCU FT245RL W/16F877A Module/Board Type: MCU, USB Core Core Processor: PIC16F877A Co-Processor: FT245RL Speed: 20MHz Flash Size: 8KB RAM Size: 368KB Connector Type: USB - B, Pin Header Size / Dimension: 2.3" x 0.7" (58.4mm x 17.8mm) Operating Temperature: -	paquet: -	Stock4 704	PIC16F877A	FT245RL	20MHz	8KB	368KB	USB - B, Pin Header	2.3" x 0.7" (58.4mm x 17.8mm)	-
CENGLH7A404-11-504HIR	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock5 520	ARM922T, LH7A404	-	200MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	-40°C ~ 85°C
20-101-0897	Digi International	MODULE RABBITCORE RCM3700 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock2 400	-	-	-	-	-	-	-	-
DC-EM-02T-NC-25	Digi International	EM 8MB SDRAM 4MB FLASH SINGLE Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: Pin Header Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock7 808	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	Pin Header	1.94" x 1.58" (49.2mm x 40.0mm)	-40°C ~ 85°C
CENGPXA270-312-10-550EC	Logic	CARD ENGINE 64MB FLASH 64MB RAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 312MHz Flash Size: 64MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock6 464	PXA270	-	312MHz	64MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CENGSH7760-10-503HC	Logic	CARD ENGINE 16MB FLASH 64MB RAM Module/Board Type: MPU Core Core Processor: SH7760 Co-Processor: - Speed: 198MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock5 328	SH7760	-	198MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
28020	Parallax Inc.	PWMPAL 4 OUTPUT CHANNELS Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock6 528	-	-	-	-	-	-	-	-
TE0320-00-EV02IB	Trenz Electronic GmbH	SOM SPARTAN-3A 3400K 1333MB DDR Module/Board Type: FPGA, USB Core Core Processor: Spartan-3A DSP Co-Processor: Cypress EZ-USB FX2LP Speed: 100MHz Flash Size: 4MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 2.7" x 1.9" (68mm x 48mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6 336	Spartan-3A DSP	Cypress EZ-USB FX2LP	100MHz	4MB	128MB	B2B	2.7" x 1.9" (68mm x 48mm)	-40°C ~ 85°C
DLP-245PL-G	DLP Design Inc.	MOD USB-MCU FT245RL W/18LF8722 Module/Board Type: MCU, USB Core Core Processor: PIC16F8722 Co-Processor: FT245RL Speed: 24MHz Flash Size: 128KB RAM Size: 3.75KB Connector Type: USB - B, Pin Header Size / Dimension: 2.8" x 2" (71.1mm x 50.8mm) Operating Temperature: -	paquet: -	Stock6 128	PIC16F8722	FT245RL	24MHz	128KB	3.75KB	USB - B, Pin Header	2.8" x 2" (71.1mm x 50.8mm)	-
100-1221-3	Bluetechnix GmbH	CORE MOD CM-BF537E 600MHZ CONN Module/Board Type: MPU Core Core Processor: CM-BF537 Co-Processor: - Speed: 600MHz Flash Size: 4MB RAM Size: 32MB Connector Type: Expansion 2 x 60 Size / Dimension: 1.44" x 1.24" (36.5mm x 31.5mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock6 880	CM-BF537	-	600MHz	4MB	32MB	Expansion 2 x 60	1.44" x 1.24" (36.5mm x 31.5mm)	0°C ~ 70°C
DC-ME-01T-C-50	Digi International	ME 8MB SDRAM 2MB FLASH 50 PAK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6 144	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
TE0807-02-04EG-1E	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock5 280	-	-	-	-	-	-	-	-
TE0841-02-035-1C	Trenz Electronic GmbH	SOM USCALE 2GB DDR4 Module/Board Type: FPGA Core Core Processor: Kintex UltraScale KU035 Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock7 024	Kintex UltraScale KU035	-	-	64MB	2GB	B2B	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
IW-G45M-S085-4E008G-E032G-BEA	iWave Systems	Stratix 10 SoC FPGA SOM Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A53 Co-Processor: - Speed: 1.5GHz Flash Size: - RAM Size: - Connector Type: - Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM® Cortex®-A53	-	1.5GHz	-	-	-	4.330" L x 2.950" W (110.00mm x 75.00mm)	-40°C ~ 85°C
OSD32MP157C-512M-BAA	Octavo Systems LLC	SIP ARM CORTEX STM32MP157C Module/Board Type: MPU Core Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4 Co-Processor: NEON™ SIMD Speed: 650MHz, 209MHz Flash Size: - RAM Size: - Connector Type: 302-BGA Size / Dimension: 0.709" L x 0.709" W (18.00mm x 18.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Stock1 662	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz, 209MHz	-	-	302-BGA	0.709" L x 0.709" W (18.00mm x 18.00mm)	0°C ~ 85°C
TE0803-04-4BE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	Zynq UltraScale+ XCZU4EG-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0600-03-83I11-A	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Core Processor: Spartan-6 LX-150 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	Spartan-6 LX-150	-	125MHz	16MB	256MB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0741-05-D2C-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K325T-2FBG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0720-03-62I33NA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0714-03-35-2IC7	Trenz Electronic GmbH	IC MODULE ARTIX-7 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
TE0820-05-3BE81MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
SOMIMX8MNS-11-29C0DMCR	Beacon EmbeddedWorks	IC MOD I.MX 8M NANO SOLO 1GB Module/Board Type: MCU Core Core Processor: ARM® Cortex™-A53, ARM® Cortex™-M7 Co-Processor: - Speed: 1.5GHz, 750MHz Flash Size: - RAM Size: 1GB Connector Type: USB Size / Dimension: 1.100" L x 1.500" W (28.00mm x 38.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Request a Quote	ARM® Cortex™-A53, ARM® Cortex™-M7	-	1.5GHz, 750MHz	-	1GB	USB	1.100" L x 1.500" W (28.00mm x 38.00mm)	0°C ~ 70°C
TE0714-03-50-2I	Trenz Electronic GmbH	IC MODULE Module/Board Type: FPGA Core Core Processor: Artix-7 A50T Co-Processor: - Speed: - Flash Size: 16MB RAM Size: 16MB Connector Type: Samtec LSHM Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock105	Artix-7 A50T	-	-	16MB	16MB	Samtec LSHM	1.180" L x 1.570" W (30.00mm x 40.00mm)	-40°C ~ 85°C

