Page 6 - Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs | Circuits intégrés (CI)

Référence	Fabricant	Description	paquet	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-MX-LC47-ZM-B	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock2 448	-	-	-	-	-	-	-	-
DC-ME-01T-NC	Digi International	MOD ME 8MB SDRAM 2MB FLASH 50PAK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock2 784	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
CENGPXA270-312-10-440ECR	Logic	CARD ENGING 32MB SDRAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 312MHz Flash Size: 64MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock3 664	PXA270	-	312MHz	64MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
20-101-1055	Digi International	MODULE RABBITCORE RCM3375 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 32MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock2 896	Rabbit 3000	-	44.2MHz	512KB (Internal), 32MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card	1.85" x 2.73" (47mm x 69mm)	0°C ~ 70°C
CENGSH7727-20-403HC	Logic	CARD ENGINE 16MB FLASH 32MB RAM Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock5 536	-	-	-	-	-	-	-	-
CENGSH7760-10-504HC	Logic	CARD ENGINE 32MB FLASH 64MB RAM Module/Board Type: MPU Core Core Processor: SH7760 Co-Processor: - Speed: 198MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock2 192	SH7760	-	198MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
101-0488	Digi International	MODULE RABBITCORE RCM2210 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x13 Size / Dimension: 1.6" x 2.3" (41mm x 58mm) Operating Temperature: -40°C ~ 70°C	paquet: -	Stock7 152	Rabbit 2000	-	22.1MHz	512KB	512KB	2 IDC Headers 2x13	1.6" x 2.3" (41mm x 58mm)	-40°C ~ 70°C
CC-MX-MB47-ZM-B	Digi International	MODULE I.MX51 128MB FLASH 25PK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock6 800	-	-	-	-	-	-	-	-
TE0841-01-040-1I	Trenz Electronic GmbH	SOM USCALE XCKU040-1I 1GB DDR4 Module/Board Type: FPGA Core Processor: Kintex UltraScale KU40 Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 4GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6 896	Kintex UltraScale KU40	-	-	32MB	4GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
5CSX-H6-4YA-RI	Critical Link LLC	MITYSOM-5CSX W/ ALTERA CYCLONE V Module/Board Type: MPU, FPGA Core Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Edge Connector Size / Dimension: 3.2" x 1.5" (82mm x 39mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock2 576	ARM? Cortex?-A9, Cyclone V SX/SE	NEON SIMD	800MHz	32MB	1GB	Edge Connector	3.2" x 1.5" (82mm x 39mm)	-40°C ~ 85°C
CC-9M-NA26-Z1	Digi International	MOD 9M 32MB SDRAM 64MB FLASH Module/Board Type: MPU Core Core Processor: ARM920T, SC2443 Co-Processor: - Speed: 533MHz Flash Size: 64MB RAM Size: 32KB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.36" x 1.73" (60mm x 44mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock2 432	ARM920T, SC2443	-	533MHz	64MB	32KB	Board-to-Board (BTB) Socket - 240	2.36" x 1.73" (60mm x 44mm)	-40°C ~ 85°C
EZ80F920120MOD	Zilog	MODULE EZ80F92 512K 20MHZ Module/Board Type: MCU Core Core Processor: eZ80F92 Co-Processor: - Speed: 20MHz Flash Size: 128KB (Internal), 1MB (External) RAM Size: 8KB (Internal), 512KB (External) Connector Type: Header 2x25 Size / Dimension: 2.5" x 2.5" (64mm x 64mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock7 824	eZ80F92	-	20MHz	128KB (Internal), 1MB (External)	8KB (Internal), 512KB (External)	Header 2x25	2.5" x 2.5" (64mm x 64mm)	0°C ~ 70°C
20-101-1105	Digi International	MODULE RCM4100 RABBITCORE Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 58.98MHz Flash Size: 512KB RAM Size: 1MB Connector Type: IDC Header 2x25, 2x5 Size / Dimension: 1.41" x 1.88" (36mm x 48mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6 528	Rabbit 4000	-	58.98MHz	512KB	1MB	IDC Header 2x25, 2x5	1.41" x 1.88" (36mm x 48mm)	-40°C ~ 85°C
