Page 10 - Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs | Circuits intégrés (CI) | Heisener Electronics
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Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs

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Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
CC-9P-V225-Z1-B
Digi International

MODULE 9P 32MB SDRAM 32MB FLASH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock7 632
-
-
-
-
-
-
-
-
CC-9M-QA25-Z1-B
Digi International

MOD 9M 32MB SDRAM 32MB FLASH 25

  • Module/Board Type: MPU Core
  • Core Processor: ARM920T, SC2443
  • Co-Processor: -
  • Speed: 400MHz
  • Flash Size: 32MB
  • RAM Size: 32MB
  • Connector Type: Board-to-Board (BTB) Socket - 240
  • Size / Dimension: 2.36" x 1.73" (60mm x 44mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock6 272
ARM920T, SC2443
-
400MHz
32MB
32MB
Board-to-Board (BTB) Socket - 240
2.36" x 1.73" (60mm x 44mm)
0°C ~ 70°C
SOMOMAP3530-11-1672IFXR
Logic

SYSTEM ON MODULE LV OMAP3530

  • Module/Board Type: MPU, DSP Core
  • Core Processor: ARM? Cortex?-A8, OMAP3530
  • Co-Processor: TMS320C64x (DSP)
  • Speed: 600MHz
  • Flash Size: 256MB (NAND), 8MB (NOR)
  • RAM Size: 128MB
  • Connector Type: Board-to-Board (BTB) Socket - 240
  • Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
  • Operating Temperature: -20°C ~ 70°C
paquet: -
Stock6 912
ARM? Cortex?-A8, OMAP3530
TMS320C64x (DSP)
600MHz
256MB (NAND), 8MB (NOR)
128MB
Board-to-Board (BTB) Socket - 240
1.23" x 3.01" (31.2mm x 76.5mm)
-20°C ~ 70°C
M5485AFEE-D
Logic

MODULE MCF5485 FIRE ENGINE

  • Module/Board Type: MPU Core
  • Core Processor: ColdFire V4e, MCF5485
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 2MB (Boot)
  • RAM Size: 64MB
  • Connector Type: -
  • Size / Dimension: 3.7" x 4.5" (95mm x 114mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock6 144
ColdFire V4e, MCF5485
-
200MHz
2MB (Boot)
64MB
-
3.7" x 4.5" (95mm x 114mm)
-40°C ~ 85°C
DC-ME-01T-NC-1
Digi International

MOD ME 8MB SDRAM 2MB FLASH 1PACK

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 2MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock7 008
ARM7TDMI, NS7520
-
55MHz
2MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 85°C
20-101-1006
Digi International

MODULE POWERCORE 3800

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 51.6MHz
  • Flash Size: 512KB (Internal), 1MB (External)
  • RAM Size: 1MB
  • Connector Type: IDC Header 2x25, 2x5, 1x3mm
  • Size / Dimension: 2.35" x 4" (60mm x 102mm)
  • Operating Temperature: -40°C ~ 70°C
paquet: -
Stock6 352
Rabbit 3000
-
51.6MHz
512KB (Internal), 1MB (External)
1MB
IDC Header 2x25, 2x5, 1x3mm
2.35" x 4" (60mm x 102mm)
-40°C ~ 70°C
MOD5282-100CR
NetBurner Inc.

PROCESSOR MODULE 512KB FLASH

  • Module/Board Type: MCU, Ethernet Core
  • Core Processor: ColdFire 5282
  • Co-Processor: -
  • Speed: 66MHz
  • Flash Size: 512KB
  • RAM Size: 8.064MB
  • Connector Type: RJ-45, 2x50 Header
  • Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock6 752
ColdFire 5282
-
66MHz
512KB
8.064MB
RJ-45, 2x50 Header
2.6" x 2" (66.04mm x 50.8mm)
0°C ~ 70°C
EZ80F915050MOD
Zilog

MODULE EZ80F91 512K 50MHZ

  • Module/Board Type: MCU, Ethernet Core
  • Core Processor: eZ80F91
  • Co-Processor: -
  • Speed: 50MHz
  • Flash Size: 256KB (Internal), 1MB (External)
  • RAM Size: 8KB (Internal), 512KB (External)
  • Connector Type: Header 2x30
  • Size / Dimension: 2.5" x 3.1" (63.5mm x 78.7mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock7 536
eZ80F91
-
50MHz
256KB (Internal), 1MB (External)
8KB (Internal), 512KB (External)
Header 2x30
2.5" x 3.1" (63.5mm x 78.7mm)
0°C ~ 70°C
CC-MX-LB58-ZM-B
Digi International