TE0741-02-410-2CF

Trenz Electronic GmbH

SOM KINTEX-7 410T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 410T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock7 232

Kintex-7 410T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

TE0600-02IVFN

Trenz Electronic GmbH

SOM GIGABEE XC6SLX150 2X128MB 3I

Module/Board Type: FPGA
Core Processor: Spartan-6 LX-150
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock4 352

Spartan-6 LX-150

-

125MHz

16MB

256MB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

CC-WMX-LB69-CV-1

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock2 112

-

CC-MX-MB58-ZM-B

Digi International

MODULE I.MX51 256MB FLASH 25PK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock7 440

-

M53017MOD

NXP

MODULE MCF5301 32-BIT VOIP

Module/Board Type: MCU, VOIP Core
Core Processor: ColdFire V3, MCF53017
Co-Processor: -
Speed: 80MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: Edge Connector
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock6 080

ColdFire V3, MCF53017

-

80MHz

32MB

64MB

Edge Connector

-

DLP-245PB-G

DLP Design Inc.

MODULE USB-MCU FT245RL W/16F877A

Module/Board Type: MCU, USB Core
Core Processor: PIC16F877A
Co-Processor: FT245RL
Speed: 20MHz
Flash Size: 8KB
RAM Size: 368KB
Connector Type: USB - B, Pin Header
Size / Dimension: 2.3" x 0.7" (58.4mm x 17.8mm)
Operating Temperature: -

paquet: -

Stock4 704

PIC16F877A

FT245RL

20MHz

8KB

368KB

USB - B, Pin Header

2.3" x 0.7" (58.4mm x 17.8mm)

-

CENGLH7A404-11-504HIR

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock5 520

ARM922T, LH7A404

-

200MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

-40°C ~ 85°C

20-101-0897

Digi International

MODULE RABBITCORE RCM3700

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock2 400

-

DC-EM-02T-NC-25

Digi International

EM 8MB SDRAM 4MB FLASH SINGLE

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: Pin Header
Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock7 808

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

Pin Header

1.94" x 1.58" (49.2mm x 40.0mm)

-40°C ~ 85°C

CENGPXA270-312-10-550EC

Logic

CARD ENGINE 64MB FLASH 64MB RAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 312MHz
Flash Size: 64MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock6 464

PXA270

-

312MHz

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CENGSH7760-10-503HC

Logic

CARD ENGINE 16MB FLASH 64MB RAM

Module/Board Type: MPU Core
Core Processor: SH7760
Co-Processor: -
Speed: 198MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock5 328

SH7760

-

198MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

28020

Parallax Inc.

PWMPAL 4 OUTPUT CHANNELS

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock6 528

-

TE0320-00-EV02IB

Trenz Electronic GmbH

SOM SPARTAN-3A 3400K 1333MB DDR

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-3A DSP
Co-Processor: Cypress EZ-USB FX2LP
Speed: 100MHz
Flash Size: 4MB
RAM Size: 128MB
Connector Type: B2B
Size / Dimension: 2.7" x 1.9" (68mm x 48mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6 336

Spartan-3A DSP

Cypress EZ-USB FX2LP

100MHz

4MB

128MB

B2B

2.7" x 1.9" (68mm x 48mm)

-40°C ~ 85°C

DLP-245PL-G

DLP Design Inc.