DC-ME-01T-C-10	Digi International	ME 8MB SDRAM 2MB FLASH 10 PAK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock4 800	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
SOMAM3517-10-1780FJIR	Logic	SYSTEM ON MODULE AM3517 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3517 Co-Processor: - Speed: 600MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 300 Size / Dimension: 1.61" x 2.02" (40.9mm x 51.2mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock4 304	ARM? Cortex?-A8, AM3517	-	600MHz	512MB	256MB	Board-to-Board (BTB) Socket - 300	1.61" x 2.02" (40.9mm x 51.2mm)	-40°C ~ 85°C
20-101-0436	Digi International	MODULE RABBITCORE RCM2120 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x20 Size / Dimension: 2" x 3.5" (51mm x 89mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6 372	Rabbit 2000	-	22.1MHz	512KB	512KB	2 IDC Headers 2x20	2" x 3.5" (51mm x 89mm)	-40°C ~ 85°C
TE0820-03-02EG-1ED	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Stock5 616	Zynq UltraScale+ XCZU2EG-1SFVC784E	-	-	128MB	2GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 85°C
TE0712-02-81I36-X	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	Artix-7 A200T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0830-01-ABI26FAP	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ ZU11EG-1I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 16GB Connector Type: 2 x 400 Pin Size / Dimension: 4.724" L x 4.724" W (120.00mm x 120.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	Zynq UltraScale+ ZU11EG-1I	-	-	128MB	16GB	2 x 400 Pin	4.724" L x 4.724" W (120.00mm x 120.00mm)	-40°C ~ 85°C
TE0823-01-3PIU1FA	Trenz Electronic GmbH	ICOBOARD Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I Speed: - Flash Size: 128MB RAM Size: 1GB Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM Cortex-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I	-	128MB	1GB	USB	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0715-05-71C33-A	Trenz Electronic GmbH	IC MOD Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock9	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
20-101-0072	Digi	DEV VERSION SMARTBLOCK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
ME-AA1-480-2I3-D12E-NFX3-R2	Enclustra FPGA Solutions	SOM ARRIA 10 10AS048 4GB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
FORLINX-FETMX6ULL-S-08256SN256IA12	Forlinx Embedded	NXP i.MX6ULLSOM, 256MB DDR3,256M Module/Board Type: MPU Core Processor: ARM® Cortex®-A7 Co-Processor: - Speed: 80MHz Flash Size: 256MB (NAND) RAM Size: 256MB Connector Type: Edge Connector Size / Dimension: 1.380" L x 1.732" W (35.00mm x 44.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM® Cortex®-A7	-	80MHz	256MB (NAND)	256MB	Edge Connector	1.380" L x 1.732" W (35.00mm x 44.00mm)	-40°C ~ 85°C
TE0745-02-93E31-A	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
ME-XU9-5EV-1I-D12E-L11-R3-0	Enclustra FPGA Solutions	SOM XU9 ZYNQ 5EV REV2.1 Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU5EV-1FBVB900I Speed: - Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU5EV-1FBVB900I	-	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
CC-WMX-ZC6D-L1	Digi	CC 93 SOM SINGLE-CORE WIRELESS Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Co-Processor: - Speed: 250MHz, 1.7GHz Flash Size: 8GB RAM Size: 512MB Connector Type: - Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM® Cortex®-A55, ARM® Cortex®-M33	-	250MHz, 1.7GHz	8GB	512MB	-	1.770" L x 1.570" W (45.00mm x 40.00mm)	-40°C ~ 85°C
TE0745-02-92I31-A	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C