MODULE I.MX51 256MB FLASH 25PK

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock6 000
-
-
-
-
-
-
-
-
CC-7U-Z113-Z1-B
Digi International

UMOD CONNECTCORE 7U 16MB SDRAM

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 8MB
  • RAM Size: 16MB
  • Connector Type: 48-DIP
  • Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock2 272
ARM7TDMI, NS7520
-
55MHz
8MB
16MB
48-DIP
2.48" x 0.73" (62.9mm x 18.5mm)
0°C ~ 70°C
EDM1-IMX6S-MSD
Wandboard.Org

EDM1-IMX6S-MSD SOM 10PK

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock7 232
-
-
-
-
-
-
-
-
20-101-1112
Digi International

MODULE RABBITCORE RCM4010

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 4000
  • Co-Processor: -
  • Speed: 58.98MHz
  • Flash Size: 512KB
  • RAM Size: 512KB
  • Connector Type: IDC Header 2x25, 2x5
  • Size / Dimension: 1.84" x 2.42" (47mm x 61mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock5 936
Rabbit 4000
-
58.98MHz
512KB
512KB
IDC Header 2x25, 2x5
1.84" x 2.42" (47mm x 61mm)
0°C ~ 70°C
20-101-1131
Digi International

MODULE RCM4200 RABBITCORE

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 4000
  • Co-Processor: -
  • Speed: 58.98MHz
  • Flash Size: 512KB (Internal), 8MB (External)
  • RAM Size: 1MB
  • Connector Type: IDC Header 2x25, 2x5
  • Size / Dimension: 1.84" x 2.42" (47mm x 61mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock6 688
Rabbit 4000
-
58.98MHz
512KB (Internal), 8MB (External)
1MB
IDC Header 2x25, 2x5
1.84" x 2.42" (47mm x 61mm)
-40°C ~ 85°C
OSD3358-512M-BAS
Octavo Systems LLC

IC SIP BASED ON TI AM3358 400BGA

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, AM3358
  • Co-Processor: -
  • Speed: 1GHz
  • Flash Size: -
  • RAM Size: 512MB
  • Connector Type: 400-BGA
  • Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Stock7 776
ARM? Cortex?-A8, AM3358
-
1GHz
-
512MB
400-BGA
1.06" x 1.06" (27.0mm x 27.0mm)
0°C ~ 85°C
20-101-1318
Digi International

MINICORE MODULE RCM6700

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 6000
  • Co-Processor: -
  • Speed: 162.5MHz
  • Flash Size: 1MB
  • RAM Size: 1.032MB
  • Connector Type: Edge Connector - 52
  • Size / Dimension: 1.2" x 2" (30mm x 51mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock15 720
Rabbit 6000
-
162.5MHz
1MB
1.032MB
Edge Connector - 52
1.2" x 2" (30mm x 51mm)
-40°C ~ 85°C
DC-ME-01T-KC-1
Digi International

MODULE DIGI CONNECT ME

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Stock7 424
-
-
-
-
-
-
-
-
CC-MX-JN7A-Z1
Digi International

CONNECTCORE I.MX6UL SOM

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A7
  • Co-Processor: NEON™ MPE
  • Speed: 528MHz
  • Flash Size: 1GB
  • RAM Size: 1GB
  • Connector Type: -
  • Size / Dimension: 1.14" x 1.14" (29mm x 29mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock6 640
ARM® Cortex®-A7
NEON™ MPE
528MHz
1GB
1GB
-
1.14" x 1.14" (29mm x 29mm)
-40°C ~ 85°C
TE0745-02-81C11-A
Trenz Electronic GmbH

SOM MIT XILINX ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM® Cortex®-A9
  • Co-Processor: Zynq-7000 (Z-7035)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec ST5
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock4 192
ARM® Cortex®-A9
Zynq-7000 (Z-7035)
-
32MB
1GB
Samtec ST5
2.05" x 2.99" (52mm x 76mm)
-40°C ~ 85°C
TE0813-01-3AE11-A
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: Board-to-Board (BTB) Socket - 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Request a Quote
Zynq UltraScale+ XCZU3CG-1SFVC784E
-
-
128MB
2GB
Board-to-Board (BTB) Socket - 240
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
TE0600-04-83I21-A
Trenz Electronic GmbH

IC MODULE GIGABEE

  • Module/Board Type: FPGA
  • Core Processor: Xilinx Spartan™ 6 XC6SLX150-3FGG484I
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 512MB
  • Connector Type: B2B
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
Xilinx Spartan™ 6 XC6SLX150-3FGG484I
-
125MHz
16MB
512MB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
IW-G47M-K19P-4E008G-Q128M-LIB
iWave Systems