MOD USB-MCU FT245RL W/18LF8722

Module/Board Type: MCU, USB Core
Core Processor: PIC16F8722
Co-Processor: FT245RL
Speed: 24MHz
Flash Size: 128KB
RAM Size: 3.75KB
Connector Type: USB - B, Pin Header
Size / Dimension: 2.8" x 2" (71.1mm x 50.8mm)
Operating Temperature: -

paquet: -

Stock6 128

PIC16F8722

FT245RL

24MHz

128KB

3.75KB

USB - B, Pin Header

2.8" x 2" (71.1mm x 50.8mm)

-

100-1221-3

Bluetechnix GmbH

CORE MOD CM-BF537E 600MHZ CONN

Module/Board Type: MPU Core
Core Processor: CM-BF537
Co-Processor: -
Speed: 600MHz
Flash Size: 4MB
RAM Size: 32MB
Connector Type: Expansion 2 x 60
Size / Dimension: 1.44" x 1.24" (36.5mm x 31.5mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock6 880

CM-BF537

-

600MHz

4MB

32MB

Expansion 2 x 60

1.44" x 1.24" (36.5mm x 31.5mm)

0°C ~ 70°C

DC-ME-01T-C-50

Digi International

ME 8MB SDRAM 2MB FLASH 50 PAK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6 144

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

TE0807-02-04EG-1E

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock5 280

-

TE0841-02-035-1C

Trenz Electronic GmbH

SOM USCALE 2GB DDR4

Module/Board Type: FPGA Core
Core Processor: Kintex UltraScale KU035
Co-Processor: -
Speed: -
Flash Size: 64MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock7 024

Kintex UltraScale KU035

-

64MB

2GB

B2B

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

IW-G45M-S085-4E008G-E032G-BEA

iWave Systems

Stratix 10 SoC FPGA SOM

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A53
Co-Processor: -
Speed: 1.5GHz
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

ARM® Cortex®-A53

-

1.5GHz

-

4.330" L x 2.950" W (110.00mm x 75.00mm)

-40°C ~ 85°C

OSD32MP157C-512M-BAA

Octavo Systems LLC

SIP ARM CORTEX STM32MP157C

Module/Board Type: MPU Core
Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4
Co-Processor: NEON™ SIMD
Speed: 650MHz, 209MHz
Flash Size: -
RAM Size: -
Connector Type: 302-BGA
Size / Dimension: 0.709" L x 0.709" W (18.00mm x 18.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

Stock1 662

Arm® Dual Cortex®-A7, Arm® Cortex®-M4

NEON™ SIMD

650MHz, 209MHz

-

302-BGA

0.709" L x 0.709" W (18.00mm x 18.00mm)

0°C ~ 85°C

TE0803-04-4BE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

Request a Quote

Zynq UltraScale+ XCZU4EG-1SFVC784E

-

128MB

2GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

TE0600-03-83I11-A

Trenz Electronic GmbH

IC MODULE GIGABEE

Module/Board Type: FPGA Core
Core Processor: Spartan-6 LX-150
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

Spartan-6 LX-150

-

125MHz

16MB

256MB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0741-05-D2C-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Request a Quote

Xilinx Kintex-7 FPGA XC7K325T-2FBG676C

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

TE0720-03-62I33NA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Request a Quote

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32GB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

TE0714-03-35-2IC7

Trenz Electronic GmbH

IC MODULE ARTIX-7

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Request a Quote

-

TE0820-05-3BE81MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Request a Quote

-

SOMIMX8MNS-11-29C0DMCR

Beacon EmbeddedWorks

IC MOD I.MX 8M NANO SOLO 1GB

Module/Board Type: MCU Core
Core Processor: ARM® Cortex™-A53, ARM® Cortex™-M7
Co-Processor: -
Speed: 1.5GHz, 750MHz
Flash Size: -
RAM Size: 1GB
Connector Type: USB
Size / Dimension: 1.100" L x 1.500" W (28.00mm x 38.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Request a Quote

ARM® Cortex™-A53, ARM® Cortex™-M7

-

1.5GHz, 750MHz

-

1GB

USB

1.100" L x 1.500" W (28.00mm x 38.00mm)

0°C ~ 70°C

TE0714-03-50-2I

Trenz Electronic GmbH

IC MODULE

Module/Board Type: FPGA Core
Core Processor: Artix-7 A50T
Co-Processor: -
Speed: -
Flash Size: 16MB
RAM Size: 16MB
Connector Type: Samtec LSHM
Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock105

Artix-7 A50T

-

16MB

Samtec LSHM

1.180" L x 1.570" W (30.00mm x 40.00mm)

-40°C ~ 85°C