CC-MX-LC47-ZM-B

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock2 448

-

DC-ME-01T-NC

Digi International

MOD ME 8MB SDRAM 2MB FLASH 50PAK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock2 784

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

CENGPXA270-312-10-440ECR

Logic

CARD ENGING 32MB SDRAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 312MHz
Flash Size: 64MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock3 664

PXA270

-

312MHz

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

20-101-1055

Digi International

MODULE RABBITCORE RCM3375

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 32MB (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock2 896

Rabbit 3000

-

44.2MHz

512KB (Internal), 32MB (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card

1.85" x 2.73" (47mm x 69mm)

0°C ~ 70°C

CENGSH7727-20-403HC

Logic

CARD ENGINE 16MB FLASH 32MB RAM

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock5 536

-

CENGSH7760-10-504HC

Logic

CARD ENGINE 32MB FLASH 64MB RAM

Module/Board Type: MPU Core
Core Processor: SH7760
Co-Processor: -
Speed: 198MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock2 192

SH7760

-

198MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

101-0488

Digi International

MODULE RABBITCORE RCM2210

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x13
Size / Dimension: 1.6" x 2.3" (41mm x 58mm)
Operating Temperature: -40°C ~ 70°C

paquet: -

Stock7 152

Rabbit 2000

-

22.1MHz

512KB

2 IDC Headers 2x13

1.6" x 2.3" (41mm x 58mm)

-40°C ~ 70°C

CC-MX-MB47-ZM-B

Digi International

MODULE I.MX51 128MB FLASH 25PK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock6 800

-

TE0841-01-040-1I

Trenz Electronic GmbH

SOM USCALE XCKU040-1I 1GB DDR4

Module/Board Type: FPGA
Core Processor: Kintex UltraScale KU40
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 4GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6 896

Kintex UltraScale KU40

-

32MB

4GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

5CSX-H6-4YA-RI

Critical Link LLC

MITYSOM-5CSX W/ ALTERA CYCLONE V

Module/Board Type: MPU, FPGA Core
Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Edge Connector
Size / Dimension: 3.2" x 1.5" (82mm x 39mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock2 576

ARM? Cortex?-A9, Cyclone V SX/SE

NEON SIMD

800MHz

32MB

1GB

Edge Connector

3.2" x 1.5" (82mm x 39mm)

-40°C ~ 85°C

CC-9M-NA26-Z1

Digi International

MOD 9M 32MB SDRAM 64MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM920T, SC2443
Co-Processor: -
Speed: 533MHz
Flash Size: 64MB
RAM Size: 32KB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.36" x 1.73" (60mm x 44mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock2 432

ARM920T, SC2443

-

533MHz

64MB

32KB

Board-to-Board (BTB) Socket - 240

2.36" x 1.73" (60mm x 44mm)

-40°C ~ 85°C

EZ80F920120MOD

Zilog

MODULE EZ80F92 512K 20MHZ

Module/Board Type: MCU Core
Core Processor: eZ80F92
Co-Processor: -
Speed: 20MHz
Flash Size: 128KB (Internal), 1MB (External)
RAM Size: 8KB (Internal), 512KB (External)
Connector Type: Header 2x25
Size / Dimension: 2.5" x 2.5" (64mm x 64mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock7 824

eZ80F92

-

20MHz

128KB (Internal), 1MB (External)

8KB (Internal), 512KB (External)

Header 2x25

2.5" x 2.5" (64mm x 64mm)

0°C ~ 70°C

20-101-1105

Digi International

MODULE RCM4100 RABBITCORE

Module/Board Type: MPU Core
Core Processor: Rabbit 4000
Co-Processor: -
Speed: 58.98MHz
Flash Size: 512KB
RAM Size: 1MB
Connector Type: IDC Header 2x25, 2x5
Size / Dimension: 1.41" x 1.88" (36mm x 48mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6 528

Rabbit 4000

-

58.98MHz

512KB

1MB

IDC Header 2x25, 2x5

1.41" x 1.88" (36mm x 48mm)