Kintex UltraScale+FPGA KU19P SOM

  • Module/Board Type: FPGA
  • Core Processor: ARM® Cortex®-A7
  • Co-Processor: -
  • Speed: 1.2GHz
  • Flash Size: -
  • RAM Size: 2GB
  • Connector Type: -
  • Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM® Cortex®-A7
-
1.2GHz
-
2GB
-
4.330" L x 2.950" W (110.00mm x 75.00mm)
-40°C ~ 85°C
TE0745-02-91C11-A
Trenz Electronic GmbH

SOM 1GB DDR3 XC7Z045-1FBG676C

  • Module/Board Type: MPU Core
  • Core Processor: Xilinx Zynq XC7Z045-1FBG676C
  • Co-Processor: -
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Samtec ST5
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Request a Quote
Xilinx Zynq XC7Z045-1FBG676C
-
-
64MB
1GB
Samtec ST5
2.050" L x 2.990" W (52.00mm x 76.00mm)
0°C ~ 70°C
SM-K26-XCL2GC
AMD

IC MOD SOM K26C ZYNQ MPSOC

  • Module/Board Type: FPGA Core
  • Core Processor: ARM® Cortex®-A53
  • Co-Processor: Arm® Cortex®-R5F
  • Speed: 533MHz, 1.333GHz
  • Flash Size: 16GB eMMC, 64MB QSPI
  • RAM Size: 4GB
  • Connector Type: 2 x 240 Pin
  • Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
  • Operating Temperature: 0°C ~ 85°C (TJ)
paquet: -
Stock405
ARM® Cortex®-A53
Arm® Cortex®-R5F
533MHz, 1.333GHz
16GB eMMC, 64MB QSPI
4GB
2 x 240 Pin
3.030" L x 2.360" W (77.00mm x 60.00mm)
0°C ~ 85°C (TJ)
DC-ME-Y402-S-UPW
Digi

IC CONNECT ME 9210 4/8-S 8MB

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9210
  • Co-Processor: -
  • Speed: 75MHz
  • Flash Size: 4MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.450" L x 0.750" W (36.70mm x 19.10mm)
  • Operating Temperature: -40°C ~ 80°C
paquet: -
Stock210
ARM926EJ-S, NS9210
-
75MHz
4MB
8MB
RJ45
1.450" L x 0.750" W (36.70mm x 19.10mm)
-40°C ~ 80°C
TE0600-03-72C21-A
Trenz Electronic GmbH

IC MODULE GIGABEE

  • Module/Board Type: FPGA Core
  • Core Processor: Spartan-6 LX-100
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 256MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Request a Quote
Spartan-6 LX-100
-
125MHz
16MB
256MB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 70°C
FORLINX-FETT507-C-152GSE8GIA10
Forlinx Embedded

Allwinner T507SOM, 2GB DDR3L, 8G

  • Module/Board Type: MPU
  • Core Processor: ARM® Cortex®-A53
  • Co-Processor: -
  • Speed: 1.5GHz
  • Flash Size: 8GB eMMC
  • RAM Size: 2GB
  • Connector Type: Board-to-Board (BTB) Socket - 240
  • Size / Dimension: 2.760" L x 1.570" W (70.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM® Cortex®-A53
-
1.5GHz
8GB eMMC
2GB
Board-to-Board (BTB) Socket - 240
2.760" L x 1.570" W (70.00mm x 40.00mm)
-40°C ~ 85°C
TE0808-05-9GI21-AK
Trenz Electronic GmbH

ULTRASOM+ MPSOC-MODULE WITH ZYNQ

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: 4 x 160 Pin
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
Zynq UltraScale+ XCZU9EG-2FFVC900I
-
-
128MB
4GB
4 x 160 Pin
2.990" L x 2.050" W (76.00mm x 52.00mm)
-40°C ~ 85°C
MYC-JX8MMA7-8E2D-32Q256D-180-C
MYIR Tech Limited

ARM i.MX 8M Mini + Artix-7 FPGA

  • Module/Board Type: MPU, FPGA
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
  • Co-Processor: Xilinx Artix-7 XC7A25T
  • Speed: 1.8GHz
  • Flash Size: 8GB eMMC, 32MB QSPI
  • RAM Size: 2GB
  • Connector Type: Pin(s)
  • Size / Dimension: 3.228" L x 1.772" W (82.00mm x 45.00mm)
  • Operating Temperature: -40°C ~ 105°C
paquet: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-M4
Xilinx Artix-7 XC7A25T
1.8GHz
8GB eMMC, 32MB QSPI
2GB
Pin(s)
3.228" L x 1.772" W (82.00mm x 45.00mm)
-40°C ~ 105°C