-40°C ~ 85°C

DC-ME-01T-C-10

Digi International

ME 8MB SDRAM 2MB FLASH 10 PAK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock4 800

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

SOMAM3517-10-1780FJIR

Logic

SYSTEM ON MODULE AM3517

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3517
Co-Processor: -
Speed: 600MHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 300
Size / Dimension: 1.61" x 2.02" (40.9mm x 51.2mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock4 304

ARM? Cortex?-A8, AM3517

-

600MHz

512MB

256MB

Board-to-Board (BTB) Socket - 300

1.61" x 2.02" (40.9mm x 51.2mm)

-40°C ~ 85°C

20-101-0436

Digi International

MODULE RABBITCORE RCM2120

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x20
Size / Dimension: 2" x 3.5" (51mm x 89mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6 372

Rabbit 2000

-

22.1MHz

512KB

2 IDC Headers 2x20

2" x 3.5" (51mm x 89mm)

-40°C ~ 85°C

TE0820-03-02EG-1ED

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

Stock5 616

Zynq UltraScale+ XCZU2EG-1SFVC784E

-

128MB

2GB

B2B

1.57" x 1.97" (40mm x 50mm)

0°C ~ 85°C

TE0712-02-81I36-X

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

Artix-7 A200T

-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0830-01-ABI26FAP

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ ZU11EG-1I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 16GB
Connector Type: 2 x 400 Pin
Size / Dimension: 4.724" L x 4.724" W (120.00mm x 120.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

Zynq UltraScale+ ZU11EG-1I

-

128MB

16GB

2 x 400 Pin

4.724" L x 4.724" W (120.00mm x 120.00mm)

-40°C ~ 85°C

TE0823-01-3PIU1FA

Trenz Electronic GmbH

ICOBOARD

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Speed: -
Flash Size: 128MB
RAM Size: 1GB
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

ARM Cortex-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I

-

128MB

1GB

USB

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0715-05-71C33-A

Trenz Electronic GmbH

IC MOD

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock9

ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

20-101-0072

Digi

DEV VERSION SMARTBLOCK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Request a Quote

-

ME-AA1-480-2I3-D12E-NFX3-R2

Enclustra FPGA Solutions

SOM ARRIA 10 10AS048 4GB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Request a Quote

-

FORLINX-FETMX6ULL-S-08256SN256IA12

Forlinx Embedded

NXP i.MX6ULLSOM, 256MB DDR3,256M

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A7
Co-Processor: -
Speed: 80MHz
Flash Size: 256MB (NAND)
RAM Size: 256MB
Connector Type: Edge Connector
Size / Dimension: 1.380" L x 1.732" W (35.00mm x 44.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

ARM® Cortex®-A7

-

80MHz

256MB (NAND)

256MB

Edge Connector

1.380" L x 1.732" W (35.00mm x 44.00mm)

-40°C ~ 85°C

TE0745-02-93E31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

ARM Cortex-A9

Zynq-7000 (Z-7045)

-

64MB

1GB

Board-to-Board (BTB) Socket - 480

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

ME-XU9-5EV-1I-D12E-L11-R3-0

Enclustra FPGA Solutions

SOM XU9 ZYNQ 5EV REV2.1

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU5EV-1FBVB900I
Speed: -
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU5EV-1FBVB900I

-

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

CC-WMX-ZC6D-L1

Digi

CC 93 SOM SINGLE-CORE WIRELESS

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Co-Processor: -
Speed: 250MHz, 1.7GHz
Flash Size: 8GB
RAM Size: 512MB
Connector Type: -
Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

ARM® Cortex®-A55, ARM® Cortex®-M33

-

250MHz, 1.7GHz

8GB

512MB

-

1.770" L x 1.570" W (45.00mm x 40.00mm)

-40°C ~ 85°C

TE0745-02-92I31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

ARM Cortex-A9

Zynq-7000 (Z-7045)

-

64MB

1GB

Board-to-Board (BTB) Socket - 480

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C